• Nuclear Engineering and Technology
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• v.8 no.2
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• pp.89-99
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• 1976

The grafting of acrylic acid in aqueous solution to polyvinyl chloride fibers tab been studied in the presence of ferrous, ferric, and cupric salts, The mutual irradiation technique was adopted using a Co-60 source or a Van do Graaff accelerator. The grafting and homopolymerization were suppressed by the cations. Particularly the grafting was suppressed by the cations in the following order of effectiveness : $Cu^{2+}$>$Fe^{2+}$>$Cu^{3+}$. The rate of grafting (in %/hr) was proportional to the 0.76th power of the dose rate over the range from 8.5f $10^3$ rad/hr to $1.4\times10^5$ rad/dr. The apparent activation energy for the grafting was determined to be 6.1 Kcal/mole between $25^{\circ}$ and $75^{\circ}C$ for the mixture of AA-HaO-$(CH_2Cl)_2$, containing Mohr's salt, $4\times10^{-3}$ mole/l. The increase of the grafting was observed when total dose and dose intensity were raised, or when ethylene dichloride as a swelling agent was saturated in the monomer mixture. The grafted polyvinyl chloride fibers showed considerable improvement in moisture regain, heat shrinkage, and melting properties, but tensile properties were not significantly affected by grafting.

• Design & Manufacturing
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• v.14 no.1
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• pp.49-55
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• 2020

In this study, the fatigue behavior and fatigue life characteristics of PA2200 specimens fabricated by SLS 3D printer were studied. Fatigue tests were performed according to the standard specification (ASTM E468) and fatigue life curves were obtained. In order to perform the fatigue test, mechanical properties were measured according to the test speed of the simple tensile test, and the self-heating temperature of the specimen according to the test speed was measured using an infrared temperature measuring camera in consideration of heat generation due to plastic deformation. There was no significant difference within the set test speed range and the average self-heating temperature was measured at 38.5 ℃. The mechanical strength at the measured temperature showed a relatively small difference from the mechanical strength at room temperature. Fatigue test conditions were established through the preceding experiments, and the loading conditions below the tensile strength at room temperature 23 ℃ were set as the cyclic load. The maximum number of replicates was less than 100,000 cycles, and the fracture behavior of the specimens with the repeated loads showed the characteristics of Racheting. It was confirmed that SLS 3D printing PA2200 material could be applied to the Basquin's S-N diagram for the fatigue life curve of metal materials. SEM images of the fracture surface was obtained to analyze the relationship between the characteristics of the fracture surface and the number of repetitions until failure. Brittle fracture, crazing fracture, grain melting, and porous fracture surface were observed. It was shown that the larger the area of crazing damage, the longer the number of repetitions until fracture.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.211-211
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• 1999

Titanium nitride (TiN) thin films have useful properties including high hardness, good electrical conductivity, high melting point, and chemical inertness. The applications have included wear-resistant hard coatings on machine tools and bearings, decorative coating making use of the golden color, thermal control coatings for widows, and erosion resistant coatings for spacecraft plasma probes. For all these applications as feature sizes shrink and aspect ratios grow, the issue of good step coverage becomes increasingly important. It is therefore essential to manufacture conformal coatings of TiN. The growth of TiN thin films by chemical vapor deposition (CVD) is of great interest for achieving conformal deposition. The most widely used precursor for TiN is TiCl4 and NH3. However, chlorine impurity in the as-grown films and relatively high deposition temperature (>$600^{\circ}C$) are considered major drawbacks from actual device fabrication. To overcome these problems, recently, MOCVD processes including plasma assisted have been suggested. In this study, therefore, we have doposited Ti(C, N) thin films on Si(100) and D2 steel substrates in the temperature range of 150-30$0^{\circ}C$ using tetrakis diethylamido titanium (TDEAT) and titanium isopropoxide (TIP) by pulsed DC plamsa enhanced metal-organic chemical vapor deposition (PEMOCVD) method. Polycrystalline Ti(C, N) thin films were successfully grown on either D2 steel or Si(100) surfaces at temperature as low as 15$0^{\circ}C$. Compositions of the as-grown films were determined with XPS and RBS. From XPS analysis, thin films of Ti(C, N) with low oxygen concentration were obtained. RBS data were also confirmed the changes of stoichiometry and microhardness of our films. Radical formation and ionization behaviors in plasma are analyzed by optical emission spectroscopy (OES) at various pulsed bias and gases conditions. H2 and He+H2 gases are used as carrier gases to compare plasma parameter and the effect of N2 and NH3 gases as reactive gas is also evaluated in reduction of C content of the films. In this study, we fond that He and H2 mixture gas is very effective in enhancing ionization of radicals, especially N resulting is high hardness. The higher hardness of film is obtained to be ca. 1700 HK 0.01 but it depends on gas species and bias voltage. The proper process is evident for H and N2 gas atmosphere and bias voltage of 600V. However, NH3 gas highly reduces formation of CN radical, thereby decreasing C content of Ti(C, N) thin films in a great deal. Compared to PVD TiN films, the Ti(C, N) film grown by PEMOCVD has very good conformability; the step coverage exceeds 85% with an aspect ratio of more than 3.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.51-57
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• 2008

In this paper, wetting and interfacial reaction properties for low Ag containing Sn-Ag-Cu Pb-free solder alloy, i.e., Sn-0.3Ag-0.7Cu were investigated and compared with those of Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu. Melting behavior and stress-strain curves of some Sn-xAg-xCu alloys were also measured using a differential scanning calorimeter(DSC) and a tensile test machine, respectively. In order to enhance insufficient wetting properties of Sn-0.3Ag-0.7Cu alloy, the improvement of wetting properties were analyzed by applying fluxes containing higher content of halide or indium adding of 0.2wt.% into the solder alloy. It was concluded that the small addition of indium is more effective for the improvement of wettability in low temperature range of $230{\sim}240^{\circ}C$ than applying flux containing higher content of halide.

• Journal of the Korean earth science society
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• v.22 no.1
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• pp.1-9
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• 2001

Composition of the major and trace elements, Rb-Sr isochron age Sr-Nd isotope composition were determined for foliated in the Jeonju area, in the middle part of the Ogcheon Fold Bet, Korea. The geochemical characteristics of the Jeonju foliated granite indicate that the granite had been crystallized from a calc-alkaline series, and formed in a volcanic are environment. The isotopic compositions of the Jeonju foliated granite give Rb-Sr whole rock errorchron age of 168.2${\pm}$8 Ma(2${\sigma}$), corresponding to the middle Jurassic period, with the Sr initial ratio of 0.71354${\pm}$0.00031. $^{143}$Nd/$^{144}$Nd ratios, ${\varepsilon}$Nd and ${\varepsilon}$Sr values range from 0.511477 to 0.511744, -15.4${\sim}$-21.2, and +108.8${\sim}$+l42.6, respectively. Model ages were caculated to be 1.82${\sim}$2.89Ga. The isotopic data of Jeonju foliated granite indicate that the source material may have been derived from partial melting of continental crust materials.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.42 no.12
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• pp.1013-1019
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• 2014

Solid-liquid Phase Change Material(PCM) as a thermal control hardware for the electro-optical payload of low earth orbit satellite is numerically studied which can be substituted with Thermal Buffer Mass(TBM). The electro-optical module in LEO satellite is periodically work and high heat is dissipated during the imaging period, however, the design temperature range is very tight and sensitive. In order to handle this problem TBM is added and as a result the time constant of the module temperature increases. TBM is made of Al6010 and its mass directly affects the system design. To save the mass PCM is suggested in this study. The latent heat of melting or solidification is very high and small amount of PCM can play a role instead of TBM. The result shows that only 12% of TBM mass is enough to control the module temperature using PCM.

• Analytical Science and Technology
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• v.11 no.3
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• pp.189-193
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• 1998

Binary alloys, $MoRu_3$ and $MoRh_3$, have been prepared using arc melting furnace. Mo and the noble metals Ru and Rh are the constituents of metallic insoluble residues, which were found in the early days of the post-irradiation studies on uranium oxide fuels. Detailed structural informations about these alloys have not been reported on JCPDS files of ICDD (International Centre for Diffraction Data). The results of X-ray diffraction study showed that the alloy was crystallized in hexagonal close-packing, well known as ${\varepsilon}$-phase. The X-ray diffraction patterns of these alloys matched well to that of $WRh_3$ with $P6_3/mmc$ of space group. The lattice parameters, a and c, were calculated using the least squares extrapolation. It was found from X-ray photoelectron spectroscopic measurements that Mo on the surface of the alloy was oxidized to Mo(6+), which could be removed by sputtering with Ar ions for approximately 15 minutes. The changes in binding energy of Mo, Ru, and Rh on the surface of the alloy were not observed. Magnetic susceptibility measurements resulted in the typical Pauli-paramagnetic behavior in the temperature range of 2 to 300 K.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• Journal of Sensor Science and Technology
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• v.7 no.2
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• pp.111-116
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• 1998

The simple solid electrolyte carbon dioxide sensor with heaters were fabricated by using Li ionic conductor. Two Au electrodes were used for the reference and sensing electrode respectively. Two types of gas sensors, type ( I ) and type (II), were fabricated. Type ( I ) sensor was fabricated by the method of melting and crystallizing alkali metal carbonate at the temperature of $420{\sim}500^{\circ}C$. The sensing membrane of type (II) sensor was formed by the printing method on sensing electrode after metal carbonate was mixed with binder. The response characteristics of sensors fabricated for the carbon dioxide were investigated for a range of $CO_{2}$ concentration from 950 ppm to 9,950 ppm at operating temperature $420^{\circ}C$. Type ( I ) sensor and type (II) sensor showed the sensitivity of 62 mV/decade and 65 mV/decade respectively. The emf/decade of type (II) sensor tested at $420^{\circ}C$ almost followed the theoretical value of Nernst's equation and showed stable response characteristics with the fast response time of $15{\sim}20$ sec. Also type (II) sensor showed excellent stability and reproduction properties for 60 days.

• Applied Chemistry for Engineering
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• v.7 no.3
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• pp.496-503
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• 1996

Aromatic and aliphatic copolyesters for the dispersing agent were synthesized by two stage reaction, esterification and polycondensation. Copolyesters were blended with PET in the melt state and their thermal and rheological properties were investigated. From GPC analysis Mn's and Mw's of copolyesters were about 30000 and 65000g/mol, respectively. From DSC experiment copolyesters had melting range of $90{\sim}150^{\circ}C$. Copolymer composition was in good agreement with comonomer feed ratio from $^1H$-NMR analysis. Copolyesters and SPA (standard sample) were blended with PET in the melt state. From DSC experiment, copolyesters and SPA were miscible with PET. From the dynamic melt viscosity experiment, melt viscosity of blended sample was increased as the content of aromatic copolyester was increased, while it was decreased as the content of aliphatic and SPA were increased. As for volume resistivity of dry color containing carbon black and copolyesters with dispersing time, aromatic copolyester showed highest value. It was conferred from this result that aromatic copolyester was the best dispersing agent for carbon black in PET resin.