• New & Renewable Energy
• /
• v.1 no.1 s.1
• /
• pp.37-43
• /
• 2005

High-efficiency silicon solar cells have potential applications on mobile electronics and electrical vehicles. The fabrication processes of the high efficiency cells necessitate com placated fabrication precesses and expensive materials. Ti/Pd/Ag metal contact has been used only for limited area In spite of good stability and low contact resistance because of Its expensive material cost and precesses. Screen printed contact formed by Ag paste causes a low fill factor and a high shading loss of commercial solar cells because of high contact resistance and a low aspect ratio. Low cost Ni/Cu metal contact has been formed by using a low cost electroless and electroplating. Nickel silicide formation at the interface enhances stability and reduces the contact resistance resulting In an energy conversion efficiency of $20.2\%\;on\;0.50{\Omega}cm$ FZ wafer. Tapered contact structure has been applied to large area solar cells with $6.7\times6.7cm^2$ in order to reduce power losses by the front contact The tapered front metal contact Is easily formed by the electroplating technique producing $45cm^2$ solar cells with an efficiency of $21.4\%$ on $21.4\%\;on\;2{\Omega}cm$ FZ wafer.

• Carbon letters
• /
• v.2 no.1
• /
• pp.15-21
• /
• 2001

In this work, activated carbon fibers (ACFs) were plated with copper metal using electroless plating method and the effects of surface properties and pore structures on chromium adsorption properties were investigated. Surface properties of ACFs have been characterized using pH and acid/base values. BET data with $N_2$ adsorption were used to obtain the structural parameters of ACFs. The electroless copper plating did significantly lead to a decrease in the surface acidity or to an increase in the surface basicity of ACFs. However, all of the samples possessed a well-developed micropore. The adsorption capacity of Cr(III) for the electroless Cu-plated ACFs was higher than that of the as-received, whereas the adsorption capacity of Cr(VI) for the former was lower than that of the latter. The adsorption rate constants ($K_1$, $K_2$, and $K_3$) were also evaluated from chromium adsorption isotherms. It was found that $K_1$ constant for Cr(III) adsorption depended largely on surface basicity. The increase of Cr(III) adsorption and the decrease of Cr(VI) adsorption were attributed to the formation of metal oxides on ACFs, resulting in increasing the surface basicity.

• Transactions on Electrical and Electronic Materials
• /
• v.12 no.3
• /
• pp.110-114
• /
• 2011

Polymeric films of high chemical stability and mechanical strength covered with a thin metallic film have been extensively used in various fields as electric and electronic materials. In this study, we have chosen polypropylene (PP) as the polymer due to its outstanding chemical resistance and good creep resistance. We coated thin nickel film on PP films by the electroless plating process. The surfaces of PP films were pre-treated and modified to increase the adhesion strength of metal layer on PP films, prior to the plating process, by an environment-friendly process with atmospheric plasma generated using dielectric barrier discharges in air. The surface morphologies of the PP films were observed before and after the surface modification process using a scanning electron microscope (SEM). The static contact angles were measured with deionized water droplets. The cross-sectional images of the PP films coated with thin metal film were taken with SEM to see the combined state between metallic and PP films. The adhesion strength of the metallic thin films on the PP films was confirmed by the thermal shock test and the cross-cutting and peel test. In conclusion, we made a composite material of metallic and polymeric films of high adhesion strength.

• Journal of the Korean institute of surface engineering
• /
• v.52 no.2
• /
• pp.78-83
• /
• 2019

Chloride baths for electrodeposited Ni thin films were fabricated by dissolving metal Ni powders with the mixed solution consisting of HCl and de-ionized water. Current efficiency, residual stress, surface morphology and microstructure of Ni films with the change of metal ion ($Ni^{2+}$) concentrations in the plating solution were studied. Current efficiency was measured to be more than 90% with increasing $Ni^{2+}$ concentrations in the plating solution. Residual stress of Ni thin film was increased from about 400 to 780 MPa with increasing $Ni^{2+}$ concentration from 0.2 to 0.5 M. It is gradually decreased to 650 MPa at 0.9 M $Ni^{2+}$ concentration. Smooth surface morphologies were observed over 0.3 M $Ni^{2+}$ concentration, but nodule surface morphology at 0.2 M. Ni films consist of FCC(111), FCC(200), FCC(220) and FCC(311) peaks in XRD patterns. Preferred orientation of FCC(111) was observed and its intensity was slightly decreased with increasing $Ni^{2+}$ concentration. The average grain size was slightly increased at 0.3 M $Ni^{2+}$ concentration and then slightly decreased with increasing $Ni^{2+}$ concentration.

• Journal of Preventive Medicine and Public Health
• /
• v.27 no.3 s.47
• /
• pp.517-530
• /
• 1994

For the purpose of providing the basic data for health management of workers who are exposed to chromium and for improving the quality of working environment, the authors evaluated blood and urinary level of chromium, the occupational history. AST, ALT, Hb, Hct, nasal specular examinaton on 287 workers who have been dealed chromium compounds in 56 manufacturing Industries of five types, that is, 38 metal plating services(plating),4 manufacture of other fabricated metal products (fabricated metal product), 5 manufacturing of dyestuff(dyestuff), 6 dressing and dyeing of leather(leather), 3 others(manufacture of pottery and ceramic househod wares, motor vehicles, electronic valves and tubes and other electronic components) and also measured the level of chromium in air from February to October 1993. The results were as follows ; 1. The utilized type of chromium compounds was the hexavalent state in plating fabricated metal product dyestuff, leather and the trivalent state in .other, and atmosperic chromium concentration as geometric mean was $0.0138mg/m^3(0.001{\sim}0.068mg/m^3)$ in plating, $0.0115mg/m^3(0.006{\sim}0.015mg/m^3)$ in fabricated matal product, $0.068mg/m^3(0.002{\sim}0.019mg/m^3)$ in dyestuff, $0.0083mg/m^3(0.002{\sim}0.028mg/m^3)$ in leather $0.0039mg/m^3(0.003{\sim}0.005mg/m^3)$ in other by the type of industry and it exceeded TLV-TWA ($0.05mg/m^3$) in five (13.6%) of plating services. 2. The geometric mean of chromium in blood was $1.54{\mu}g/dl(0.10{\sim}3.62{\mu}g/dl)$ in Plantng, $0.94{\mu}g/dl(0.27{\sim}2.82{\mu}g/dl)$ in fabricated metal product, $0.51{\mu}g/dl(0.10{\sim}3.25{\mu}g/dl)$ in dyestuff, $0.87{\mu}g/dl(0.15{\sim}8.00{\mu}g/dl)$ in leather, $0.55{\mu}g/dl(0.20{\sim}2.28{\mu}g/dl)$ in other by the type of industry(p<0.001). 3. The geometric mean of chromium in urine was $14.47{\mu}g/l(6.90{\sim}28.00{\mu}g/l)$ in planting, $4.63{\mu}g/l(0.24{\sim}43.00{\mu}g/l)$ in fabricated metal product, $5.93{\mu}g/l(1.00{\sim}33.00{\mu}g/l)$ in dyestuff, $11.09{\mu}g/l(0.80{\sim}48.00{\mu}g/l)$ in leather, $12.41{\mu}g/l(10.10{\sim}41.00{\mu}g/l)$ in other by the type of industry(p<0.001). 4. As the result of nasal specular examination, twenty four cases (8.4%) of nasal septal perforation among 287 total subjects was observed, and there were 17 (9.7%) cases in plating, 4 csaes (14.3%) in dressing and dyeing of leather. In the comparison of chromium concentration in blood and urine between the perforated group and non-perforated group, the perforated group showed a significantly higher value as $1.883{\pm}3.055{\mu}g/dl\;and\;0.793{\pm}0.815{\mu}g/dl$(P<0.001), $21.31{\pm}34.610{\mu}g/L\;and\;9.304{\pm}11.079{\mu}g/L$ (P<0.001). 5. The mean concentration of chromium in blood, urine and the mean level of AST, ALT, Hb and Hct in exposure group were higher than those of control group(p<0.001).

• Resources Recycling
• /
• v.32 no.2
• /
• pp.12-18
• /
• 2023

In 2018, the demand for silver (referred to as Ag) in the electrical and electronics sector was 249 million tons. The demand stood at 81 million tons in the solar module production sector. Currently, due to the rapid increase in solar module installation, the demand for silver is increasing drastically in Korea. However, Korea's natural metal resources and reserves are insufficient in comparison to their consumption, and the domestic silver ore self-sufficiency rate was as low as 2.2% as of 2021. This implies that a recycling technology is necessary to recover valuable metal resources contained in the waste plating solution generated in the metal industry. Therefore, this study compared and analyzed, the results of the impact evaluation through life cycle assessment according to an improvement in the process of recovery of valuable metals in the waste plating solution. The process improvement resulted in reducing GWP (Global Warming Potential) and ADP(Abiotic Depletion Potential) by 50% and 67%, respectively. The GWP of electricity and industrial water was reduced by 98% and 93%, respectively, which significantly contributed to the minimization of energy and water consumption. Thus, the improvement in recycling technology has a high potential to reduce chemical and energy use and improve resource productivity in the urban mining industry.

• Journal of the Korea Furniture Society
• /
• v.23 no.4
• /
• pp.449-459
• /
• 2012

The article aims to making a comparison between traditional Korean and Western furniture metal handles to give the detail information of the handle terms by analyzing the related literature including internet and interviews. In terms of that, the Korean and Western metal handles are compared in the types, components, materials, methods, and terms affecting the development made by the craftsmen before the Industrial Revolution about the mid or late 18th century. As a result, first, ring and drop pull handles were mostly and wooden knobs were a little used to open the furniture doors and drawers. The Korean drop pulls, Deulswae, came out after the ring pulls, Gori, while the Western drops called loop or bail handles as well, came out before the ring pulls. Second, the components were composed by ring, Gori, loop or bail, Deulswae, Post, Baemok, washer, Baemokbatchim, and backplate, Deulswaebatchim. Most of the Western handles were fastened by the bolt and nut, while the post of two strips, Baemok, fastened the Korean metal handles. Third, the metal handles were created of brass and iron mostly, gilded gold and silver. Forth, the method were largely used by casting, engraving, forging, plating, and hammering in the Korean handles, and by casting, molding, engraving, and stamped in the Western handles. Finally, the terms such as "knobs, pulls, drops, ring and drop pulls, loop or bail handles, posts, washers, backplate, casting, molding, engraving, forging, plating, and stamped" were clarified by the two comparison in Korean and English.

• Korean Journal of Materials Research
• /
• v.19 no.7
• /
• pp.349-355
• /
• 2009

Metal thin film patterns on a LTCC substrate, which was connected through inner via and metal paste for electrical signals, were formed by a screen printing process that used electric paste, such as silver and copper, in a conventional method. This method brought about many problems, such as non uniform thickness in printing, large line spaces, and non-clearance. As a result of these problems, it was very difficult to perform fine and high resolution for high frequency signals. In this study, the electric signal patterns were formed with the sputtered metal thin films (Ti, Cu) on an LTCC substrate that was coated with protective oxide layers, such as $TiO_2$ and $SiO_2$. These electric signal patterns' morphology, surface bonding strength, and effect on electro plating were also investigated. After putting a sold ball on the sputtered metal thin films, their adhesion strength on the LTCC substrate was also evaluated. The protective oxide layers were found to play important roles in creating a strong design for electric components and integrating circuit modules in high frequency ranges.

• Journal of the Microelectronics and Packaging Society
• /
• v.11 no.2 s.31
• /
• pp.11-16
• /
• 2004

Electronic devices are getting smaller due to integration of electronic chip, and heat generated in electronic devices can cause loss of performance and/or reliability of the devices. In this research, metals such as gold, nickel and copper are plated onto a porous membrane by electroless plating method to make an efficient micro-heatsinks. Electroless plating includes sensitization and activation steps in pre-treatment steps. A polycarbonate(PC) membrane was sensitizied, activated and deposited in each metal solution for plating. Among manufactured microfibrils, heat transfer and radiation properties of Ni-microfibril with high surface area were more effective than those of $Au^-$ and Cu-microfibril.

• Journal of the Korean institute of surface engineering
• /
• v.44 no.6
• /
• pp.239-245
• /
• 2011

Magnesium alloys is the lightest by structural metals, but it is not good corrosion resistant because of pit, void. Particularly, AZ31B magnesium alloy sheets that have slag, scratch by rolling process indicate some defects. The objective of this research is to perform uniform plating on AZ31B by studying etching and zincate process. Especially, zincate treatment by zinc salt and pyrophosphate is the most important in the decoration plating. Dissolution of magnesium is reduced by the formation of uniform zinc conversion layer during strick and post process, which decreases defects for plating process.