• Journal of the Korean Society for Precision Engineering
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• v.10 no.4
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• pp.206-215
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• 1993

The finite element method is applied to analyze the mechanism of metal cutting, especially micro metal cutting. This paper introduces some effects, such as constitutive deformation laws of workpiece material, friction of tool-chip contact interfaces, tool rake angle and also simulate the cutting process, chip formation and geometry, tool-chip contact, reaction force of tool. Under the usual plane strain assumption, quasi-static analysis were performed with variation of tool-chip interface friction coefficients and tool rake angles. In this analysis, cutting speed, cutting depth set to 8m/sec, 0.02mm, respectively. Some cutting parameters are affected to cutting force, plastic deformation of chip, shear plane angle, chip thickness and tool-chip contact length and reaction forces on tool. Several aspects of the metal cutting process predicted by the finite element analysis provide information about tool shape design and optimal cutting conditions.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.813-816
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• 2002

We investigate the junction between CdZnTe and a variety of metals with the aim of determining whether the choice of metal can improve the performance of X-ray image detectors, in particular minimizing the dark current. The samples consist of $5{\mu}m$ thick CdZnTe with top electrodes formed from In, Al, and Au. For each metal, current transients following application of valtages from -10V to 10V are measured for up to 1 hour. We find that dark currents depending on the metal used. The current is controlled by hole injection at the metal-CdZnTe junction and there is consistent trend with the metal's work function possibly and it seems that metal to CdZnTe layer junction is ohmic contact.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.318.2-318.2
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• 2014

The high contact resistance is still one of the major issues to be resolved in CdS/CdTe thin film solar cells. CdTe/Metal Schottky contact induced a high contact resistance in CdS/CdTe solar cells. It has been reported that the work function of CdTe thin film is more than 5.7 eV. There has not been a suitable back contact metal, because CdTe thin film has a high work function. In a few decades, some buffer layer was reported to improve a back contact problem. Buffer layers which are Te, $Sb_2Te_3$, $Cu_2Te$, ZnTe:Cu and so on was inserted between CdTe and metal electrode. A formed buffer layers made a tunnel junction. Hole carriers which was excited in CdTe film by light absorption was transported from CdTe to back metal electrode. In this report, we reported the variation of solar cell performance with different buffer layer at the back contact of CdTe thin film solar cell.

• Journal of Sensor Science and Technology
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• v.28 no.2
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• pp.117-120
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• 2019

Graphene is recognized as a promising material for silicon photonics, since it has a wide optical-window that entirely covers the optical communication wavelength region ($1.3{\sim}1.6-{\mu}m$) and extremely high-carrier mobility that makes it possible to fabricate the high-speed photodetectors. However, the maximum absorbance of monolayer graphene is only 2.3%, which limits the photoresponse characteristics of graphene photodetectors. As a result, a low photoresponsivity of graphene photodetector is a critical issue limiting the use of graphene photodetectors in the optical communications field. In this paper, we investigated effects of optically-modulated metal-graphene contact on the photoresponsivity of graphene photodetectors. The optical modulation of the contact resistance mainly determined the photoresponse characteristics of graphene photodetectors. The Ni-contact graphene photodetector which has a characteristic of the significant optical modulation of metal-graphene contact showed a higher photoresponsivity than the Pd-contact device. This work will provide a way to improve the photoresponse characteristics of graphene-based photodetector and contribute to the development of high-speed/high-responsivity graphene photodetector.

• Progress in Superconductivity and Cryogenics
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• v.20 no.4
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• pp.26-30
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• 2018

The turn-to-turn contact resistance of 2G high temperature superconducting (HTS) coils with metal insulation (MI) is closely related to the stability of the coils, current charging rate and delay time [1]. MI coils were fabricated using five kinds of metal tapes such as aluminum (Al) tape, brass tape, stainless steel (SS) tape, copper (Cu)-plated tape and one-sided Cu-plated SS tape. The turn-to-turn contact surface resistances of co-winding model coils using Al tape, brass tape, and SS tape were 342.6, 343.6 and $724.8{\mu}{\Omega}{\cdot}cm^2$, respectively. The turn-to-turn contact resistance of the model coil using the one-sided Cu-plated SS tape was $ 248.8{\mu}{\Omega}{\cdot}cm^2$, which was lower than that of Al and brass tape. Al or brass tape can be used to reduce contact resistance and improve the stability of the coil. Considering strength, SS tape is recommended. For strength and low contact resistance, SS tape with copper plating on one side can be used.

• Transactions of Materials Processing
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• v.8 no.3
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• pp.306-312
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• 1999

In the recent sheet metal forming simulations, it increases to adopt the dynamic explicit method for an effective computation and the elastoplastic formulation for stress recovery. It is inevitable in the dynamic explicit method that some noises occur, which sometimes partly spoil results of simulations. This phenomenon becomes severer when complicate contact conditions are included in simulations. In commercial dynamic codes, the concept of contact damping is introduced. However, the formulation process of it is not revealed well. In this paper, a contact damping method is formulated in order for effectively suppressing noises occurring due to complicated contact conditions. This is checked by analyzing a simple sheet metal stamping process (U-draw bending). From the computational results, it is shown that the contact damping can effectively control the noises due to contacts, especially when considering the sheet thickness, and help to develop more reliable internal stress states, which result in more realistic shapes after springbank.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.7
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• pp.571-574
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• 2010

Surface recombination loss should be reduced for high efficiency of solar cells. To reduce this loss, the BSF (back surface field) is used. The BSF on the back of the p-type wafer forms a p+layer, which prevents the activity of electrons of the p-area for the rear recombination. As a result, the leakage current is reduced and the rear-contact has a good Ohmic contact. Therefore, the open-circuit-voltage (Voc) and fill factor (FF) of solar cells are increased. This paper investigates the formation of the rear contact process by comparing aluminum-paste (Al-paste) with pure aluminum-metal(99.9%). Under the vacuum evaporation process, pure aluminum-metal(99.9%) provides high conductivity and low contact resistance of $4.2\;m{\Omega}cm$, but It is difficult to apply the standard industrial process to it because high vacuum is needed, and it's more expensive than the commercial equipment. On the other hand, using the Al-paste process by screen printing is simple for the formation of metal contact, and it is possible to produce the standard industrial process. However, Al-paste used in screen printing is lower than the conductivity of pure aluminum-metal(99.9) because of its mass glass frit. In this study, contact resistances were measured by a 4-point probe. The contact resistance of pure aluminum-metal was $4.2\;m{\Omega}cm$ and that of Al-paste was $35.69\;m{\Omega}cm$. Then the rear contact was analyzed by scanning electron microscope (SEM).

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.91.1-91.1
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• 2010

There are some methods for increasing efficiency of crystalline silicon solar cells. Among them, It is important to reduce the recombination loss of surface for high efficiency. In order to reduce recombination loss is a way to use the BSF(Back Surface Field). The BSF on the back of the p-type wafer forms a p+layer. so, it is prevented to act electrons of the p-area for the rear recombination. As a result, the leakage current is reduced and the rear-contact has a good Ohmic contact. therefore, open-circuit-voltage and Fill factor(FF) of solar cells are increased. This paper investigates the formation of rear contact process comparing Aluminum-paste(Al-paste) with Aluminum-Metal(99.9%). It is shown that the Aluminum-Metal provides high conductivity and low contact resistance of $21.35m{\Omega}cm$ using the Vacuum evaporation process but, it is difficult to apply the standard industrial process because high Vacuum is needed and it costs a tremendous amount more than Al-paste. On the other hand, using the Al-paste process by screen printing is simple for formation of metal contact and it is possible to produce the standard industrial process. however, it is lower than Aluminum-Metal(99.9) of conductivity because of including mass glass frit. In this study, contact resistances were measured by 4-point prove. each of contact resistances is $21.35m{\Omega}cm$ of Aluminum-Metal and $0.69m{\Omega}cm$ of Al-paste. and then rear contact have been analyzed by Scanning Electron Microscopy(SEM).

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.5
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• pp.588-593
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• 2014

Current crowding problem can worsen the internal quantum efficiency and the negative-voltage ESD of InGaN-based LEDs. In this paper, by using photon emission microscope and thermal emission microscope measurement, we confirmed that the electric field and the current of the InGaN-based LED sample are crowded in specific regions where the distance between p-type metal contact and n-type metal contact is shorter than other regions. To improve this crowding problem of electric field and current, modified metal contact geometry having uniform distance between the two contacts is proposed and verified by a numerical simulation. It is confirmed that the proposed structure shows better current spreading, resulting in higher internal quantum efficiency and reduced reverse leakage current.

• Journal of Technologic Dentistry
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• v.29 no.2
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• pp.173-180
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• 2007

There was a great problem about the deposition between materials of a different kind at the beginnings of the introduction of porcelains, however, thereafter the deposition efficiency was settlded to the sufficient level of all user thanks to effort to have studied by many scholars and clinical authorities. But in a clinical process, as the difference of designs has an effect on fractures of porcelains, this researcher divided them into 4 groups of A: 1 mm, B: 2 mm, C: 3 mm, and D: 4 mm, and made 40 pieces to each 10 as the test samples to consider a length axis of tooth for studies in accordance with a position of a finishing line to meet between porcelain and metal at the contact point at the adjacent side to a metal porcelain. The sample materials are those to be use at the open market and the test samples wer completed by the same manufacturing technique to that of existent metal porcelain tube. s a result of the strength test on fractures, the average value is as in the following, A: 1 mm - 8.5bar, B: 2 mm - 10.5bar, C: 3 mm - 14.3bar, and D: 4 mm - 15.0bar. In case of the metal porcelain tube, the more faraway to process parts of metal and porcelain from the contact point of adjacent side has the stronger strength of fractures, Accordingly, the research shows that it had better to keep off more than 3 to consider a ledngth axis of tooth.