• Journal of the Korean Society for Precision Engineering
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• v.17 no.4
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• pp.106-113
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• 2000

One of the recent changes in machining technology is rapid application of micro- and high precision grinding processes. A fine groove generation is necessary for the fabrication of optics, electronics and semiconductor parts. Slot grinding is very efficient for the generation of micro ordered groove with hard and brittle materials. In the process of slot grinding, chipping at the sharp edges and microcracks of the ground grooves are inevitable defects. Chipping should be reduced for the improvement of surface integrity. Mechanical contact with diamond grits causes microcracks at the grooves. This damage resides subsurface, and can be the cause of failure of the punch die. This paper deals with chipping generation at the sharp edges, surface integrity of side groove and fracture strength is related to the microcracks in the slot grinding.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.2 no.4
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• pp.25-32
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• 2003

In this study, the grinding characteristics of CBN wheels, such as grinding force and surface roughness, have been compared and analyzed from various working conditions of spindle speed and depth of cut. To actualize high efficient grinding at ceramic and silicon nitride material, electrolytic in-process dressing (ELID) method has been applied at metal bonded diamond and CBN wheels. Super precision grinding using ductile mode at difficult-ta-cut materials could be performed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1994.10a
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• pp.92-97
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• 1994

The there axis CNC grinding machine tool for ultra-precison mirror surface grinding of advanced materials such as ceramics and other hard and brittle materials was designed and manufactured. The grinding machine is composed of the air spindle, the high damping resin concrete bed, and the three axis CNC controller with the high resolution AC servo motor. To investigate the dynamic properties of the grinding machine, the natural frequencies of the spindle and the headstock were experimentally measured. The truing method using the break truer to revise the shape of the metal bonded diamond wheel was developed. Form the results of the machining using the prototype three axis CNC grinding machine manufactured, the mirror surface were achieved.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.12
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• pp.1285-1289
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• 2012

This study has been focused on application of ELID lapping process for mirror-surface machining of sapphire wafer. Sapphire wafer is a superior material with optic properties of high performance as light transmission, thermal conductivity, hardness and so on. High effective surface machining technology is necessary to use sapphire as various usages. The interval ELID lapping process has been set up for lapping of the sapphire material. According to the ELID lapping experimental results, it shows that 12.5 kg of load for lapping is most pertinent to ELID lapping. the surface of sapphire can be eliminated by metal bonded wheel with micron abrasives and the surface roughness of 60 nmRa can be gotten using grinding wheel of 2,000 mesh in 4.5 um, depth of cut. In this study, the chemical experiments after ELID grinding also has been conducted to check chemical reaction between workpiece and grinding wheel on ELID grinding process. It shows that the chemical reaction has not happened as the results of the chemical experiments.