• Composites Research
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• 제20권5호
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• pp.43-48
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• 2007

전자기파의 흡수와 간섭 문제는 상업적, 군사적 용도에서 중요한 문제로 다루어져 왔다. 스텔스 기술은 전자기파 흡수 기술의 가장 전형적인 적용 방법 중에 하나이다. 본 연구는 유전성 및 자성 손실을 함유한 복합성의 필러를 개발하고자 시작되었다. 전도성 나노 소재인 탄소나노섬유 (CNFs)에 자성을 부여하기 위해 두 가지의 니켈-인과 니켈-철을 무전해 도금을 적용하여 각각 코팅하는 실험에 성공하였다. 제작된 복합 소재의 미세 구조를 SEM/TEM을 통해 관찰하였고, 이들의 성분 분석(EDS/ELLS)을 수행하였다. 코팅 층의 평균 두께는 약 $50\;{\sim}\;100\;nm$의 결과를 나타내었으며, 코팅 층의 성분은 Ni-6wt%P와 Ni-70wt%Fe의 결과를 각각 나타내었다.

• Journal of Electrochemical Science and Technology
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• 제11권1호
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• pp.92-98
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• 2020

SnO₂-based high-capacity anode materials are attractive candidate for the next-generation high-performance lithium-ion batteries since the theoretical capacity of SnO₂ can be ideally extended from 781 to 1494 mAh g^-1. Here 3D etched Cu foam is applied as a current collector for electron path and simultaneously a substrate for the SnO₂ coating, for developing an integrated electrode structure. We fabricate the 3D etched Cu foam through an auto-catalytic electroless plating method, and then coat the SnO₂ onto the self-supporting substrate through a simple sol-gel method. The catalytic dissolution of Cu metal makes secondary pores of both several micrometers and several tens of micrometers at the surface of Cu foam strut, besides main channel-like interconnected pores. Especially, the additional surface pores on etched Cu foam are intended for penetrating the individual strut of Cu foam, and thereby increasing the surface area for SnO₂ coating by using even the internal of Cu foam. The increased areal capacity with high structural integrity upon cycling is demonstrated in the SnO₂-coated 3D etched Cu foam. This study not only prepares the etched Cu foam using the spontaneous chemical reactions but also demonstrates the potential for electroless plating method about surface modification on various metal substrates.

• 한국표면공학회지
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• 제16권4호
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• pp.199-214
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• 1983

Up to this date, numerous methods of analysis of electroplating solutions are published. Some, however, need lots of works before reaching final results, or require high technique and special instruments, and also some are unaccurate due to unclearnes of end point. Like our undevelope countries, technicians of electoplating shops are most high school gradutes or under, and have not much knowledge on chemistry. Furthermore, those technicians have to control their plating solutions by themselves without having enough analytical laboratory equiIJment. Therefore, in this paper the simplest, besides accurate method is investigated after comparing nu.merous methods published. Among the methods of 'copper determinations from acid and alkaline copper plating baths, EDT A titration method are chosen, due to these methods are the simplest and fastest for the evaluation of metal content, without requiring any special instrument. For acid copper solutions, chelate titrations were accurate enough. Since the end point of titration of chelate method is variable according to the kind of .indicators androther metal's coexsistence as well as solution comIJonent, many difficulties were encountered from cyanide' copper, on the contrary of acid copper bath. PAN, PV, and MX indicators were tried, but it is found that MX is the best. In cyanide solution, due to cyanide is the masking reagent, elimination of this component is essential, and finally found that elimination eN- by precipitation with AgN03 solution was the simplest and the most accurate way among others. This method was very accurate for the new plating solutions even coexistence with organic brightners. However used solutions for long months running have to be predetermined the accurate copper value by thiosulfate method from time to time, before chelate titration by means of AgN03 precipitation. Always some constant deviatioJ;ls will be seen according to the solutions nature. Therefore those deviation values have to be compensated each time.

• 한국환경과학회지
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• 제23권7호
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• pp.1269-1275
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• 2014

Ecotoxicity assessments with the physiochemical water quality items and the bioassay test using Daphnia magna were conducted for 18 selected effluents of 6 industrial types (metal processing, petroleum refining, synthetic textile manufacturing, plating, alcohol beverage manufacturing, inorganic compound manufacturing) being detected toxicity from industrial effluent in Ulsan city, and the interrelationship between total toxic unit (${\Sigma}TU$) and concentrations of Water Quality Conservation Act in Korea were investigated. The average toxic unit(TU) of effluents for 6 industrial types displayed the following ascending order: petroleum refining (0.2) < synthetic textile manufacturing (0.6) < alcohol beverage manufacturing (0.9) < metal processing (1.3) ${\leq}$ inorganic compound manufacturing (1.3) < plating (3.0). These values were less than effluent permission standard. Based on the result of substances causing ecotoxicity, the correlation analysis was not easy because most of heavy metals were not detected or were less than effluent permission standard. Toxicological assessment of industrial effluent was suitable for the evaluation of the mixture toxicity for pollutant. The whole effluent toxicity test using a variety of species was needed for the evaluation of industrial wastewater.

• 센서학회지
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• 제24권1호
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• pp.29-34
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• 2015

This study aimed to evaluate the characterization of a metal oxide semiconductor and electrochemical gas sensor array for measuring wastewater odor. The sensitivity of all gas sensors observed in sampling method by stripping was 6.7 to 20.6 times higher than that by no stripping, except sensor D (electrochemical gas sensor). The average reduction ratio of sensor signal as a function of initial dilution rate of wastewater was in the order of food plant > food waste reutilization facility > plating plant. The sensitivity of gas sensors was dependent on both the type of wastewater and the dilution rate. The sensor signals observed by the gas sensor array were correlated with the dilution factor (OU) calculated by the air dilution sensory test with several wastewater ($r^2=0.920{\sim}0.997$), except the sensor signals of sensor D measured in the plating plant wastewater. It seems likely that the gas sensor array plays a role in the evaluation of odor in wastewater and is useful tool for on-site odor monitoring in the wastewater facilities.

• 멤브레인
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• 제4권2호
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• pp.106-112
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• 1994

$ZnSo_4{\cdot}7H_2O$에 의한 모델폐수에서 Zn 농도 및 pH를 변화하여 역삼투 실험하였고, Zn용액의 pH에 따라 아연의 제거율은 상당히 변화하였고, pH 3.0~11.5 범위에서 실험한 바 pH 8.3일 때가 아연제거율은 99.9% 이상, 투과 속도는 $1.49 {\times} 10^{-3}cm/sec$로 가장 큰 값을 보였다. 아연모델폐수에 Cyanide를 아연농도와 동량으로 첨가하였을 때, 아연은 99%, Cyanide는 93% 정도 제거가 가능하였다. 또한 첨가제로 음이온계면활성제 등을 첨가하여 실험한 결과, Membrane에서의 투과속도가 $0.76 {\times} 10^{-3}cm/sec$로 현저히 감소하였다.

• 구강회복응용과학지
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• 제22권2호
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• pp.125-136
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• 2006

Statement of problem. The success of the bonding between electroforming gold and resin is dependent on the surface-conditioning technique but its effective technique has net been studied widely. Purpose. The purpose of the study was to evaluate the bond strength between the electroforming gold and resin with varying the surface-conditioning technique. Materials and methods. Sixty rectangular shaped metal specimens were made and one side of each specimen were gold hard plated. The sand-blasted specimens were divided into four experimental groups with fifteen specimens in each group and were treated as follows. Group 1: Silicoating (Rocatec, 3M ESPE)+ Sinfony (3M ESPE), Group 2: SR Link+ SR Adoro (Ivoclar Vivadent), Group 3: Tin plating (Microtin, Danville Engineering)+ SR Link+ SR Adoro, Group 4: Tin plating (Micro tin, Danville Engineering)+ Silicoating (Rocatec)+ Sinfony. Shear bond strength at metal-resin interface were measured using universal testing machine. Energy Dispersive x-ray analysis was done and scanning electron microscope images were taken and observed. Results and Conclusion. The following conclusions were drawn. 1. The mean shear bond strength values in order were 11.69MPa (Group 2), 22.35MPa (Group 3), 22.40MPa (Group 1) and 27.71MPa (Group 4). There was no significant difference in Group 1, Group 3 and Group 4(P>0.05). 2. In the EDX line analysis, the Au was detected on the surface of all specimen. $SnO_2$ showed on the surface of Group 2 and $SiO_2$ was detected on the surface of Group 1. 3. Increasing of roughness by sandblasting(Group 2), formation of micro-irregularities and tin crystals by electrolytic tin plating(Group 3) and formation of surface irregularities and $SiO_2$ layer(Group 1,4) were observed in SEM photo. 4. Tin plating(Group 3) and Rocatec treatment(Group 1) showed clinically effective shear bond strength(>20MPa), but when the two surface conditioning method were used together higher bond strength were achieved.

• 한국자기학회지
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• 제15권2호
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• pp.67-75
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• 2005

경량 전파흡수체 구현 방안의 하나로 저밀도(약 0.2g/cc) 중공미세구 표면에 수 ${\cal}um$ 두께의 Co 피막을 무전해 도금에 의해 코팅하고, 고주파 전자기 특성 및 전파흡수특성을 조사하였다. Co 도금은 활성화 처리와 도금공정 2단계 과정을 거쳐 시행되었다. 도금공정의 반복에 의해 두께 $2{\~}3\mu$m의 균일한 Co 피막을 얻을 수 있었다. 이 분말을 실리콘 고무와 혼합하여 복합체를 제조하고, 고주파 전자기 물성 및 전파흡수특성을 회로망 분석기로 측정하였다. Co 피막의 강자성 특성 및 전도 특성에 의해 높은 자기손실 및 유전상수를 얻을 수 있었다. 이와 같은 전자기적 특성에 의해 GHz 대역에서 우수한 전파흡수특성(두께 2.0$\~$2.5mm, 전파흡수능 20dB 이상)이 확인되었다. 특히 Co 도금 중공미세구의 밀도(0.84 g/cc)는 페라이트(5.0 g/cc)에 비해 약 1/6에 불과하기 때문에 경량 전파흡수체로서 응용가치가 매우 높음을 제시할 수 있었다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2006년도 춘계학술대회 논문집
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• pp.314-317
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• 2006

Electroformed part is widely used in modem manufacturing industries, especially semi-conductor division. It is basically a specialized form of electroplating. So, it has very similar parameters with electroplating. The object of this study is development of the fine metal mask by electroforming process. In this paper considered two parameters. The first is relationship of UV exposure and soft baking time. The other one is thickness uniformity of electroformed parts by distance of between electrodes. This paper presents the fabrication method of fine metal mask by electroforming process.

• 한국표면공학회지
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• 제26권6호
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• pp.327-333
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• 1993

The effect of heat treatment on the adhesion between Cu-18wt% Cr film and polyimide has been studied by using T-peel test, AES, and XRD. Cu-18wt% Cr alloy and pure Cu films were sputter deposited onto pol-yimide. Cu was electroplated before and after heat treatment at $400^{\circ}C$ for 0.5 hr and 2 hrs respectively. The adhesion of metal film onto polyimide was considerably good before heat treatment, but heat treatment re-duced the peel adhesion strength in all specimens. The reduction in adhesion in adhesion strength values in the specimens which were plated after heat treatment was mainly due to Cr-O rich pahse formed in the metal/polyimide in-terface. In the specimens which were heat treated after plating, the enhanced ductility in the metal films con-tributes the peel adhesion strength by increasing the amount of deformation in metal strips.