• Korean Journal of Metals and Materials
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• v.48 no.1
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• pp.90-100
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• 2010

Micro-conductive patterns were microfabricated on an insulating substrate ($SiO_2$) surface by a selective electroless nickel plating process in order to investigate the formation of seed layers. To fabricate micro-conductive patterns, a thin layer of metal (Cu.Cr) was deposited in the desired micropattern using laser-induced forward transfer (LIFT). and above this layer, a second layer was plated by selective electroless plating. The LIFT process. which was carried out in multi-scan mode, was used to fabricate micro-conductive patterns via electroless nickel plating. This method helps to improve the deposition process for forming seed patterns on the insulating substrate surface and the electrical conductivity of the resulting patterns. This study analyzes the effect of seed pattern formation by LIFT and key parameters in electroless nickel plating during micro-conductive pattern fabrication. The effects of the process variables on the cross-sectional shape and surface quality of the deposited patterns are examined using field emission scanning electron microscopy (FE-SEM) and an optical microscope.

• Journal of the Optical Society of Korea
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• v.19 no.3
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• pp.217-221
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• 2015

Developing a metallization that has low cost and high efficiency is essential in solar-cell industries, to replace expensive silver-based metallization. Ni/Cu two-step metallization is one way to reduce the cost of solar cells, because the price of copper is about 100 times less than that of silver. Alkaline electroless plating was used for depositing nickel seed layers on the front electrode area. Prior to the nickel deposition process, 2% HF solution was used to remove native oxide, which disturbs uniform nickel plating. In the subsequent step, a nickel sintering process was carried out in $N_2$ gas atmosphere; however, copper was plated by light-induced plating (LIP). Plated nickel has different properties under different bath conditions because nickel electroless plating is a completely chemical process. In this paper, plating bath conditions such as pH and temperature were varied, and the metal layer's structure was analyzed to investigate the adhesion of Ni/Cu metallization. Average adhesion values in the range of 0.2-0.49 N/mm were achieved for samples with no nickel sintering process.

• Journal of Ceramic Processing Research
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• v.19 no.6
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• pp.445-449
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• 2018

Chromium plating is a common surface treatment technique extensively applied in industry due its excellent properties which include substantial hardness, abrasion resistance, corrosion resistance, surface color, and luster. In this study, the effect of $MoS_2$ particles of the composite coating was investigated. To improve the lubrication of mold, $Cr-P-C/MoS_2$ composite plating was studied by varying the $MoS_2$ content. The current efficiency of the composite plating incorporated $MoS_2$ particles was increased at $MoS_2$ contents of 0.5 and 1.0 g/l due to the incorporation of fine particles. On the other hand, when the content of $MoS_2$ is 1.0 g/l or more, the current efficiency is lowered due to an increase in impact on the cathode surface. In order to evaluate the mechanical properties of Scratch test were conducted. Scratch test confirmed the lubricity and abrasion resistance characteristics revealed that the composite plating with added $MoS_2$ had relatively low surface roughness and uniform surface modification to improve its properties.

• Clean Technology
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• v.9 no.2
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• pp.63-69
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• 2003

The metal finishing industry generates a variety of pollutants such as acidic or alkaline wastewater, chromic compounds, cyanide, heavy metals, and toxic materials. Especially, zinc plating process is one of the processes which cause serious environmental problems. In this study, we applied the proven optimum technology to important unit processes in terms of implement effects through the process diagnosis and analysis. This study aimed to improve the working environment and the environmental pollutions in zinc plating process.

• Corrosion Science and Technology
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• v.3 no.1
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• pp.26-29
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• 2004

Metal plated plastics are becoming more prevalent in materials of communication parts. A new technique MmSH is a process of injecting plastics to produce innovated physical properties compared to the conventional injection process. This study involves two ways of coating plastics Ni by electroless plating and varying bath and plasma treatment for improved adhesion strength between plating layer and surface. MmSH injection processed ASS with plasma treated after neutralization showed a superior adhesion force and a gloss and rate of deposition when it was in pH 7.5. On the other hand, conventional injection processed ASS was in pH 6.5.

• Journal of the Korean institute of surface engineering
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• v.15 no.2
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• pp.82-97
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• 1982

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1998.05a
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• pp.74-74
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• 1998

• The korean journal of orthodontics
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• v.23 no.4 s.43
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• pp.671-691
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• 1993

To estimate the possibility in the application of TiN ion-plating to the orthodontic appliance, this study investigated frictional force and frictional coefficient between non-ionplated and TiN ion-plated to the orthodontic appliance. The obtained results were as follows : 1. For each group, the frictional force between metal bracket and arch wire in the wet condition was exhibited lower than that in the dry condition. 2. In the dry condition, the frictional force was lowest with fourth group, and it increased in the order of the 3rd, 1st, and 2nd group. Same situation happened in the wet condition. 3. Experimental results using ceramic & plastic bracket showed that group B was lower than group A, and group D was similar to group C. 4. The surface texture after experiment showed that the scratch due to a friction with bracket was observed in an arch wire of dry contition. Also the surface of bracket was rougher than before. 5. We observed that a specimen surface processed with the TiN ion plating was smoother than that of without the TiN ion plating. 6. The surface texture of a metal bracket and an arch wire in the wet condition was observed smoother than that in the dry condition. 7. In the dry condition, the friction coefficient of each specimen was very similar to each other, but in the wet condition, the friction coefficient of specimen processed with the TiN ion plating showed lower values.

• Journal of the Korean Institute of Gas
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• v.26 no.3
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• pp.21-26
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• 2022

Zinc is emerging as a environment-friendly plating material to replace cadmium, which is harmful to the human body, to prevent hydrogen gas penetration or release from metal materials. Electroplating of Zn and Zn alloys, which is usually performed in an aqueous acidic atmosphere, has disadvantages such as low coulombic efficiency, corrosion, and hydrogen release, resulting in industrial use difficult. In this study, a deep-eutectic solvent was synthesized using choline chloride and ethylene glycol. Using this as a solvent, an electrolyte for Zn plating was prepared, and then zinc was plated on the STS 304 substrate. The surface microstructure and roughness were observed using SEM and AFM. The crystal structure of the electro-plated film was analyzed using XRD. Finally, the preventing effects of hydrogen release through Zn-based deep-eutectic plating on the STS 304 substrate were compared with the uncoated substrate.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.91.2-91.2
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• 2010

The use of plated front contact for metallization of silicon solar cell may alternative technologies as a screen printed and silver paste contact. This technologies should allow the formation of contact with low contact resistivity a high line conductivity and also reduction of shading losses. The better performance of Ni/Cu contacts is attributed to the reduced series resistance due to better contact conductivity of Ni with Si and subsequent electroplating of Cu on Ni. The ability to pattern narrower grid lines for reduced light shading combined with the lower resistance of a metal silicide contact and improved conductivity of plated deposit. This improves the FF as the series resistance is deduced. This is very much required in the case of low concentrator solar cells in which the series resistance is one of the important and dominant parameter that affect the cell performance. A selective emitter structure with highly dopes regions underneath the metal contacts, is widely known to be one of the most promising high-efficiency solution in solar cell processing. This paper using selective emitter structure technique, fabricated Ni/Cu plating metallization cell with a cell efficiency of 17.19%.