• Journal of the Korean Society for Precision Engineering
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• v.10 no.4
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• pp.206-215
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• 1993

The finite element method is applied to analyze the mechanism of metal cutting, especially micro metal cutting. This paper introduces some effects, such as constitutive deformation laws of workpiece material, friction of tool-chip contact interfaces, tool rake angle and also simulate the cutting process, chip formation and geometry, tool-chip contact, reaction force of tool. Under the usual plane strain assumption, quasi-static analysis were performed with variation of tool-chip interface friction coefficients and tool rake angles. In this analysis, cutting speed, cutting depth set to 8m/sec, 0.02mm, respectively. Some cutting parameters are affected to cutting force, plastic deformation of chip, shear plane angle, chip thickness and tool-chip contact length and reaction forces on tool. Several aspects of the metal cutting process predicted by the finite element analysis provide information about tool shape design and optimal cutting conditions.

• Transactions of Materials Processing
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• v.27 no.1
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• pp.54-59
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• 2018

In connecting parts of a hydrogen fuel cell vehicle, since the rubber ring is permeable to hydrogen, it is necessary to use a metal sealing structure which ensures leakage stability. Finite element analysis was performed to verify the fitting characteristics of the metal sealing structure, which is used to connect the pipe to a high pressure hydrogen FCEV tank. Deformation shape, contact distance and axial load were compared experimentally and these values were in agreement with each other. In the contact surface, between the pipe and the fitting body, the stress at the edge of the contact surface was higher than the center point, which was considered to be a good characteristic in view point of the leakage. The location of the contact points has almost no change in the upper part of the fitting, but that of the lower parts move downward as the fastening amount increases. The contact pressure at the lower part is maintained at the same constant level.

• Korean Journal of Metals and Materials
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• v.49 no.11
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• pp.905-909
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• 2011

The formation of front metal contact silicon solar cells is required for low cost, low contact resistance to silicon surfaces. One of the available front metal contacts is Ni/Cu plating, which can be mass produced via asimple and inexpensive process. A selective emitter, meanwhile, involves two different doping levels, with higher doping (${\leq}30{\Omega}/sq$) underneath the grid to achieve good ohmic contact and low doping between the grid in order to minimize the heavy doping effect in the emitter. This study describes the formation of a selective emitter and a nickel silicide seed layer for the front metallization of silicon cells. The contacts were thickened by a plated Ni/Cu two-step metallization process on front contacts. The experimental results showed that the Ni layer via SEM (Scanning Electron Microscopy) and EDX (Energy dispersive X-ray spectroscopy) analyses. Finally, a plated Ni/Cu contact solar cell displayed efficiency of 18.10% on a $2{\times}2cm^2$, Cz wafer.

• Journal of Hydrogen and New Energy
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• v.26 no.6
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• pp.554-559
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• 2015

Single cell of PEMFC (polymer electrolyte membrane fuel cell) is composed of bipolar plates, gasket, GDL and the MEA. Bipolar plate's function is the collecting electricity, helping oxygen/hydrogen gas diffuse evenly and draining the water and heat. In this work, we have conducted experiments to low contact resistance and improve the performance of a $25cm^2$ single cell by using metal forms. We have following experimental cases: 1) Conventional graphite serpentine channel bipolar plate; 2) Channel-less bipolar plate with nickel(Ni) based metal foam which coated by various materials. We focused the difference in contact resistance and performance of the single cell with metal foam depending on various coating materials. The experimental results show the similar performance of single cells between with serpentine channel bipolar plates and with channel-less bipolar plate using metal foams. In addition, single cell with metal foam shows potential to higher performance than conventional channel.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.349-349
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• 2010

Great performance of many semiconductor devices requirs the use of low-resistance ohmic contact. Typically, transmission line method (TLM) patterns are used to measure the specific contact resistance between silicon and metal. In this works, we investigate contact resistance for metal dependent (Cr/Ag, Ni) using TLM pattern based on silicon-on-insulator (SOI) wafer. The electrode with Ni linearly increases contact resistance as the pattern distance increase from $15{\mu}m$ to $75{\mu}m$ in accumulation part, but non-linearly increase in inversion part. In additional, the electrode with Cr/Ag linearly increases contact resistance as the pattern distance increase from $15{\mu}m$ to $75{\mu}m$ in inversion part, but non-linearly increase in accumulation part.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.26 no.1
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• pp.32-37
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• 2014

The thermal contact resistance (TCR) is one of the important resistance components in cryogenic systems. Cryogenic measurement devices using a cryocooler can be affected by TCR because the device has to consist of several metal components that are in contact with each other for heat transfer to the specimen without a cryogen. Therefore, accurate measurement and understanding of TCR is necessary for the design of cryogenic measurement devices using a cryocooler. The TCR occurs at the interface between metals and it can be affected by variable factors, such as the roughness of the metal surface, the contact area and the contact pressure. In this study, we designed a TCR measurement system at variable temperature using a cryocooler as a heat sink. Copper was selected as a specimen in the experiment because it is widely used as a heat transfer medium in cryogenic measurement devices. We measured the TCR between Cu and Cu for various temperatures and contact pressures. The effect of the interfacial materials on the TCR was also investigated.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.261-261
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• 2010

In electric railways, high speed trains are normally supplied by AC 25kV power by contact between a pantograph contact strip and a contact wire. Advanced railway operating countries are actively researching various areas for the development of contact strips due to the reason that the properties of contact strips are one of the key factors of electric railways. This paper applied nano technology which is rapidly growing in many areas to the contact strip of a pantograph for current collection performance improvement considering speed up of electric railways. In detail, this paper proposes a method to dope nano particles of metal to a Korea Train eXpress(KTX) carbon pantograph and its measurement results. It is expected that the contents of this paper be used for preliminary study of high-speed railway current collection technologies.

• Progress in Superconductivity and Cryogenics
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• v.15 no.2
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• pp.48-51
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• 2013

The thermal contact resistance (TCR) is one of the important components in the cryogenic systems. Especially, cryogenic measurement devices using a cryocooler can be affected by TCR because the systems have to consist of several metal components in contact with each other for heat transferring to the specimen without cryogen. Therefore, accurate measurement and understanding of TCR is necessary for the design of cryogenic measurement device using a cryocooler. The TCR occurs at the interface between metals and it can be affected by variable factors, such as roughness of metal surface, contact area and contact pressure. In this study, we designed TCR measurement system at various temperatures using a cryocooler as a heat sink and used steady state method to measure the TCR between metals. The copper is selected as a specimen in the experiment because it is widely used as a heat transfer medium in the cryogenic measurement devices. The TCR between Cu and Cu is measured for various temperatures and contact pressures. The effect of the interfacial materials on the TCR is also investigated.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.813-816
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• 2002

We investigate the junction between CdZnTe and a variety of metals with the aim of determining whether the choice of metal can improve the performance of X-ray image detectors, in particular minimizing the dark current. The samples consist of $5{\mu}m$ thick CdZnTe with top electrodes formed from In, Al, and Au. For each metal, current transients following application of valtages from -10V to 10V are measured for up to 1 hour. We find that dark currents depending on the metal used. The current is controlled by hole injection at the metal-CdZnTe junction and there is consistent trend with the metal's work function possibly and it seems that metal to CdZnTe layer junction is ohmic contact.

• Solar Energy
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• v.17 no.1
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• pp.59-66
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• 1997

The solar cell electrical output parameters such as the open circuit voltage($V_{oc}$) and short circuit current density($V_{sc}$) are intrinsic characteristics depending on junction depth, doping concentration, metal contacts barriers and cell structure. As a role of thumb for solar cell design, the metal contact barriers for phosphorus doped emitter should have lower work function in order to provide lower series resistance. The fabrication of PESC(passivated emitter solar cell) structure usually involves the use of titanium as a metal contact barrier. Chromium, which work function is similar to titanium but conductance is higher than titanium is being investigated as the new metal contact barrier. Although titanium has lower work function difference than chromium, the electric performances of chromium as contact barrier are higher than titanium. This better performance is attributed to the lower resistivity from chromium. This paper, therefore, compares the attributes of metal barrier contacts using titanium and chromium.