• The Journal of Advanced Prosthodontics
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• v.4 no.3
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• pp.127-133
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• 2012

PURPOSE. Many dentists use desensitizing agents to prevent hypersensitivity. This study compared and evaluated the effect of two desensitizing agents on the retention of cast crowns when cemented with various luting agents. MATERIALS AND METHODS. Ninety freshly extracted human molars were prepared with flat occlusal surface, 6 degree taper and approximately 4 mm axial length. The prepared specimens were divided into 3 groups and each group is further divided into 3 subgroups. Desensitizing agents used were GC Tooth Mousse and $GLUMA^{(R)}$ desensitizer. Cementing agents used were zinc phosphate, glass ionomer and resin modified glass ionomer cement. Individual crowns with loop were made from base metal alloy. Desensitizing agents were applied before cementation of crowns except for control group. Under tensional force the crowns were removed using an automated universal testing machine. Statistical analysis included one-way ANOVA followed by Turkey-Kramer post hoc test at a preset alpha of 0.05. RESULTS. Resin modified glass ionomer cement exhibited the highest retentive strength and all dentin treatments resulted in significantly different retentive values (In Kg.): GLUMA ($49.02{\pm}3.32$) > Control ($48.61{\pm}3.54$) > Tooth mousse ($48.34{\pm}2.94$). Retentive strength for glass ionomer cement were GLUMA ($41.14{\pm}2.42$) > Tooth mousse ($40.32{\pm}3.89$) > Control ($39.09{\pm}2.80$). For zinc phosphate cement the retentive strength were lowest GLUMA ($27.92{\pm}3.20$) > Control ($27.69{\pm}3.39$) > Tooth mousse ($25.27{\pm}4.60$). CONCLUSION. The use of $GLUMA^{(R)}$ desensitizer has no effect on crown retention. GC Tooth Mousse does not affect the retentive ability of glass ionomer and resin modified glass ionomer cement, but it decreases the retentive ability of zinc phosphate cement.

• Corrosion Science and Technology
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• v.17 no.1
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• pp.20-29
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• 2018

Ti and its alloys show the excellent corrosion resistance to chloride environments, but they show less corrosion resistance in HCl, $H_2SO_4$, NaOH, $H_3PO_4$, and especially HF environments at high temperature and concentration. In this study, we used the commercially pure titanium and Ti-6Al-4V alloy, and evaluated the effect of the manufacturing process on the electrochemical properties. We used commercial products of rolled and forged materials, and made additive manufactured materials by DMT (Directed Metal Tooling) method. We annealed each specimen at $760^{\circ}C$ for one hour and then air cooled. We performed anodic polarization test, AC impedance measurement, and Mott-Schottky plot to evaluate the electrochemical properties. Despite of the difference of its microstructure of CP-Ti and Ti-6Al-4V alloys by the manufacturing process, the anodic polarization behavior was similar in 20% sulfuric acid. However, the addition of 0.1% hydrofluoric acid degraded the electrochemical properties. Among three kinds of the manufacturing process, the electrochemical properties of additive manufactured CP-Ti, and Ti-6Al-4V alloys were the lowest. It is noted that the test materials showed a Warburg impedance in HF acid environments.

• Journal of Welding and Joining
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• v.27 no.4
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• pp.73-78
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• 2009

Characterization of the microweld CCFL electrode for the TFT-LCD backlight unit was carried out in terms of the glass beading heat treatment conditions. We evaluate the weld zone and parent metal of the microweld CCFL electrodes that were exposed to simulated glass beading heat treatment. The CCFL electrode was composed of the cup made with pure Ni, the pin made with pure Mo and the lead wire made with Ni-Mn alloy. Each part of the electrode was assembled together by micro spot welding process and then the assembled electrodes were exposed to simulated glass beading temperatures of $700^{\circ}C,\;750^{\circ}C$ and $800^{\circ}C$. The microstructures of the microweld CCFL electrode were observed by using optical microscope, scanning electron microscope and EDS. Micro-tensile and microhardness test were also carried out. The results indicated that the grain coarsening in the HAZs(heat affected zones) for both the cup-pin weld and pin-lead wire were exhibited and the grain coarsening of the HAZ for the cup and the lead wire was more obvious than the HAZ of the pin. The micro-tensile test revealed that the fracture occurred at the cup-pin weld zone for all test conditions. The fracture surface could be classified into two parts such as pin portion and cup portion including weld nugget. The failure was seemed to be initiated from the boundary between nugget and pin through the weld joint. The result of the microhardness measurement exhibited that the relatively low hardness value, about 105HV was recorded at the HAZ of the cup. This value was about 50% less than that of the original value of the cup. The reduction of the microhardness was considered as the cause of the grain coarsening due to welding process. It was also appeared that there was no change in electric resistance for the standard electrodes and heat treated electrodes.

• Journal of Powder Materials
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• v.23 no.6
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• pp.426-431
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• 2016

The Fe-Cr-Al alloy system shows an excellent heat resistance because of the formation of an $Al_2O_3$ film on the metal surface in an oxidizing atmosphere at high temperatures up to $1400^{\circ}C$. The Fecralloy needs an additive that can act as a binder because of its bad compactability. In this study, the green compacts of STS434L and Al powder added to Fecralloy are oxidized at $950^{\circ}C$ for up to 210 h. Fecralloy and Al is mixed by two types of ball milling. One is vented to air and the other was performed in a sealed jar. In the case of Al addition, there are no significant changes in the electrical resistance. Before the oxidation test, Al oxides are present in the Fecralloy surface, as determined from the energy dispersive spectroscopy results. The addition of Al improves the compactability because of an increased density, and the addition of STS434L increases the electrical resistivity by forming a composite oxide.

• Journal of Powder Materials
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• v.13 no.1 s.54
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• pp.62-67
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• 2006

Friction welding of $Al_2O_3$ particulate reinforced aluminum composites was performed and the following conclusions were drawn from the study of interfacial bonding characteristics and the relationship between experimental parameters of friction welding and interfacial bond strength. Highest bonded joint efficiency (HBJE) approaching $100\%$ was obtained from the post-brake timing, indicating that the bonding strength of the joint is close to that of the base material. For the pre-brake timing, HBJE was $65\%$. Most region of the bonded interface obtained from post-brake timing exhibited similar microstructure with the matrix or with very thin, fine-grained $Al_2O_3$ layer. This was attributed to the fact that the fine-grained $Al_2O_3$ layer forming at the bonding interface was drawn out circumferentially in this process. Joint efficiency of post-brake timing was always higher than that of pre-brake timing regardless of rotation speed employed. In order to guarantee the performance of friction welded joint similar to the efficiency of matrix, it is necessary to push out the fine-grained $Al_2O_3$ layer forming at the bonding interface circumferentially. As a result, microstructure of the bonded joint similar to that of the matrix with very thin, fine-grained $Al_2O_3$ layer can be obtained.

• Journal of Korea Foundry Society
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• v.20 no.4
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• pp.254-259
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• 2000

Metal matrix composites(MMCs) reinforced with hard particles have many potential application in aerospace structures, auto parts, semiconductor package, heat resistant panels, wear resistant materials and so on. In this work, the effect of SiC partioel sizes(50 and 100 ${\mu}m$) and additional elements such as Si, Cu and Ti on the microstructure and the wear property of $Al-5Mg-X(Si,Cu,Ti)/SiC_p$ composites produced by pressureless infiltration method have been investigated using optical microscopy, scanning eletron microcopy(SEM) with EDS(energy dispersive spectrometry), hardness test, X-ray diffractometer(XRD) and wear test. In present study, the sound $Al-5Mg-X(Si,Cu,Ti)/SiC_p$(50 and 100 ${\mu}m$) composites were fabricated by pressureless infiltration method. The $Al-5Mg-0.3Si-O.1Cu-O.1Ti/SiC_p$ composite with $50 {\mu}m$ size of SiC particle has higher hardness and better wear property than any other composite with $100{\mu}m$ size of SiC particle produced by pressureless infiltration method. The hardness and wear property of $Al-5Mg/SiC_p$(50 and 100 ${\mu}m$) composites were enhanced by the addition of Si, Cu and Ti in Al-5%Mg matrix alloy.

• Journal of Korea Foundry Society
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• v.31 no.5
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• pp.274-283
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• 2011

The vacuum die casting is a promising candidate of the stamping process for fabrication of fuel cell bipolar plate due to its advantages, such as precision casting, mass production and short production time. This study proposes vacuum die casting process to fabricate bipolar plates in fuel cell. Bipolar plates were fabricated under various injection conditions such as molten metal temperature and injection velocity. Also, according to injection velocity conditions, simulation results of MAGMA soft were compared to the experimental results. In case of melt temperature $650^{\circ}C$, misrun occurred. When the melt temperature was $730^{\circ}C$, mechanical properties were low due to dendrite microstructure. Injection velocity has to set at more than 2.0 m/s to fabricate the sound sample. When melt temperature, injection velocity (Fast shot), and vacuum pressure are $700^{\circ}C$, 2.5 m/s and 30 kPa respectively, sample had good formability and few casting defects. Simulation results are mostly in agreement with experimental results.

• Journal of the Korean Electrochemical Society
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• v.7 no.2
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• pp.108-123
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• 2004

Imaging of surfaces and structures by near-field scanning optical microscopy (NSOM) has matured and is routinely used for studies ranging from biology to materials science. Of interest in this review paper is a versatility of modified or multi-functional NSOM (mf-NSOM) to enable high resolution imaging in several modes: (1) Concurrent fluorescence and Topographical Imaging (gases) (2) Microspectroscopy (gases) (3) Concurrent Scanning Electrochemical and Topographical Imaging (SECM) (liquids) (4) Concurrent Photoelectrochemical and Topographical Imaging (PEM) (liquids) The present study will summarize some of the recent advances in mf-NSOM work confirmed and supported by the results from several other imaging techniques of optical, fluorescence, electron and electrochemical microscopy. The studies are directed at providing local information on pitting precursor sites and vulnerable areas on metal and semiconductor surfaces, and at reactive sites on heterogeneous, catalytic substrates, especially on Al 2024 alloy and polycrystalline Ti. In addition, we will introduce some results related to the laser-induced nanometal (Ag) synthesis using mf-NSOM.

• Korean Chemical Engineering Research
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• v.50 no.2
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• pp.211-216
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• 2012

Wet chemical etching of stainless steel foil by aqueous ferric chloride solution was investigated in this study. Effects of various process parameters (e.g. etchant agitation rate, etchant temperature, $Fe^{3+}$ ion concentration, free HCl concentration, specific gravity, etc.) on the etch rate was first studied, and it was found that the etch rate of AK (aluminum-killed) steel, chromium metal and stainless steel (STS430J1L alloy) follows the pseudo-first order reaction equation. When the fatigue ratio of etchant was kept under 16%, sludge was not formed in the solution, and the etched surface showed smooth roughness. The etch rate decreases as Baume of etchant increases, but the effect of free HCl concentration on the etch rate turned out to be minimal. Experimental data were compared with the calculated results from modeled equation, showing very good agreement.

• Corrosion Science and Technology
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• v.6 no.2
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• pp.50-55
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• 2007

The smaller size and higher integration of advanced electronic package systems result in severe electrochemical reliability issues in microelectronic packaging due to higher electric field under high temperature and humidity conditions. Under these harsh conditions, electronic components respond to applied voltages by electrochemical ionization of metal and the formation of a filament, which leads to short-circuit failure of an electronic component, which is termed electrochemical migration. This work aims to evaluate electrochemical migration susceptibility of the pure Sn, Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder alloys in $Na_{2}SO_{4}$. The water drop test was performed to understand the failure mechanism in a pad patterned solder alloy. The polarization test and anodic dissolution test were performed, and ionic species and concentration were analyzed. Ag and Cu additions increased the time to failure of Pb-free solder in 0.001 wt% $Na_{2}SO_{4}$ solution at room temperature and the dendrite was mainly composed of Sn regardless of the solders. In the case of SnAg solders, when Ag and Cu added to the solders, Ag and Cu improved the passivation behavior and pitting corrosion resistance and formed inert intermetallic compounds and thus the dissolution of Ag and Cu was suppressed; only Sn was dissolved. If ionic species is mainly Sn ion, dissolution content than cathodic deposition efficiency will affect the composition of the dendrite. Therefore, Ag and Cu additions improve the electrochemical migration resistance of SnAg and SnAgCu solders.