• Title/Summary/Keyword: Metal industry

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Recycling Technologies for Metal Processing - An Australian Perspective

  • Tran, Tam
    • Proceedings of the IEEK Conference
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    • 2001.10a
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    • pp.34-39
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    • 2001
  • Following the trends around the world in the 1990's, Australia has been promoting recycling as a means to reduce wastes and at the same time improve the economics of metal processing. Of significance to the metal processing industry is the recycling of steel and aluminium, mostly from cans collected from households. The recycling of cyanide during gold processing has also been evaluated extensively, involving many R&D activities currently conducted in several laboratories and commercial plants in Australia. This paper presents an overview of the above issues, evaluating facts and data collected on metal recycling. The technologies currently developed and evaluated for cyanide recycling are also discussed.

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Establishment of Conditions for Ultrasonic Welding of Cu sheet (Cu 박판에 대한 초음파 용착 조건 확립)

  • Seo, Jeong-Seok;Park, Dong-Sam
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.19 no.2
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    • pp.282-287
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    • 2010
  • This paper gives a description of an experimental study of the ultrasonic welding of metals. In ultrasonic metal welding, high frequency vibrations are combined with pressure to join two materials together quickly and securely, without producing significant amount of heat. Ultrasonic metal welder consists of Transducer, Booster, and horn that are designed very accurately to get the natural frequencies and vibration mode. In this study, The horn was designed and analyzed the natural frequency by the modal analysis and harmonic analysis. And using a fiber optic sensor, we measured the amplitude and analyzed the Fast Fourier Transformed result. Using the horn, Ultrasonic metal welding between Cu sheet and Cu sheet of 0.1mm thickness was accomplished under the optimal conditions of static pressure 0.15MPa, vibration amplitude 30% and welding time of 0.28s. This result can be used for ultrasonic metal welding in manufacturing industry.

Optimal Solidification Conditions for Suppression of Heavy Metal Elution from Water Treatment Sludge (정수슬러지로부터 중금속 용출 억제를 위한 최적 고화조건)

  • Lee, Byung-Dae;Kim, Yeoung-Chan;Lee, Jin-Shik
    • Journal of the Korean Applied Science and Technology
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    • v.22 no.4
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    • pp.379-384
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    • 2005
  • In general, water treatment sludge (WTS) had high concentration of heavy metal, thus it made the reuse or recycling of WTS difficult. The optimal solidification conditions for maximum suppression of heavy metal elution from WTS were decided in this study. Under the optimal solidification conditions (i.e., temperature, $320^{\circ}C;$ ratio of WTS and MgO, 9:1; solidification time, 1hr), all of heavy metal including aluminum were not detected. Therefore there are no problems for reuse or recycling of WTS which was solidified under the optimal solidification conditions found in the study.

Catalytic Reactivity of Transition Metal (Pd, Ni) complexes with Aminophosphines; I. Carbon-Carbon coupling reactions (Aminophosphine류가 배위된 전이금속(Pd, Ni) 착물의 촉매반응; I. 탄소-탄소 짝지움 반응)

  • Jung, Maeng-Joon;Lee, Chul-Jae;Kim, Dong-Yeub
    • Journal of the Korean Society of Industry Convergence
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    • v.7 no.1
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    • pp.107-113
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    • 2004
  • Several transition metal complexes, [$M(L)X_2$](M=Pd(II), Ni(II); X=CI, Br) are prepared with aminophosphine ligands such as 1,2-bis{(diphenylphosphino)amino}ethane{$Ph_2PNHCH_2CH_2NHPPh_2$}($L_1$), 1,2-bis{(diphenylphosphino)amino}propane{$Ph_2PNHCH(CH_3)CH_2NHPPh_2$}($L_2$), trans-1,2-bis{(diphenylphosphino)amino}cyclohexane{$Ph_2PNHC_6H_{10}NHPPh_2$}($L_3$) and 1,2-bis{(diphenylphosphino)amino}benzene{$Ph_2PNHC_6H_4NHPPh_2$}($L_4$). The properties of these complexes are characterized by optical spectroscopic methods including UV/vis spectroscopy, CD, IR, $^1H$- and $^{31}P-NMR$ together with conductometer and elemental analysis. All complexes are stable under atmospheric environment. Catalytic reactivity for C-C coupling between [$M(L)X_2$] and Grignard reagents(RMgX; R=phenyl, propyl, buthyl) by thermolysis were investigated utilizing GC/mass, $^1H$- and $^{13}C-NMR$. When mol scale is 1:20 at [$Pd(L)Cl_2$] and Grignard reagents, the high catalytic activity for C-C coupling is apparent. The [$M(L)X_2$](X=Cl, Br) complexes which have strong bond at M-P exhibit high yields for C-C coupling reactions. When the central metal ion is Pd(II), the high catalytic activity for C-C coupling is apparent. The complex coordinated with Br shows higher catalytic activity for C-C coupling reactions compared to Cl.

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An Investigation for the Adsorption of Heavy Metal Ions by Polyamine Organic Adsorbent from the Aqueous Solution - The Influence of Molecular Weight and Degree of Deacetylation of Chitosan - (수용액 중에서 Polyamine계 유기응집제를 이용한 중금속 이온의 흡착 - 키토산의 분자량과 탈아세틸화도 -)

  • Park, Young-Mi;Jeon, Dong-Won
    • Fashion & Textile Research Journal
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    • v.8 no.4
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    • pp.458-464
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    • 2006
  • The adsorption ability of heavy metal ions from the aqueous solution by chitosan, which it is well known natural biopolymer, has been investigated. The fundamental study in this research is focusing on the physicochemical adsorption utilizing the chitosan as a organic chelating adsorbent, adsorb especially heavy metal ions from the waste liquid solution. The adsorption ability of the chitosan between metal ions, having different characteristics with Mw of 188,600, 297,200, and 504,200 g/mol and degree of deacetylation (DD) of 86.92% and 100% were investigated targeting on the $Ni^{2+}$, $Co^{2+}$, $Zn^{2+}$, and $Pb^{2+}$ ions, respectively. The uptake of heavy metal ions with chitosan was performed by atomic absorption flame emission spectrophotometer (AAS) as conducted residual metal ions. It was found that chitosan has an strong adsorption capacity for some metals under certain conditions. Chitosan, which have 100% degree of deacetylation showed high adsorption recovery ratio and have an affinity for all kinds of heavy metals. In contrast, the molecular weight of chitosan was not completely affected on metal ion adsorption.

The Development and Application of Sheet Metal Forming Technology (박판성형기술의 개발과 적용)

  • 박춘달;이장희;양동열;허훈;정동원
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 1994.06a
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    • pp.147-162
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    • 1994
  • Generally, the forming process of sheet metal is very complex and difficult process because of many variables such as tool geometry, material properties and lubrication. In this view point, the numerical analysis of sheet metal forming process is very difficult. High speed computer is used to model complex sheet metal forming process on a reasonable time scale. The design and development of sheet metal parts in the automotive industry and the need for improved sheet forming process and reduced part development cost have led to the use of computer simulation in tool/die design of sheet metal pressing. HMC(Hyundai Mator Company) has invested to develop programs for analysis of sheet metal forming process with connection of Universities. As a result, several programs were developed. Recently, the commercial software, PAM-STAMP of ESI was installed and is being tried to application of it to the real automotive panels. This article reviews the ongoing activities on development and application of analytical modeling of sheet metal forming at HMC.

Wear Characteristics of Particulate Reinforced Metal Matrix Composites Fabricated by Pressureless Metal Infiltration Process (무가압함침법으로 제조된 입자강화 금속복합재료의 마모특성)

  • Kim, Jae-Dong;Jung, Sun-Uk;Kim, Hyung-Jin
    • Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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    • 2002.10a
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    • pp.379-384
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    • 2002
  • The effect of size and volume fraction of ceramic particles with sliding velocity on the wear properties were investigated for the metal matrix composites fabricated by pressureless infiltration process. The particulate metal matrix composites exhibited about 5.5 - 6 times of excellent wear resistance compared with AC8A alloy at high sliding velocity, and as increasing the particle size and decreasing the volume fraction the wear resistance was improved. The wear resistance of metal matrix composites and AC8A alloy exhibited different aspects. Wear loss of AC8A alloy increased with sliding velocity linearly. whereas metal matrix composites indicated more wear loss than AC8A alloy at slow velocity region, however a transition point of wear loss was found at middle velocity region which show the minimum wear loss, and wear loss at high velocity region exhibited nearly same value with slow velocity region. In terms of wear mechanism, the metal matrix composites exhibited the abrasive wear at slow to high sliding velocity generally, however AC8A alloy showed abrasive wear at low sliding velocity and adhesive and melt wear at high sliding velocity.

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Formation of electric circuit for printed circuit board using metal nano particles (금속 나노 입자를 이용한 인쇄 회로 기판의 회로 형성)

  • Joung, Jae-Woo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.545-545
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    • 2007
  • Recently, innovative process has been investigated in order to replace the conventional high-cost micro patterning processes on the electronic products. To produce desirable profit margins from this low cost products, printed circuit board(PCB), will require dramatic changes in the current manufacturing philosophies and processes. Innovative process using metal nano particles replaces the current industry standard of subtractive etched of copper as a highly efficient way to produce robust circuitry on low cost substrates. An advantage of using metal nano particles process in patterned conductive line manufacturing is that the process is additive. Material is only deposited in desired locations, thereby reducing the amount of chemical and material waste. Simply, it just draws on the substrate as glass epoxy or polyimide with metal nano particles. Particles, when their size becomes nano-meter scale, show some specific characteristics such as enhanced reactivity of surface atoms, decrease in melting point, high electric conductivity compared with the bulk. Melting temperature of metal gets low, the metal nano particles could be formated onto polymer substrates and sintered under $300^{\circ}C$, which would be applied in PCB. It can be getting the metal line of excellent electric conductivity.

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