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Establishment of Conditions for Ultrasonic Welding of Cu sheet  

Seo, Jeong-Seok (인천대학교 공학대학원 기계공학)
Park, Dong-Sam (인천대학교 기계공학과)
Publication Information
Journal of the Korean Society of Manufacturing Technology Engineers / v.19, no.2, 2010 , pp. 282-287 More about this Journal
Abstract
This paper gives a description of an experimental study of the ultrasonic welding of metals. In ultrasonic metal welding, high frequency vibrations are combined with pressure to join two materials together quickly and securely, without producing significant amount of heat. Ultrasonic metal welder consists of Transducer, Booster, and horn that are designed very accurately to get the natural frequencies and vibration mode. In this study, The horn was designed and analyzed the natural frequency by the modal analysis and harmonic analysis. And using a fiber optic sensor, we measured the amplitude and analyzed the Fast Fourier Transformed result. Using the horn, Ultrasonic metal welding between Cu sheet and Cu sheet of 0.1mm thickness was accomplished under the optimal conditions of static pressure 0.15MPa, vibration amplitude 30% and welding time of 0.28s. This result can be used for ultrasonic metal welding in manufacturing industry.
Keywords
Ultrasonic metal welding; Horn; modal analysis; Fiber optic sensor; FFT; Test of tensile load;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 Lee, B. G., Kim, K. L., K., and Kim, K. E., 2008, "Design of Ultrasonic Vibration Tool Horn for Micromachining Using FEM," J of KSMTE, Vol. 17, No. 6, pp. 63-70.   과학기술학회마을
2 Seah, K. H. W., Y. S. Wong, and Lee, L. C., 1993, "Design of tool holders for ultrasonic machining using FEM," Journal of Materials Processing Technology, Vol. 37, pp. 810-816.
3 Liu, Z., Kim, H. S., Park, J. R., and Kim, J, T., 2004, "Surface profile measurement with FFT method and stabilized interferometer," Proceedings of the KSMTE Autumn Conference, 2004, pp. 269-273 .
4 Park, H. S., Kim, W. Y., and Kang, C. Y., 1996, "Welding and Bonding of Dissimilar Metal Steel/Nonferros Metal," Journal of the Korean Welding and Joining Society, Vol. 14, No. 6, pp. 1-7.
5 Lee, S. I. and Hong, S. H., 2007, "Nonliner Analysis of ultrasonic horn model for flip-chip bonding," Proceedings of the KMTE Autumn Conference, pp. 523-528.
6 STAPLA Ultrasonic Corp., n.d, viewed 12 October 2009, .
7 Branson Ultrasonic Corp., n.d, viewed 5 September 2009, .