• Title/Summary/Keyword: Mechanics' Institute

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Spatial Optical Modulator (SOM);Samsung's Light Modulator for the Next Generation Laser Display

  • Yun, Sang-Kyeong;Song, Jong-Hyeong;Lee, Tae-Won;Yeo, In-Jae;Choi, Yoon-Joon;Lee, Yeong-Gyu;An, Seung-Do;Han, Kyu-Bum;Victor, Yurlov;Park, Heung-Woo;Park, Chang-Su;Kim, Hee-Yeoun;Yang, Jeong-Suong;Cheong, Jong-Pil;Ryu, Seung-Won;Oh, Kwan-Young;Yang, Haeng-Seok;Hong, Yoon-Shik;Hong, Seok-Kee;Yoon, Sang-Kee;Jang, Jae-Wook;Kyoung, Je-Hong;Lim, Ohk-Kun;Kim, Chun-Gi;Lapchuk, Anatoliy;Ihar, Shyshkin;Lee, Seung-Wan;Kim, Sun-Ki;Hwang, Young-Nam;Woo, Ki-Suk;Shin, Seung-Wan;Kang, Jung-Chul;Park, Dong-Hyun
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.551-555
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    • 2006
  • A new type of diffractive spatial optical modulators, named SOM, has been developed by Samsung Electro-Mechanics for projection display and other applications. A laser display in full HD format $(1920{\times}1080)$ was successfully demonstrated by using prototype projection engines having SOM devices, signal processing circuits, and projection optics.

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MEMS based micro-fuel processor

  • Kundu, Arunabha;Jang, J.H.;Lee, H.R.;Jung, C.R.;Gil, J.H.;Kim, S.H.;Cha, H.Y.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.10a
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    • pp.611-612
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    • 2006
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Computational multiscale analysis in civil engineering

  • Mang, H.A.;Aigner, E.;Eberhardsteiner, J.;Hackspiel, C.;Hellmich, C.;Hofstetter, K.;Lackner, R.;Pichler, B.;Scheiner, S.;Sturzenbecher, R.
    • Interaction and multiscale mechanics
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    • v.2 no.2
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    • pp.109-128
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    • 2009
  • Multiscale analysis is a stepwise procedure to obtain macro-scale material laws, directly amenable to structural analysis, based on information from finer scales. An essential ingredient of this mode of analysis is mathematical homogenization of heterogeneous materials at these scales. The purpose of this paper is to demonstrate the potential of multiscale analysis in civil engineering. The materials considered in this work are wood, shotcrete, and asphalt.

주파수 동기화 구현을 위한 가변 발진기 회로

  • Jang, Yu-Jin;Chun, Jeog-In;Kong, Seung-Kon;Shin, Sang-Chul;Goo, Bo-Nam;Gong, Jung-Chul;Min, Byoung-Own
    • Proceedings of the KIPE Conference
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    • 2008.06a
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    • pp.532-534
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    • 2008
  • LCD TV용 Backlight Unit을 구동하는 Inverter 및 SMPS용 IC의 발진기(OSC)는 구동 주파수를 결정하는 블록이다. 종래에는 미리 결정된 전류값과 충방전용 시정수에 의하여 스위칭 주파수가 고정 되어 있다. 이에 반하여 외부에서 스위칭 주파수를 가변하고자 할 때, 신호의 입력에 따라 스위칭 주파수가 가변 가능한 발진기(Oscillator) 블록을 제안한다.

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Studies on Changes of the Droplets by Bubbles in Piezoelectric Inkjet Head (잉크젯 헤드내 발생한 기포에 따른 토출 변화 연구)

  • Yoo, Young-Seuck;Kim, Young-Jae;Sim, Won-Chul;Park, Chang-Sung;Park, Jung-Hoon;Kang, Pil-Joong;Joung, Jae-Woo;Oh, Yong-Soo
    • Proceedings of the KIEE Conference
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    • 2007.07a
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    • pp.1544-1545
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    • 2007
  • 본 논문은 피에조방식으로 구동하는 MEMS 구조의 산업용 잉크젯 헤드를 제작하여 잉크를 충진하여 토출하는 과정에서 토출이 되지 않는 원인 중 하나인 기포에 대해서 연구하였다. 기포를 직접 관찰하기 위한 방법으로 투명한 유리로 Membrane을 제작하여 기포가 발생하여 거동하는 모습을 관찰하였으며 Actuator가 구동하는 헤드내 기포를 구동 중에 관찰하기 위한 방법으로 LDV(Laser Doffler Vibrometer)를 이용하였다. 그 결과, 구동하면서 발생하는 변위의 미세한 차이를 관찰할 수 있었으며 주파수 data의 차이를 관찰함으로써 기포의 크기에 따른 토출의 양태를 구별할 수 있었다.

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Investigation of Conductive Pattern Line for Direct Digital Printing (디지털 프린팅을 위한 전도성 배선에 관한 연구)

  • Kim, Yong-Sik;Seo, Shang-Hoon;Lee, Ro-Woon;Kim, Tae-Hoon;Park, Jae-Chan;Kim, Tae-Gu;Jeong, Kyoung-Jin;Yun, Kwan-Soo;Park, Sung-Jun;Joung, Jae-Woo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.502-502
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    • 2007
  • Current thin film process using memory device fabrication process use expensive processes such as manufacturing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as PCB, FCPB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line for the electronic circuit board using metal ink contains Ag nano-particles. Metal lines are fabricated by two types of printing methods. One is a conventional printing method which is able to quick fabrication of fine pattern line, but has various difficulties about thick and high resolution DPI(Dot per Inch) pattern lines because of bulge and piling up phenomenon. Another(Second) methods is sequential printing method which has a various merits of fabrication for fine, thick and high resolution pattern lines without bulge. In this work, conductivities of metal pattern line are investigated with respect to printing methods and pattern thickness. As a result, conductivity of thick pattern is about several un.

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