• Title/Summary/Keyword: Metal Filament

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A Study on the Electrochemical Properties of Water-soluble Waste Cutting Oil using Boron-Doped Diamond Electrodes (붕소도핑 다이아몬드 전극을 이용한 수용성 폐절삭유의 전기화학적 특성연구)

  • J.H., Park;T.G., Kim
    • Journal of the Korean Society for Heat Treatment
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    • v.35 no.6
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    • pp.337-342
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    • 2022
  • In metal cutting, water-soluble cutting oil is used for cooling the surface of the workpiece and improving the surface roughness. However, waste cutting oil contains preservatives and surfactants, and if it is discarded as it is, it has an great influence on environmental pollution. For this reason, regulations on the use of cutting oil are being stricter. Hence, the development of eco-friendly treatment technologies is required. In this study, a diamond electrode doped with boron on a niobium substrate was deposited by thermal filament chemical vapor deposition and waste cutting oil was treated using an electrochemical method. Compared to the total amount of organic carbon contained in the waste cutting oil, it was confirmed that the boron-doped diamonds developed from this study showed much better performance than electrodes that has been widely used before.

Effect of Applied Voltage Bias on Electrochemical Migration in Eutectic SnPb Solder Alloy

  • Lee, Shin-Bok;Jung, Ja-Young;Yoo, Young-Ran;Park, Young-Bae;Kim, Young-Sik;Joo, Young-Chang
    • Corrosion Science and Technology
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    • v.6 no.6
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    • pp.282-285
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    • 2007
  • Smaller size and higher integration of electronic systems make narrower interconnect pitch not only in chip-level but also in package-level. Moreover electronic systems are required to operate in harsher conditions, that is, higher current / voltage, elevated temperature / humidity, and complex chemical contaminants. Under these severe circumstances, electronic components respond to applied voltages by electrochemically ionization of metals and conducting filament forms between anode and cathode across a nonmetallic medium. This phenomenon is called as the electrochemical migration. Many kinds of metal (Cu, Ag, SnPb, Sn etc) using in electronic packages are failed by ECM. Eutectic SnPb which is used in various electronic packaging structures, that is, printed circuit boards, plastic-encapsulated packages, organic display panels, and tape chip carriers, chip-on-films etc. And the material for soldering (eutectic SnPb) using in electronic package easily makes insulation failure by ECM. In real PCB system, not only metals but also many chemical species are included. And these chemical species act as resources of contamination. Model test systems were developed to characterize the migration phenomena without contamination effect. The serpentine-shape pattern was developed for analyzing relationship of applied voltage bias and failure lifetime by the temperature / humidity biased(THB) test.

Structural Design of 3D Printer Nozzle with Superior Heat Dissipation Characteristics for Deposition of Materials with High Melting Point (고 용융점 소재의 압출적층성형을 위한 우수한 방열특성을 갖는 3차원 프린터 nozzle부 기구설계)

  • Kim, Wan-Chin;Lee, Sang-Wook
    • The Journal of the Korea institute of electronic communication sciences
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    • v.15 no.2
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    • pp.313-318
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    • 2020
  • Since the engineering plastics having a melting point of higher than 300 degrees have a high mechanical rigidity, chemical resistance, friction and abrasion performance, those are being highlighted as metal replacement materials in various industries. In this study, 3D printer nozzle with excellent heat dissipation characteristics are designed and analytically verified to form engineering plastics with high melting points in 3D printers based on the melt-lamination modeling method. In order to insulate between the heat block heated to a melting point of filament material and the upper part of the nozzle where the filament is transferred, the heat brake part with low thermal conductivity was designed to have two separate parts, and a cooling fin structure is further applied to the heat brake part to lower steady-state temperature by air convection. Optimized structural design on FDM nozzle part reduces the temperature at the heat sink and at the end part of heat brake by 50% and 14% respectively, compared to the conventional BCnozzle structure.

Irregular surface output using FDM (Fused Deposition Modeling) 3D printer (FDM(Fused Deposition Modeling) 방식 3D 프린터를 이용한 불규칙한 표면 출력)

  • Lee, Jung-Soo;Cha, Kyung-Chul
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.32 no.1
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    • pp.33-39
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    • 2022
  • As 3D printer-related patents expire and major technologies are disclosed, the price of 3D printers is dropping, creating an environment where you can easily find the product you want. In particular, the cheapest FDM (Fused Deposition Modeling) 3D printer is being used in various fields. The FDM method can be manufactured without collapsing of the shape only by attaching a support under certain conditions when outputting the shape. When printing a shape without a support, the irregular surface that occurs at a certain angle is a defect in the product, but it is considered that it can be used as another fun factor in terms of arts and crafts. In this paper, to obtain such an irregular surface, factors that can affect the output were controlled and only the output angle was tested as a displacement factor. As a result of the experiment, it was possible to obtain an irregular surface without the filament flowing down when printing at an angle of 62° to 70° from the vertical. Also, artificially irregular surfaces were applied to craft products.

A Study on the Burst Pressure of Composite Motor Case due to the Change of Metal Boss PDR Design (금속 보스 압력분포비 설계 변경에 따른 복합재 연소관 파열압력에 관한 연구)

  • Kim, Namjo;Jeong, Seungmin;Yun, Kyeongsoo;Chung, Sangki;Hwang, Taekyung
    • Journal of the Korean Society of Propulsion Engineers
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    • v.23 no.4
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    • pp.21-27
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    • 2019
  • Composite motor cases fabricated by the filament winding method are structurally weak in the dome when they are required to withstand the internal pressure of the combustion gas. In this study, a finite element analysis is conducted to compare the burst pressure of a composite dome according to the variation of the pressure distribution ratio(PDR). The performance of the composite motor case was compared quantitatively by calculating the stress on the inner and outer dome surfaces and metal boss volume. As a result, the critical point of the failure mode was observed at a PDR between 2.5 and 3.0. A design at a PDR of 2.5­-3.5 can reduce the weight of metal boss without fluctuation in the burst pressure of the combustion motor case. Moreover as the design reference value changes according to the dome shape and opening size, further analysis and testing are necessary.

A Study on the Effect of FFF 3D Printer Nozzle Size and Layer Height on Radiation Shield Fabrication (FFF방식의 3D프린터 노즐 크기와 층 높이가 방사선 차폐체 제작에 미치는 영향에 관한 연구)

  • Yoon, Joon;Yoon, Myeong-Seong
    • Journal of the Korean Society of Radiology
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    • v.14 no.7
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    • pp.891-898
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    • 2020
  • As the problem of shields made of lead has recently emerged, research on replacement shields is essential, and studies on the manufacture of diagnostic X-ray shields with 3D printers are also being actively conducted. Recently, with the development of metal mixed filaments, it has become possible to manufacture shielding materials easily, but studies on the nozzle size and output setting of 3D printers are insufficient. Therefore, this study aims to compare and analyze the results through a shielding rate experiment using a brass filament and a 3D printer, outputting the shield according to the nozzle size and layer height, and using a diagnostic radiation generator. The nozzle size was changed to 0.4, 0.8 mm, layer height 0.1, 0.2, 0.3, 0.4 mm, and output. The shielding rate test was fixed at 40 mAs, and the shielding rate was analyzed by experimenting with 60, 80, and 100 kVp, respectively. As a result of the analysis, it was analyzed that the printing time could be reduced to 1/10 according to the nozzle size and the layer height, and the shielding rate could be increased by 1% or more.

Mineralization of Geothite and Lepidocrocite on the Twisted-stalk and Sheathed-filaments from the Microbial Origin (미생물 기원의 나선형 및 협막구조물에 형성된 침철석과 레피도크로사이트의 결정화작용)

  • Park, Cheon-Young;Cho, Sang-Seob
    • Economic and Environmental Geology
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    • v.42 no.6
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    • pp.549-559
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    • 2009
  • The objectives of this study are to investigate the biomineralization of goethite and lepidocrocite formed on the twisted-stalk and the sheathed-filament structure that is suggest microbe origin, and heavy metal in the yellow Fe-hydroxide. On the ratio of Cl and the Cl/Br ratios that are a pollution and non-pollution of groundwaters, it is indicated that the groundwater in this areas were relatively contaminated by human activity. The composition of the yellow Fe-hydroxide consisted mainly of $Fe_2O_3$ and $SiO_2$. The content of $Fe_2O_3$ ranges from 58.57 wt.% to 75.7 3wt.%, and $SiO_2$ content ranges from 5.8 wt.% to 16.17 wt.%. Heavy metal elements such as Zn(max. 6,160 mg/kg), Pb(max. 377 mg/kg), U(max. 503 mg/kg), Cr(max. 203 mg/kg), Cu(max. 77 mg/kg), V(max. 162 mg/kg), Ni(max. 105 mg/kg) were observed to be rich in those yellow Fe-hydroxide. The lath and platy crystals and needle-shaped crystals were clearly observed on the twisted-stalks and sheathed-filaments structure. The goethite, gypsum, and lepidocrocite were identified in the yellow Fe-hydroxide by x-ray powder diffraction.

Electrochemical treatment of wastewater using boron doped diamond electrode by metal inter layer

  • KIM, Seohan;YOU, Miyoung;SONG, Pungkeun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.251-251
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    • 2016
  • For several decades, industrial processes consume a huge amount of raw water for various objects that consequently results in the generation of large amounts of wastewater. Wastewaters are consisting of complex mixture of different inorganic and organic compounds and some of them can be toxic, hazardous and hard to degrade. These effluents are mainly treated by conventional technologies such are aerobic and anaerobic treatment and chemical coagulation. But, these processes are not suitable for eliminating all hazardous chemical compounds form wastewater and generate a large amount of toxic sludge. Therefore, other processes have been studied and applied together with these techniques to enhance purification results. These include photocatalysis, absorption, advanced oxidation processes, and ozonation, but also have their own drawbacks. In recent years, electrochemical techniques have received attention as wastewater treatment process that could be show higher purification results. Among them, boron doped diamond (BDD) attract attention as electrochemical electrode due to good chemical and electrochemical stability, long lifetime and wide potential window that necessary properties for anode electrode. So, there are many researches about high quality BDD on Nb, Ta, W and Si substrates, but, their application in effluents treatment is not suitable due to high cost of metal and low conductivity of Si. To solve these problems, Ti has been candidate as substrate in consideration of cost and property. But there are adhesion issues that must be overcome to apply Ti as BDD substrate. Al, Cu, Ti and Nb thin films were deposited on Ti substrate to improve adhesion between substrate and BDD thin film. In this paper, BDD films were deposited by hot filament chemical vapor deposition (HF-CVD) method. Prior to deposition, cleaning processes were conducted in acetone, ethanol, and isopropyl alcohol (IPA) using sonification machine for 7 min, respectively. And metal layer with the thickness of 200 nm were deposited by DC magnetron sputtering (DCMS). To analyze microstructure X-ray diffraction (XRD, Bruker gads) and field emission scanning electron microscopy (FE-SEM, Hitachi) were used. It is confirmed that metal layer was effective to adhesion property and improved electrode property. Electrochemical measurements were carried out in a three electrode electrochemical cell containing a 0.5 % H2SO4 in deionized water. As a result, it is confirmed that metal inter layer heavily effect on BDD property by improving adhesion property due to suppressing formation of titanium carbide.

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Electrical Switching Characteristics of Ge-Se Thin Films for ReRAM Cell Applications

  • Kim, Jang-Han;Nam, Ki-Hyun;Chung, Hong-Bay
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.343-344
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    • 2012
  • It has been known since the mid 1960s that Ag can be photodissolved in chalcogenide glasses to form materials with interesting technological properties. In the 40 years since, this effect has been used in diverse applications such as the fabrication of relief images in optical elements, micro photolithographic schemes, and for direct imaging by photoinduced Ag surface deposition. ReRAM, also known as conductive bridging RAM (CBRAM), is a resistive switching memory based on non-volatile formation and dissolution of a conductive filament in a solid electrolyte. Especially, Ag-doped chalcogenide glasses and thin films have become attractive materials for fundamental research of their structure, properties, and preparation. Ag-doped chalcogenide glasses have been used in the formation of solid electrolyte which is the active medium in ReRAM devices. In this paper, we investigated the nature of thin films formed by the photo-dissolution of Ag into Ge-Se glasses for use in ReRAM devices. These devices rely on ion transport in the film so produced to create electrically programmable resistance states. [1-3] We have demonstrated functionalities of Ag doped chalcogenide glasses based on their capabilities as solid electrolytes. Formation of such amorphous systems by the introduction of Ag+ ions photo-induced diffusion in thin chalcogenide films is considered. The influence of Ag+ ions is regarded in terms of diffusion kinetics and Ag saturation is related to the composition of the hosting material. Saturated Ag+ ions have been used in the formation of conductive filaments at the solid electrolyte which is the active medium in ReRAM devices. Following fabrication, the cell displays a metal-insulator-metal structure. We measured the I-V characteristics of a cell, similar results were obtained with different via sizes, due to the filamentary nature of resistance switching in ReRAM cell. As the voltage is swept from 0 V to a positive top electrode voltage, the device switches from a high resistive to a low resistive, or set. The low conducting, or reset, state can be restored by means of a negative voltage sweep where the switch-off of the device usually occurs.

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Resistive Memory Switching in Ge5Se5 Thin Films

  • Kim, Jang-Han;Hwang, Yeong-Hyeon;Chung, Hong-Bay
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.326-326
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    • 2014
  • It has been known since the mid 1960s that Ag can be photodissolved in chalcogenide glasses to form materials with interesting technological properties. In the 40 years since, this effect has been used in diverse applications such as the fabrication of relief images in optical elements, micro photolithographic schemes, and for direct imaging by photoinduced Ag surface deposition. ReRAM, also known as conductive bridging RAM (CBRAM), is a resistive switching memory based on non-volatile formation and dissolution of a conductive filament in a solid electrolyte. Especially, Ag-doped chalcogenide glasses and thin films have become attractive materials for fundamental research of their structure, properties, and preparation. Ag-doped chalcogenide glasses have been used in the formation of solid electrolyte which is the active medium in ReRAM devices. In this paper, we investigated the nature of thin films formed by the photo-dissolution of Ag into Ge-Se glasses for use in ReRAM devices. These devices rely on ion transport in the film so produced to create electrically programmable resistance states [1-3]. We have demonstrated functionalities of Ag doped chalcogenide glasses based on their capabilities as solid electrolytes. Formation of such amorphous systems by the introduction of Ag+ ions photo-induced diffusion in thin chalcogenide films is considered. The influence of Ag+ ions is regarded in terms of diffusion kinetics and Ag saturation is related to the composition of the hosting material. Saturated Ag+ ions have been used in the formation of conductive filaments at the solid electrolyte which is the active medium in ReRAM devices. Following fabrication, the cell displays a metal-insulator-metal structure. We measured the I-V characteristics of a cell, similar results were obtained with different via sizes, due to the filamentary nature of resistance switching in ReRAM cell. As the voltage is swept from 0 V to a positive top electrode voltage, the device switches from a high resistive to a low resistive, or set. The low conducting, or reset, state can be restored by means of a negative voltage sweep where the switch-off of the device usually occurs.

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