• 제어로봇시스템학회:학술대회논문집
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• 2004.08a
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• pp.1648-1652
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• 2004

An advanced training machine designed for elderly people is proposed. The training machine allows users to have a safe and effective training through exercise close to ordinal motion appears in daily life such as standing up/down motion. The activation level of user's muscle is real timely monitored during the exercise and the training load is adjusted based on the body information. The training load is exerted and continuously controlled by actuation of an air cylinder.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1171-1174
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• 2005

Manufacturing capability at the micro or nano scale production field is requested strongly in view of parts and product miniaturization. Miniaturized parts and products will introduce lots of benefits in terms of high precision functionality and low energy consumption. This paper presents the results of micro milling machine tool development for micro machining process. Finite element analysis has been performed to know the relationship between design dimensional variables and structural stiffness in terms of static, dynamic, thermal aspects. Performance evaluation through machining has been tested and discussed for achievable machining characteristics.

• Journal of Institute of Control, Robotics and Systems
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• v.8 no.5
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• pp.419-424
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• 2002

After the patterning and probe process of wafer have been achieved, the dicing processing is necessary to separate chips from a wafer. The dicing process cuts a semiconductor wafer to lengthwise and crosswise directions to make many chips. The existing general dicing method is the mechanical cutting using a narrow circular rotating blade impregnated diamond particles or laser cutting. Inferior goods can be made by the mechanical or laser cutting unless several parameters such as blade, wafer, cutting water and cutting conditions are properly set. Moreover, we can not apply these general dicing method to that of GaN wafer, because the GaN wafer is harder than general semiconductor wafers such as GaAs, GaAsP, AIGaAs and so forth. In order to overcome these problems, this paper describes a new wafer dicing method using fixed diamond scriber and precision servo mechanism.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.245-246
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• 2006

For developing 5-axis laser cutting systems, many problems such as rotating of laser head or table, 5-axis tool path generation and collision avoidance between laser head and product should be solved. In this paper, a five-axis laser cutting machine with table swivel and rotary type configuration is developed. The five axes (X,Y,Z,A,B) are controlled and interfaced to PC via MMC board. Two kinds of CAM S/W such as commercial 5-axis CAM S/W(Euclid) and UG-API are engaged to generate NC code for the developed 5-axis laser cutting machine.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.258-263
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• 2004

Mechanical property evaluation of micrometer-sized structures is necessary to help design reliable microelectromechanical systems(MEMS) devices. Most material properties are known to exhibit dependence on specimen size and such properties of microscale structures are not well characterized. This paper describes techniques developed for tensile testing of materials used in MEMS. Epi-polycrystalline silicon is currently the most widely used material, and its tensile strength has been measured as 1.52GPa. We have developed an uniaxial testing machine for testing microscale specimen using electro-magnetic actuator. The field magnet and the moving coil taken from an audio-speaker were utilized as the components of the actuator. Structure of specimen was designed and manufactured for easy handling and alignment. In addition to the static tensile tests, new techniques and procedures for measuring strength are described.

• Journal of Mechanical Science and Technology
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• v.18 no.8
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• pp.1349-1357
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• 2004

Computer-Aided Inspection Planning (CAIP) is the integration bridge between CAD/CAM and Computer Aided Inspection (CAI). A CAIP system for On-Machine Measurement (OMM) is proposed to inspect the complicated mechanical parts efficiently during machining or after machining. The inspection planning consists of Global Inspection Planning (GIP) and Local Inspection Planning (LIP). In the GIP, the system creates the optimal inspection sequence of the features in a part by analyzing the various feature information such as the relationship of the features, Probe Approach Directions (PAD), etc. Feature groups are formed for effective planning, and special feature groups are determined for sequencing. The integrated process and inspection plan is generated based on the sequences of the feature groups and the features in a feature group. A series of heuristic rules are developed to accomplish it. In the LIP of Part II, the system generates inspection parameters. The integrated inspection planning is able to determine optimum manufacturing sequence for inspection and machining processes. Finally, the results are simulated and analyzed to verify the effectiveness of the proposed CAIP.

• Journal of the Korean Society of Industry Convergence
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• v.10 no.4
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• pp.201-206
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• 2007

Most of the fatigue fractures of various machine structures start at discontinuities or small defects. In this study property of crack growth of titanium alloy was also analyzed to investigate the difference compared with the carbon steel. Titanium alloy has very high specific strength, and the material is widely utilized in advanced engineering fields such as aerospace, atomic energy and ocean development because of its excellence in corrosion and heat resistance. Generally the machine structures experience irregular loadings rather than periodic forces. The prediction of the fatigue life therefore has been analyzed to provide fundamentals of the design and estimation of the machine structures under irregular loading conditions.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.6
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• pp.15-22
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• 2002

• Journal of the Korean Society for Precision Engineering
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• v.19 no.10
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• pp.23-30
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• 2002

• Transactions of the Korean Society of Mechanical Engineers
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• v.13 no.1
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• pp.199-203
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• 1989

본 연구에서 제작된 시험기는 연구자 개인의 경제적 수준에서 충분이 제작이 가능한 것이다.