• Korean Journal of Materials Research
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• v.15 no.1
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• pp.37-41
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• 2005

Stainless steel fibers with a diameter of $17\;{\mu}m$ and 630 nm were produced from stainless steel wires by the drawing/annealing/exfolitation process. The suitable sheath material to draw the core stainless steel wires to fibers was the Cu coating. The low melting metal of Zn was not a suitable sheath coating. Also, an attempt was made to produce $20\;{\mu}m{\Phi}Ti$ fibers from the core titanium wires. The main obstacles in producing Ti fibers were their resistance to deformation owing to the Ti's hop structure, and high reactivity of Ti with the exfolitation solution.

• Journal of the Korean Society for Precision Engineering
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• v.14 no.7
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• pp.22-28
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• 1997

In this paper, We have studied internal quality incluiding chemical compositions, microscopic structure and nonmetalic inclusion of test material. We have analyzed dynamic characteristics of cutting resistence and compared chip treatment of the test material. In analyzing internal quality, all of the test material have typical ferrite+pearlite structure. But, nonmetallic inclusion has oxide and sulfide inclusion has oxide and sulfide inclusion in medium carbon steel, mainly sulfide inclusion is existed in S-free cutting steel. In Ca+S-free cutting steel, calcium aluminate and sulfide complex inclusion, had low-melting point, as deformation of sulfide and oxide inclusion is existed. Machining characteristics, cutting resistence is maximum in medium carbon steel. Chip treatement are excellent in S-free cutting steel, similar to the Ca+S free cutting steel and medium carbon steel.

• Journal of Powder Materials
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• v.31 no.4
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• pp.336-341
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• 2024

Molybdenum, valued for its high melting point and exceptional physical and chemical properties, is studied in diverse fields such as electronics, petrochemicals, and aviation. Among molybdenum oxides, molybdenum dioxide stands out for its higher electrical conductivity than other transition metal oxides due to its structural characteristics, exhibiting metallic properties. It is applied as pellets to gas sensors, semiconductors, and secondary batteries for its properties. Thus, research on molybdenum dioxide compaction and pressureless sintering is necessary, yet research on pressureless sintering is currently insufficient. This study synthesized MoO₃ powder via solution combustion synthesis and reduced it using the 3% hydrogen/argon gas mixture to investigate the effect of reduction temperature on the powder. Additionally, the reduced powder was compacted and subjected to pressureless sintering with temperature as a variable. The density and the microstructure of brown parts were analyzed and discussed.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Membrane Journal
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• v.26 no.6
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• pp.449-457
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• 2016

In this study, polyvinylidene fluoride (PVDF) membrane with excellent mechanical properties and chemical resistance was prepared and characterized for the application of water treatment. Dibutyl-phthalate (DBP) was used as a diluent for making a membranes through temperature induced phase separation (TIPS) method, and the crystallization temperature, melting point, cloud point and SEM image were observed with different ratio of diluent in polymer/diluent mixture. The crystallization temperature and melting point increased proportionally with the content of polymer, while the cloud point temperature decreased. Finally, it was confirmed that stable membrane could be manufactured at a polymer content of 62 wt% and a temperature $125^{\circ}C$ using the phase diagram of PVDF/DBP mixtures with temperatures.

• Journal of Powder Materials
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• v.18 no.2
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• pp.141-148
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• 2011

Carbon material shows relatively high strength at high temperature in vacuum atmosphere and can be easily removed as CO or $CO_2$ gas in oxidation atmosphere. Using these characteristics, we have investigated the applicability of carbon mold for precision casting of high melting point metal such as nickel. Disc shape carbon mold with cylindrical pores was prepared and Ni-base super alloy (CM247LC) was used as casting material. The effects of electroless Nickel plating on wettability and cast parameters such as temperature and pressure on castability were investigated. Furthermore, the proper condition for removal of carbon mold by evaporation in oxidation atmosphere was also examined. The SEM observation of the interface between carbon mold and casting materials (CM247LC), which was infiltrated at temperature up to $1600^{\circ}C$, revealed that there was no particular product at the interface. Carbon mold was effectively eliminated by exposure in oxygen rich atmosphere at $705^{\circ}C$ for 3 hours and oxidation of casting materials was restrained during raising and lowering the temperature by using inert gas. It means that the carbon can be applicable to precision casting as mold material.

• Journal of Powder Materials
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• v.22 no.6
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• pp.426-431
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• 2015

Microstructural examination of the Nb-Si-B alloys at Nb-rich compositions is performed. The Nb-rich corner of the Nb-Si-B system is favorable in that the constituent phases are Nb (ductile and tough phase with high melting temperature) and $T_2$ phase (very hard intermetallic compound with favorable oxidation resistance) which are good combination for high temperature structural materials. The samples containing compositions near Nb-rich corner of the Nb-Si-B ternary system are prepared by spark plasma sintering (SPS) process using $T_2$ and Nb powders. $T_2$ bulk phase is made in arc furnace by melting the Nb slug and the Si-B powder compact. The $T_2$ bulk phase was subsequently ball-milled to powders. SPS is performed at $1300^{\circ}C$ and $1400^{\circ}C$, depending on the composition, under 30 MPa for 600s, to produce disc-shaped specimen with 15 mm in diameter and 3 mm high. Hardness tests (Rockwell A-scale and micro Vickers) are carried out to estimate the mechanical property.

• Korean Journal of Materials Research
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• v.28 no.2
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• pp.89-94
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• 2018

The properties of 18 K red gold solder alloys were investigated by changing the content of In up to 10.0 wt% in order to replace the hazardous Cd element. Cupellation and energy dispersive X-ray spectroscopy (EDS) were used to check the composition of each alloy, and FE-SEM and UV-VIS-NIR-Colormeter were employed for microstructure and color characterization. The melting temperature, hardness, and wetting angle of the samples were determined by TGA-DTA, the Vickers hardness tester, and the Wetting angle tester. The cupellation result confirmed that all the samples had 18K above 75.0wt%-Au. EDS results showed that Cu and In elements were alloyed with the intended composition without segregation. The microstructure results showed that the amount of In increased, and the grain size became smaller. The color analysis revealed that the proposed solders up to 10.0 wt% In showed a color similar to the reference 18 K substrate like the 10.0 wt% Cd solder with a color difference of less than 7.50. TGA-DTA results confirmed that when more than 5.0 wt% of In was added, the melting temperature decreased enough for the soldering process. The Vickers hardness result revealed that more than 5.0 wt% In solder alloys had greater hardness than 10.0 wt% Cd solder, which suggested that it was more favorable in making a wire type solder. Moreover, all the In solders showed a lower wetting angle than the 10.0 wt% Cd solder. Our results suggested that the In alloyed 18 K red gold solders might replace the conventional 10.0 wt% Cd solder with appropriate properties for red gold jewelry soldering.

• Polymer(Korea)
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• v.36 no.4
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• pp.500-506
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• 2012

In this study, we developed and optimized hydrophilic polymer based solid dispersion formulations (SDs) for enhancing the aqueous solubility of eprosartan, one of poorly soluble drugs, that has been broadly used for the treatment of high blood pressure. Poly(ethylene glycol) (PEG) and poly(vinyl pyrrolidone) (PVP) based SDs were prepared by hot melting and solvent evaporation methods and the drug/polymer composition varied in the range of 1:1~1:5 with or without poloxamer 407 (P407) as a polymeric surfactant. The SDs prepared by solvent evaporation showed more reduced crystallinity than ones by hot melting, and PVP based SDs showed more enhanced solubility and lower crystallinity than PEG based SDs. Furthermore, it was observed from DSC and PXRD analysis that the SDs with P407 (drug:polymer: P407 = 1:5:1) demonstrated no crystallinity and the most enhanced solubility (more than 3~4 times).