• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.5
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• pp.457-463
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• 2005

This paper presents a method for analyzing irregular shaped power distribution networks. The irregular shaped metal-dielectric-metal plane is split into several piece of rectangular segments to calculate the impedance of the irregular shaped plane. Impedance matrix for each rectangular segments is calculated using the Mobius transform method to reduce the calculation time. Then the segmentation and do-segmentation method is applied to the piece of rectangular segments. Applied to the 6 inch by 5 inch size irregular shaped board, the proposed method shows 10 times faster than the electromagnetic or circuit analysis method.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.8 s.111
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• pp.713-718
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• 2006

We designed and fabricated, in this paper, a quintuple band folded monopole antenna for the mobile phone handset that can be provided multiple mobile services. Antenna design was based on the compensation of series antenna capacitance with the expansion of physical antenna length by the proper folding structure. It's shown that this antenna satisfies quintuple service band as CDMA/GSM/DCS/USPCS/WCDMA, and is more cost competitive than conventional metal plate pressing method by applying on flexible PCB technology. Measured maximum gain on quintuple band were $-2.51{\sim}+1.82 dBi$, and radiation patterns were also shown nearly omnidirectional on all bands.

• Proceedings of the KIEE Conference
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• 2002.11c
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• pp.601-604
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• 2002

In this paper, the timing do-skew modeling for a high speed logic tester channels is developed. The time delay of each channel in a logic tester are different from other channels and it can produce timing error in a test. To get the best timing accuracy in the test with a logic tester, the timing skew must be compensated. The timing skew of channels is due to the difference of time delay of pin-electronics devices composing channels and length of metal line placed on PCB. The expected timing difference of channels can be calculated according to the specifications of pin electronics devices and strip line modeling of PCB. With the calculated delay time, the timing skew compensation circuit has been designed. With the timing skew compensation circuit, the timing calibration of a logic tester can be peformed easily and automatically without other time measuring instruments. The calibration method can then be directly applied to logic testers in mass production lines.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.343-343
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• 2006

집적회로기판의 소형화 추세에 따라 커패시터, 인덕터, 저항과 같은 수동소자를 PCB 기판내부에 임베딩하는 연구가 국내외에서 활발하게 진행되고 있다. 본 논문에서는 polymer-metal-ceramic의 3상 복합체 구조를 가지는 임베디드 커패시터에서 Bimodal PZT분말에 따른 유전 특성에 대하여 고찰하였다. 매트릭스를 형성하는 고분자 재료로는 PMMA(polymethyl methacrylate)를 사용하였으며, 충분히 혼합된 분말을 고온에서 프레싱하여 시편을 제조하였다. 유전특성은 임피던스분석기 및 LCZ 미터를 이용하여 측정하였으며, 실험결과는 혼합법칙과 Percolation 이론을 이용하여 해석하였다.

• Proceedings of the KIEE Conference
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• 2006.07d
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• pp.2063-2064
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• 2006

The power source of inverter welder stable power of low voltage and high current. Because if shouldn't be, it is caused to spark between the parent metal and the peak. So that, we designed to be base on high frequency transformer and reactor of DC part. Then, we optimized control of PWM, current rising slant, voltage, current, pulse current and inverter out-put voltage. Also we designed PCB for EMI and noises.

• Proceedings of the Korean Institute of Resources Recycling Conference
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• 2005.05a
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• pp.73-77
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• 2005

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.10a
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• pp.104-104
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• 2009

금값 폭등과 에너지자원 고갈에 따라 폐 인쇄회로기판의 유가금속 및 에너지자원을 효과적으로 회수하고자, 최근 국내외 금 회수 및 폐백보드 활용방안을 제시하였다. 금을 회수하는 방법으로는 침적박리, 농축처리, 중화처리, 수용액환원처리, 이온교환수지, 전해채취 등의 방법이 있다. 금은 상온침적박리 회수하며 폐백보드는 이동식 건축내장재로 활용하고자 한다.

• Journal of Environmental Science International
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• v.24 no.2
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• pp.245-251
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• 2015

The main objective of this study is to recovery valuable metals with metal particle size distributions in waste cell phone PCBs(Printed Circuit Boards) by means of pulverization and nitric acid process. The particle size classifier also was evaluated by specific metal contents. The PCBs were pulverized by a fine pulverizer. The particle sizes were classified by 5 different sizes which were PcS1(0.2 mm below), PcS2(0.20~0.51 mm), PcS3(0.51~1.09 mm), PcS4(1.09~2.00 mm) and PcS5(2.00 mm above). Non-magnetic metals in the grinding particles were separated by a hand magnetic. And then, Cu, Co and Ni were separated by 3M nitric acid. Particle diameter of PCBs were 0.388~0.402 mm after the fine pulverizer. The sorting coefficient were 0.403~0.481. The highest metal content in PcS1. And the bigger particle diameter, the lower the valuable metals exist. The recovery rate of the valuable metals increases in smaller particle diameter with same leaching conditions. For further work, it could improve to recovery of the valuable metals effectively by means of individual treatment, multistage leaching and different leaching solvents.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.149-154
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• 2018

This paper describes the fabrication and heat transfer property of 50 watts rated LED array module where multiple chips are mounted on chip-on-board type ceramic-metal hybrid substrate with high heat dissipation property for high power street and anti-explosive lighting system. The high heat transfer ceramic-metal hybrid substrate was fabricated by conformal coating of thick film glass-ceramic and silver pastes to form insulation and conductor layers, using thick film screen printing method on top of the high thermal conductivity aluminum alloy heat-spreading panel, then co-fired at $515^{\circ}C$. A comparative LED array module with the same configuration using epoxy resin based FR-4 PCB with thermalvia type was also fabricated, then the thermal properties were measured with multichannel temperature sensors and thermal resistance measuring system. As a result, the thermal resistance of the ceramic-metal hybrid substrate in the $4{\times}9$ type LEDs array module exhibited about one third to the value as that of FR-4 substrate, implying that at least triple performance of heat transfer property as that of FR-4 substrate was realized.

• Journal of Institute of Control, Robotics and Systems
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• v.9 no.10
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• pp.774-781
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• 2003

The important factors that cause position error in X-Y robot are inertial force, frictions and spring distortion in screw or coupling. We have to estimate these factors precisely to correct position errors, Which is very difficult. In this paper, we makes systems to inspect metal stencil which is used to print solder paste on pads of SMD of PCB with low precision X-Y robot and vision system. To correct position error that is caused by low precision X-Y robot, we defines position error vector that is formed with position of objects that exist in reference and camera image. We apply MHT(Modified Hough Transformation) for the aim of determining the dominant position error vector. We modify reference image using extracted dominant position error vector and obtain reference image that is the same with camera image. Effectiveness and performance of this method are verified by simulation and experiment.