• Journal of Biosystems Engineering
• /
• 제33권4호
• /
• pp.276-281
• /
• 2008

A flow injection analysis method (FIA), which analyzes sample conditions after injecting a sample and reagents into a continuous stream, are recognized as the most adequate analyzing method according to the increase of sampling frequency, the decrease of measuring time and the diversity of measuring targets. Specially, the FIA is considered to be used effectively for the control of a fermentation process to produce fermentation food and useful microbial production by activation of a fermentation industry for development of biological materials. In this study, a flow injection analysis sensor unit was developed for on-line monitoring of the fermentation process. The performance was verified by on-line measuring the concentration of glucose of the fermentation process of wine. The glucose concentrations of the samples were measured every 12 hours during the whole fermentation process and compared with those by a HPLC. The concentration relative errors of glucose on the fermentation process of wine showed below 30% within 72 hours and over 50% after the 72 hours. The sensor unit had potential to on-line monitoring of the fermentation process but some problems to overcome for an commercial application.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 1995년도 추계학술대회 논문집
• /
• pp.623-627
• /
• 1995

This paper deals with the process which automatically straightens the shaft whose straightness is over the tolerance. The developed straightening process is composed of the measuring module and the control module. In the measuring module, the deflection of each measuring point is automatically measured, and the press point and the reference press stroke is determined. In the control module, the springback is predicted by the observer using the calculated reference press stroke and on-line-measured force and deflection. Through a series of experiments, the validity of the proposed process was verified.

• 한국정밀공학회지
• /
• 제19권8호
• /
• pp.172-179
• /
• 2002

In this paper, an efficient reverse engineering method for free-formed surfaces is proposed based on the integration of a repetitive digitizing method and vision system. In recent reverse engineering process, the equi-interval digitization method is being used since the surface information is not known. If more accurate results are required, the number of measuring point should be increased appropriately. Thus, such measuring process tends to result in too dense data including useless information, and cause excessive measuring time. This problem can be improved by applying repetitive digitizing method and image process technique, which is proposed in this paper. The proposed methods are validated through appropriate simulation and experiments.

• 디지털산업정보학회논문지
• /
• 제15권4호
• /
• pp.63-70
• /
• 2019

The subject of the simultaneous measuring system of base pattern and deposition pattern is a new research topic on a defect inspection of OLED. In this paper, we propose a new OLED inspection method that simultaneously measures standard and deposition pattern images. This method reduces unnecessary processes and tac time during OLED inspection. For an additional reduction of the tac time during pattern measurement, the ROI was configured to measure only in the designated ROI area instead of measuring the entire area of an image. During the ROI set-up, the value of effective deposition pattern area is included so that if the deposition pattern is out of the ROI zone, it would be treated as a defect before measuring the size and center point of the pattern. As a result, the tac time and inspection process could be shortened. The proposed method also could be applied to the OLED manufacturing process. Production of OLED could be increased by reducing tac time and inspection process.

• 한국안전학회지
• /
• 제10권3호
• /
• pp.30-41
• /
• 1995

This paper proposed a simple method for measuring surface roughness of ground surface. Utilizing non-contact in-process measuring system using the diode laser. The measurement system is consisted of a laser unit with a diode laser and a cylindrical lens, a detecting unit with polygon mirror and CCD array sensor, and a signal processing unit with a computer and device. During operation, this measuring system can provide information on surface roughness in the measuring distance with a single sampling and simultaniously monitor the state of the grind wheel. The experimental results, showed that the Increase of the feed rate and the dressing speed an caused increase in the surface roughness and when the surface roughness is 4Rmax-10Rmax, the cutting speed is 1653m/min-1665m/min, the table speed is 0.2n1/min -0.9m/min, the dressing speed is 0.2mm/rev～0.4mm/rev, the stylus method and the in-process method can be obtained the same results. Thus, under limited working conditions, using the proposed system, the surface roughness of the ground surface during cylindrical grinding can be obtained through the in-process measurement method using the diode laser.

• 제어로봇시스템학회:학술대회논문집
• /
• 제어로봇시스템학회 2000년도 제15차 학술회의논문집
• /
• pp.184-184
• /
• 2000

The new-type measuring modules for unmanned remote supervisory system using mobile communication network have been designed in this study. Measuring modules consist of temperature measuring module, humidity measuring module and human body sensing module. And we will design a main part to collect and process informations of each modules, evaluate reliability of combined total system.

• 전기의세계
• /
• 제19권6호
• /
• pp.1-7
• /
• 1970

In this paper, to determine process dynamic characteristics, the correlation method for measuring the impulse response of process using a pseudo-random binary signal as the test signal instead of white noise was studied. The error caused by using the signal of Mesquence signal generator which was built up by the authors was analysed. Experments were performed on the 1st and 2nd order lag systems and the results were in good coincidence with theoretical values. It is expected that applying these results, it may be possible to develop a continuous measuring method adaptable to modern control systems.

• 한국지반공학회:학술대회논문집
• /
• 한국지반공학회 2008년도 춘계 학술발표회 초청강연 및 논문집
• /
• pp.1304-1312
• /
• 2008

In this study, the analysis to the preference level on slope measuring instrument of weight values on effect factors find out the reasonable monitoring on slope was performed, in which used AHP(Analytic Hierarchy Process) techniques. The results on professional group, such as the industry, academic, institute and government, analyzed that the very important effect factors, which were indicator of various collapse type, convenience of instrument management, The evaluation of preference level on the slope measuring instrument analyzed the invar wire extensometer which was high level at convenience of install, economical efficiency of install and convenience of instrument management.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2002년도 추계학술대회 논문집
• /
• pp.411-415
• /
• 2002

In this paper, a mechanical probe for CMM (Coordinate Measuring Machine) with a three-axis force-sensing unit is proposed, which is capable of measuring an actual contact position without the lobbing effect and the pre-travel error. The force-sensing unit detects the external force, which is act on the stylus of CMM during the measuring process. Thus, the contact point of the stylus of CMM can be estimated ken the direction of measured force components. Based on the structural analysis of the proposed CMM probe, the transformation matrix is derived and calibrated so that it shows linear relationships between the estimated force components from the output voltages and the real input forces. And, the relationships are verified through the computer simulation. The results show that the proposed mechanical probe is very useful fur detecting the contacting force components on measuring process of CMM.

• Journal of Mechanical Science and Technology
• /
• 제19권8호
• /
• pp.1576-1581
• /
• 2005

Generally, the optical components are fabricated by grinding, lapping, and polishing. And, those processes take long time to obtain such a high surface quality. Therefore, in the case of large optical component, the on-machine inspection (OMI) is essential. Because, the work piece is fragile and difficult to set up for fabricating and measuring. This paper is concerned about a swing-arm method for measuring surface profile of large optical concave mirror. The measuring accuracy and uncertainty for suggested method are studied. The experimental results show that this method is useful specially in lapping process with the accuracy of $3\~5\;{\mu}m$. Those inspection data are provided for correcting the residual figuring error in lapping or polishing processes.