• Journal of Sensor Science and Technology
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• v.4 no.3
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• pp.80-88
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• 1995

This paper presents the fabrication of a metal-insulator-metal(MIM) antifuse structure consisting of insulators sandwiched between top electrode, Al, and bottom electrode, TiW and additionally studies on antifuse properties depending on the condition of insulator. The intermetallic insulators, prepared by means of sputter, comprised of silicon oxide and tantalum oxide. In such an antifuse structure, silicon oxide layer is utilized to decrease the leakage current and tantalum oxide layer, of which the dielectric strength is lower than that of silicon oxide, is also utilized to lower the breakdown voltage near 10V. Finally sufficient low leakage current, below 1nA, and low programming voltage, about 9V, could be obtained in antifuse device comprising $Al/Ta_{2}O_{5}(10nm)/SiO_{2}(10nm)/TiW$ structure and OFF resistance of 3$3.65M{\Omega}$ and ON resistance of $7.26{\Omega}$ could be also obtained. This $Ta_{2}O_{5}/SiO_{2}$ based antifuse structures will be promising for highly reliable programmable device.

• Korean Journal of Materials Research
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• v.10 no.7
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• pp.499-504
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• 2000

Recently there have been many investigations on the synthesis and properties of transition metal trialuminides based on Ti, Zr, V, Nb and Ta for use aircraft structure materials in an elevated environment. The effect of Zr additions on the formation behaviour of Al-Nb alloy was investigated. Al-1.3at.%(Nb+Zr) alloys with different Nb to Zr atomic 1:3, 1:1 and 3:1 were prepared by mechanical alloying(MA). The morphological changes and microstructural evolution of Al-Nb-Zr powders during MA were investigated by SEM, XRD and TEM. The intermetallic compound phase of $Nb_2Al\; and\; Al_3Zr_4$ was identified by X-ray diffraction. The intemetallic compound of $Al_3Zr,\; Al_3Nb$ and $Al_3Zr_4$ were formed by heat treatment for 1 hour at $500^{\circ}C$. The size of intermetallic compounds observed by TEM were approximately below 100nm, when they were heat treated after mechanically alloying for 30 hours.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.1
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• pp.33-38
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• 2009

The use of portable devices has created the need for new reliability criterion of drop impact tests because of the tendency to accidentally drop in the use of these devices. The effects of different PCB surface finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) and high temperature storage (HTS) test on the drop reliability were studied. Various drop test conditions were used to evaluate a drop reliability of assemblies to endure such impact and shock load. In the case of the as-reflowed samples (no HTS test), the SAC/OSP boards exhibited a better drop impact reliability than that of SAC/ENIG. However, the reverse was true if HTS test is performed. In addition, significant decrease of drop reliability was observed for both SAC/ENIG and SAC/OSP assemblies after HTS test. It was also observed that the thickness of intermetallic compound layer do play an important role in the brittle fracture of drop test.

• Journal of the Korean Vacuum Society
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• v.2 no.2
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• pp.209-219
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• 1993

Evaporated Al/Pd thin films were irradiated with various doses to produce intermetallic compounds. In order to study the first phase formation and phase sequence, RBS and TEM studies have been used. It was found that the initial phase formed by irradiation of $5{\times}10^{15}Ar^+/cm^2$ was $Al_3Pd_2$, while $1.5{\times}10^{16}Ar^+/cm^2$ gave the subsequent phase of AlPd. This phenomenon was analysed using effective heat of formation (${\Delta}$H') model. The experimental results agree with that predicted by effective heat of formation model. This model has been extended to predict the first phase formation and phase sequence by ion beam mixing in metal/Si systems as well as metal-metal systems.

• Journal of the Korean Society for Nondestructive Testing
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• v.18 no.2
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• pp.112-120
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• 1998

A nondestructive evaluation technique was developed for the quantitative determination of the reinforcement volume fractions in particulate reinforced metal matrix composites. The proposed technique employed a composite micromechanics which accounts for the microstructure of the composite medium together with the measurement of anisotropic electrical conductivity. When the measured conductivity was coupled with the theoretically predicted conductivity, the unknown reinforcement volume fraction was calculated. An analytical model based on the Mori-Tanaka method was described which relates the NDE signatures to the composite microstructure. The volume fractions were calculated using eddy current measurements made on a wide range of silicon carbide particulate ($SiC_p$) reinforced aluminum (Al) matrix composites. The calculated $SiC_p$ volume fractions were in good agreement with the measured volume fractions in the range of 0-30%. The technique was also found to be effective in estimating the total volume percentage of reinforcement and intermetallic compound formed during the processing stage.

• Conservation Science in Museum
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• v.16
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• pp.32-45
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• 2015

The bronze incense burner, discovered in Chungung-dong, Hanam, Gyeonggi-do in 1971, is a hanging incense burner dating from the Goryeo period. The incense burner was covered with a thick layer of clay. The object was in a severely deteriorated state, affected by bronze disease which resulted in extensive corrosion. Numerous cracks were present across its surface, and some parts had been broken off. To preserve and display the bronze incense burner in a stable condition, deposits of foreign material were removed from the surface, and the weakened metal was strengthened. Cracked and broken areas were reinforced using woven glass fiber, followed by the application of epoxy resin to restore the shape. To investigate the method of production, a chemical analysis was performed, and the microstructure was examined. The chemical analysis revealed that the body of the incense burner as well as the ear, loop, lid and the knob were cast in a ternary alloy of Cu-Sn-Pb. Moreover, copper nails with high copper content were used to securely join the ear to the body of the incense burner. The microstructure was mainly α-phase, and non-intermetallic inclusions composed of Cu and S were detected.

• Proceedings of the Korean Vacuum Society Conference
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• 1998.02a
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• pp.135-136
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• 1998

By the ion bombardment the original discrete layered structure is damaged and a uniformly mixed layer is formed by the intermixing of the films. Immediately after this dynamic cascade mixing a structure of this mixed layer is likely to be a mixture of randomly distributed atoms. Subsequently the mixed layered structure becomes a non-equilibrium structure such as the metastable pphase because the kinetic energies of the incident ions rappidly dissippate and host atoms within the collision cascade region are quenched from a highly energetic state. The formation of the metastable transition metal alloys using ion-beam-mixing has been extensively studied for many years because of their sppecific ppropperties that differ from those of bulk materials. in ion-beam-mixing the alloy or comppound is formed due to the atomic interaction between different sppecies during ion bombardment. in this study the metastable pphase formed by ion-beam-mixing pprocess is comppared with equilibrium one by arc-melting method by GXRD and XAS. Therfore we studied the fundamental characteristics of charge redistribution uppon alloying and formation of intermetallic comppounds. The multi-layer films were depposited on a wet-oxidized Si(100) substrate by sequential electron beam evapporation at a ppressure of less than 5$\times$10-7 Torr during depposition. These compprise 4 ppairs of Co and ppt layers where thicknesses of each layer were varied in order to change the alloy compposition.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.41-41
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• 2009

To evaluate the applicability of dissimilar joining between Mg and Al alloys in automobile manufacturing process, solid state joining processes such as magnetic pulse welding(MPW), friction stir welding(FSW) and friction spot joining(FSJ) were attempted successfully. MPW process has been concentrated mainly on round section tube to tube and tube to bar welds. AZ31 Mg alloy has been successfully welded to pure Al A1070 as well as to Al alloy A3003. While, for friction stir welding of dissimilar sheet joints, AZ31B/A6061 with the thickness of 2mm were used and a square butt joint with a good quality was obtained at the conditions of 0.8mm/sec of travel speed and tool rotation speed of 850rpm. The maximum tensile strength of 179 MPa, which was about 80 % of the Mg base metal tensile strength, has been obtained. Finally, friction spot joining was attempted to make a dissimilar lap joint between AZ31(0.8mm) and A6061(1mm), while the joint exhibited the same level of tensile shear strength as that of similar Mg joint.

• Journal of Welding and Joining
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• v.31 no.5
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• pp.20-25
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• 2013

This study was carried out to investigate the influence of a sigma phase precipitation on the pitting corrosion resistance and microstructural change of super duplex stainless steels(UNS S32750). The welds made by FCAW (Flux Cored Arc Welding) were heat treated ($930^{\circ}C$, $1080^{\circ}C$, $1230^{\circ}C$) and quenched. Based on the microstructural examination, it was found that the ${\sigma}$ phase was formed in base metals and welds heat treated at $930^{\circ}C$ while there were little ${\sigma}$phases formed in base metals and weld metal experienced the relatively fast cooling from $1080^{\circ}C$ and $1230^{\circ}C$. On the other hand, the most weight loss due to pitting corrosion occurred in base and weld metals heat treated at $930^{\circ}C$. It was confirmed that the pitting corrosion occurred in the phase boundaries of ferrite/sigma and austenite/sigma. The pitting corrosion resistance decreased owing to an increase in Cr, Mo depleted areas adjacent to the intermetallic phases such as ${\sigma}$phases. The hardness was greatly increased due to the precipitation ${\sigma}$phases.

• Corrosion Science and Technology
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• v.6 no.2
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• pp.50-55
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• 2007

The smaller size and higher integration of advanced electronic package systems result in severe electrochemical reliability issues in microelectronic packaging due to higher electric field under high temperature and humidity conditions. Under these harsh conditions, electronic components respond to applied voltages by electrochemical ionization of metal and the formation of a filament, which leads to short-circuit failure of an electronic component, which is termed electrochemical migration. This work aims to evaluate electrochemical migration susceptibility of the pure Sn, Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder alloys in $Na_{2}SO_{4}$. The water drop test was performed to understand the failure mechanism in a pad patterned solder alloy. The polarization test and anodic dissolution test were performed, and ionic species and concentration were analyzed. Ag and Cu additions increased the time to failure of Pb-free solder in 0.001 wt% $Na_{2}SO_{4}$ solution at room temperature and the dendrite was mainly composed of Sn regardless of the solders. In the case of SnAg solders, when Ag and Cu added to the solders, Ag and Cu improved the passivation behavior and pitting corrosion resistance and formed inert intermetallic compounds and thus the dissolution of Ag and Cu was suppressed; only Sn was dissolved. If ionic species is mainly Sn ion, dissolution content than cathodic deposition efficiency will affect the composition of the dendrite. Therefore, Ag and Cu additions improve the electrochemical migration resistance of SnAg and SnAgCu solders.