• 제목/요약/키워드: Measuring Time Reduction

검색결과 203건 처리시간 0.027초

Ar+H2 혼합(混合)가스에 의한 MoO3의 MoO2로의 환원거동(還元擧動) (Reduction Behavior of MoO3 to MoO2 by Ar+H2 Gas Mixture)

  • 손호상;이향준;박종일
    • 자원리싸이클링
    • /
    • 제20권4호
    • /
    • pp.71-77
    • /
    • 2011
  • $MoO_3$ 분말을 723 K ~ 873 K에서 Ar+$H_2$ 혼합기체를 이용히여 수평관상로에서 $MoO_2$로 훤원하였으며, 반용속도를 배가스 중의 상대습도를 측정하여 계산하였다. 반응속도는 수소가스 분압과 반응속도에 따라 현저하게 증가하였다. 환원 반응초기에 $H_2O$의 발생속도가 급격하게 증가하였으며, 시간의 경과에 따라 배가스 중의 $H_2O$ 분압은 급격하게 감소하였다. 이 시기에 환원 반응율은 직선적으로 증가하였다. 환원반응 초기의 $MoO_3$에서 $MoO_2$로의 환원반응의 활성화 에너지는 73.56 kJ/mol로 계산되었다.

포도상구균에 대한 키토산의 항균성 측정을 위한 실험조건의 적정화 (Optimization of Experimental Conditions for the Chitosan Antibacterial Activity Test against Staphylococcus aureus)

  • 한영숙
    • 대한가정학회지
    • /
    • 제42권3호
    • /
    • pp.145-158
    • /
    • 2004
  • Experimental conditions for evaluating chitosan antibacterial activities were established. The chitosan antibacterial activities were measured against the Staphylococcus aureus and evaluated for their application to antibacterial textile finishing. The strain of Staphylococcus aureus used in this experiments was KCTC 1916. The chitosan antibacterial activities were estimated from the bacterial densities or %reduction of bacteria in chitosan solutions and bacterial culture mixtures after incubation under specific conditions. Six parameters as follows were evaluated to optimize the experimental conditions for measuring antibacterial activities. The different combinations of mixtures according to the different ratios of chitosan solutions to the bacterial cultures showed different antibacterial activities. However, the chitosan antibacterial activities could be evaluated by comparing the data obtained from the same combinations of mixtures. The solvent influence on the chitosan solution antibacterial activities could be eliminated using control solution containing the same concentration of acetic acid. The initial pH of the chitosan -bacterial mixtures also affected the chitosan antibacterial activity; at a higher pH, higher activity in terms of %reduction of bacteria was observed. In case of the bacterial solution without either the acetic acid or chitosan, the initial pH of the solution did not significantly affect bacterial growth. The % reduction of bacteria increased when contact times of bacteria with chitosan in the chitosan -bacterial mixture were expended upto 24 hours. However, the chitosan antibacterial activities could be successfully evaluated at contact time 0 where the chitosan-bacterial mixture was plated immediately after mixing and incubated to measure the bacterial number to 24 hours. Evaluating %reduction of bacteria in the test mixtures after incubation were not changed when the inoculated bacterial concentrations were 2.3${\times}$10$\^$0/ml to 2.3${\times}$10$\^$6/ml. The optimal range of incubation time of the petri-Dish after plating the chitosan-bacterial mixture was 24 to 72 hours depending on the antibacterial activities of the test solutions.

경사밭 고랑 식생 및 PAM (Polyacrylamide) 멀칭에 따른 영농기 비점오염 저감효과 분석 (Reduction Efficiency Analysis of Furrow Vegetation and PAM (Polyacrylamide) Mulching for Non-Point Source Pollution Load from Sloped Upland During Farming Season)

  • 엽소진;김민경;안난희;최순군
    • 한국농공학회논문집
    • /
    • 제65권4호
    • /
    • pp.1-10
    • /
    • 2023
  • As a result of climate change, non-point source pollution (NPS) from farmland with the steep slope during the rainy season is expected to have a significant impact on the water system. This study aimed to evaluate the effect of furrow mulching using alfalfa and PAM (Polyacrylamide) materials for each rainfall event, while considering the load characteristics of NPS. The study was conducted in Wanju-gun, Jeollabuk-do, in 2022, with a testbed that had a slope of 13%, sandy loam soil, and maize crops. The testbed was composed of four plots: bare soil (Bare), No mulching (Cont.), Vegetation mulching (VM), and PAM mulching (PM). Runoff was collected from each rainfall event using a 1/40 sampler and the NPS load was calculated by measuring the concentrations of SS, T-N, T-P, and TOC. During farming season, the reduction efficiency of NPS load was 37.1~59.5% for VM and 38.2~75.7% for PM. The analysis found that VM had a linear regression correlation (R2=0.28~0.86, P-value=0.01~0.1) with elapsed time of application, while PM had a quadratic regression correlation (R2=0.35~0.80, P-value=0.1). These results suggest that the selection of furrow mulch materials and the appropriate application method play a crucial role in reducing non-point pollution in farmland. Therefore, further studies on the time-series reduction effect based on the application method are recommended to develop more effective preemptive reduction technologies.

NOVA System을 이용한 CMP Automation에 관한 연구 (The Study for the CMP Automation with Nova Measurement System)

  • 김상용;정헌상;박민우;김창일;장의구
    • 한국전기전자재료학회:학술대회논문집
    • /
    • 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
    • /
    • pp.176-180
    • /
    • 2001
  • There are several factors causing re-work in CMP process such as improper polish time calculation by operator. removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistancy. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfact Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

  • PDF

NOVA System을 이용한 CMP Automation에 관한 연구 (The Study for the CMP Automation wish Nova Measurement system)

  • 김상용;정헌상;박민우;김창일;장의구
    • 한국전기전자재료학회:학술대회논문집
    • /
    • 한국전기전자재료학회 2001년도 추계학술대회 논문집
    • /
    • pp.176-180
    • /
    • 2001
  • There are several factors causing re-work in CMP process such as improper polish time calculation by operator, removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistency. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfect Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

  • PDF

온도조건 비영향형 복합재생방식 DPF의 실차적용을 통한 대형디젤기관의 배출가스 특성 연구 (A Study on Exhaust Gas Characteristics of Heavy-duty Diesel Engines through Actual Vehicle Application of Non-influenced Temperature Condition Type Active Regeneration Method)

  • 이윤철;오상기
    • 한국분무공학회지
    • /
    • 제29권2호
    • /
    • pp.53-59
    • /
    • 2024
  • Cars are one of the main causes of air pollution in large cities, and 34.6% of domestic air pollution emissions come from mobile sources, of which cars account for 69.6%. In particular, the importance of nitrogen oxides (NOx) and particulate matter (PM), which are major pollutants in diesel vehicles, is increasing due to their high contribution to emissions. Therefore, in this study, the problem of natural regeneration caused by low exhaust gas temperature during low speed and low load operation was solved by applying a complex regeneration DPF that is not affected by temperature conditions to large diesel vehicles with higher driving time and engine displacement than small and medium-sized vehicles. And the feasibility of application to large diesel vehicles was reviewed by measuring the emission reduction efficiency. As a result of the reduction efficiency test on the actual vehicle durability product, PM showed a reduction efficiency of 84% to 86%, and the reduction efficiency of gaseous substances showed a high reduction efficiency of over 90%. The actual vehicle applicability test was completed with three driving patterns: village bus vehicle, police car, and road-going construction equipment vehicle, and no device problems occurred until the end of the test. Both load and no-load smoke measurement results showed a smoke reduction efficiency of over 96%.

측정데이터의 효율적 감소를 위한 De Iaunay 삼각형 분할의 적용 (Delaunay triangulation for efficient reduction of measured point data)

  • 허성민;김호찬;이석희
    • 한국정밀공학회:학술대회논문집
    • /
    • 한국정밀공학회 2001년도 춘계학술대회 논문집
    • /
    • pp.53-56
    • /
    • 2001
  • Reverse engineering has been widely used for the shape reconstruction of an object without CAD data and it includes some steps such as scanning of a clay or wood model, and generating some manufacturing data in an STL file. A new approach to remove point data with Delaunay triangulation is introduced to deal with the size problems of STL file and the difficulties in the operation of RP process. This approach can be used to reduce a number of measuring data from laser scanner within a specified tolerance, thus it can avoid the time for handing point data during modeling process and the time for verifying and slicing STL model during RP process. Developed software enables the user to specify the criteria for the selection of group of triangles either by the angle between triangles or the percentage of triangles reduced, and thus RP models with accuracy will be helpful to automated process.

  • PDF

모드해석과 관측기에 의한 볼스크류 온도분포의 실시간 예측 (Real-time estimation of Temperature Distribution of a Ball Screw System Using Modal Analysis and Observer)

  • 김태훈
    • 한국공작기계학회:학술대회논문집
    • /
    • 한국공작기계학회 2000년도 춘계학술대회논문집 - 한국공작기계학회
    • /
    • pp.635-640
    • /
    • 2000
  • Thermal deformation of machine tools can be evaluated from the analysis of the whole temperature field. However, it is extremely inefficient and impossible to acquire the whole temperature field by measuring temperatures of every point. So, a temperature estimator, which can estimate the whole temperature field from the temperatures of just a few points, is required. In this paper, 1-dimensional heat transfer problem is modeled with modal analysis and state space equations. and then state observer is designed to estimate the intensity of heat source and the whole temperature field in real-time. The reliability of this estimator is verified by making a comparison between solutions by the proposed method and the exact solutions of examples. The proposed method is applied to the estimation of temperature distribution in a ball screw system.

  • PDF

초기 재령에서 초음파 속도법을 활용한 보통 및 경량 골재 콘크리트의 강도 발현 평가 (Evaluation of Strength of Normal and Lightweight Aggregate Concrete Using Ultrasonic Velocity Method in Early Age)

  • 남영진;김원창;최형길;류정림;이태규
    • 한국건축시공학회:학술대회논문집
    • /
    • 한국건축시공학회 2023년도 봄 학술논문 발표대회
    • /
    • pp.55-56
    • /
    • 2023
  • Recently, large and high-rise buildings are increasing, and accordingly, concrete weight reduction is required. Lightweight aggregate concrete can provide economic feasibility and large space, but safety can be reduced due to problems such as low strength and poor durability. Since the development of such low strength of concrete is important in the early construction stage, it is necessary to evaluate the vertical formwork demolding period at the early age. The correlation was analyzed by measuring the compressive strength and ultrasonic pulse velocity. As a result, the ultrasonic pulse rates of normal and lightweight aggregate concrete at the time of 5 MPa expression, which is the time of vertical mold deformation, were 3.07 km/s and 2.77 km/s for W/B 41, and 2.89 km/s and 2.73 km/s for W/B 33.

  • PDF

3D 프린팅을 이용한 P LA+ 소재의 채움 패턴 및 밀도 변화에 따른 인장강도 연구 (A Study on Tensile Strength Dependent on Variation of Infill Pattern and Density of PLA+ Material Using 3D Printing)

  • 나두현;김현준
    • 소성∙가공
    • /
    • 제31권5호
    • /
    • pp.281-289
    • /
    • 2022
  • Presently, 3D printers manufactured by material extrusion are economical and easy to use, so they are being used in various fields. However, this study conducted a tensile test on the infill pattern and density of the PLA+ material, due to the limitations of long printing time as well as low mechanical strength. The infill area for the infill density change was measured, using a vision-measuring machine for four infill patterns (concentric, zigzag, honeycomb, and cross) in which the nozzle path was the same for each layer. The tensile strength/weight[MPa/g] and tensile strength/printing time[MPa/min] of the tensile specimens were analyzed. In this study, efficient infill density and patterns are suggested, for cost reduction and productivity improvement. Consequently, it was confirmed that the infill area and infill percentage of the four patterns, were not constant according to the infill pattern. And the tensile strength of the infill density 40% of the honeycomb pattern and infill density 20% of the cross pattern, tended to highly consider the weight and printing time. Honeycomb and cross patterns could reduce the weight of the tensile specimen by 19.11%, 28.07%, as well as the printing time by 29.56%, 52.25%. Tensile strength was high in the order of concentric, zigzag, honeycomb, and cross patterns, considering the weight and printing time.