• 제목/요약/키워드: Material Removal rate

검색결과 593건 처리시간 0.028초

면삭 밀링공정에서의 절삭조건의 적응 최적화 (Adaptive Cutting Parameter Optimization Applied to Face Milling Operations)

  • 고태조;조동우
    • 대한기계학회논문집
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    • 제19권3호
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    • pp.713-723
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    • 1995
  • In intelligent machine tools, a computer based control system, which can adapt the machining parameters in an optimal fashion based on sensor measurements of the machining process, should be incorporated. In this paper, the technology for adaptively optimizing the cutting conditions to maximize the material removal rate in face milling operations is proposed using the exterior penalty function method combined with multilayered neural networks. Two neural networks are introduced ; one for estimating tool were length, the other for mapping input and output relations from experimental data. Then, the optimization of cutting conditions is adaptively implemented using tool were information and predicted process output. The results are demonstrated with respect to each level of machining such as rough, fine and finish cutting.

습식 에칭에 의한 웨이퍼의 층간 절연막 가공 특성에 관한 연구 (A Study on a Wet etching of ILD (Interlayer Dielectric) Film Wafer)

  • 김도윤;김형재;정해도;이은상
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1997년도 추계학술대회 논문집
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    • pp.935-938
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    • 1997
  • Recently, the minimum line width shows a tendency to decrease and the multi-level increase in semiconductor. Therefore, a planarization technique is needed and chemical mechanical polishing(CMP) is considered as one of the most suitable process. CMP accomplishes a high polishing performance and a global planarization of high quality. But there are several defects in CMP such as micro-scratches, abrasive contaminations, and non-uniformity of polished wafer edges. Wet etching include of Spin-etching can improve he defects of CMP. It uses abrasive-free chemical solution instead of slurry. On this study, ILD(INterlayer-Dielectric) was removed by CMP and wet-etching methods in order to investigate the superiority of wet etching mechanism. In the thin film wafer, the results were evaluated at a viewpoint of material removal rate(MRR) and within wafer non-uniformity(WIWNU). And pattern step height was also compared for planarization characteristics of the patterned wafer.

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$WO_3$ 박막의 광역평탄화 특성 (Global planarization Characteristic of $WO_3$)

  • 이우선;고필주;최권우;김태완;서용진
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 춘계학술대회 논문집 반도체 재료 센서 박막재료 전자세라믹스
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    • pp.89-92
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    • 2004
  • Chemical mechanical polishing (CMP) process has been widely used to planarize dielectric layers, which can be applied to the integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of in the defect-free inter-level dielectrics (ILD). we investigated the performance of $WO_3$ CMP used silica slurry, ceria slurry, tungsten slurry. In this paper, the effects of addition oxidizer on the $WO_3$ CMP characteristics were investigated to obtain the higher removal rate and lower non-uniformity.

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첨가제에 따른 $SiO_2$ CMP 특성 ([ $SiO_2$ ] CMP Characteristic by Additive)

  • 이우선;고필주;최진우;신재욱;서용진
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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    • pp.378-381
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    • 2003
  • The chemical mechanical polishing (CMP) has been widely accepted for the global planarization of multi-layer structures in semiconductor manufacturing However, cost of ownership (COO) and cost of consumables (COC) were relatively increased because of expensive slurry. In this paper, the effects of different slurry composition on the oxide CMP characteristics were investigated to obtain the higher removal rate and lower non-uniformity. We prepared the various kinds of slurry. In order to save the costs of slurry, the original slurry was diluted by de-ionized water (DIW). And then, alunima abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry.

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전기전도성 이방성 복합재료 방전가공의 수치모사 (Numerical Simulation of the Electro-discharge Machining Process of a Conductive Anisotropic Composite)

  • 안영철;천갑재
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2002년도 추계학술대회 논문집
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    • pp.709-712
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    • 2002
  • For the electro-discharge machining of an electro-conductive anisotropic composite, an unsteady state formulation was established and solved by Galerkin's finite element method. The distribution of temperature on work piece, the shape of the crater and the material removal rate were obtained in terms of the process parameters. As the spark was initiated the workpiece immediately started to melt and the heat affected zone was formed. The moving boundary of the crater was also identified with time. When the radial and axial conductivities were increased separately the temperature distribution and the shape of the crater were shifted in the same direction respectively and the material removal rate was found to be higher in the case of increasing radial conductivity rather than the axial conductivity.

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Abrasive Waterjet 세라믹 Drilling가공시 Acoustic Emission 신호를 이용한 On-Line Monitoring에 대한 연구 (On-Line Monitoring of Abrasive Water Jet Drilling of Refractory Ceramics Using Acoustic Emission Sensing Technique)

  • Kwak, Hyo-Sung;Rodovan Kovacevic
    • 한국정밀공학회지
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    • 제15권6호
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    • pp.48-57
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    • 1998
  • Abrasive waterjet(AWJ)은 가공시 열에 의한 가공경화가 없기 때문에 유리, 세라믹, 타이타늄및 금속복합재료와 같은 난삭재의 가공기술로 사용이 증가되었다. Acoustic emission(AE)신호에 의한 AWJ 세라믹 drilling가공시 On-Line Monitoring의 가능성이 고찰되었다. 기계 적인 물성이 서로 상이한 3종류의 세라믹이 본 연구에서 사용되었으며, AE신호는 AWJ drilling의 깊이를 monitoring하는데 유용함을 알 수 있었고 또한 세라믹의 material removal mechanisms을 규명하였다.

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도전성 탄화티타늄 이차상을 포함하는 산화알루니늄기 세라믹 복합체의 방전가공 (Electrical Discharge Machining of Alumina Ceramic Matrix Composites Containing Electro-conductive Titanium Carbide as a Second Phase)

  • 윤존도;왕덕현;안영철;고철호
    • 한국세라믹학회지
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    • 제34권10호
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    • pp.1092-1098
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    • 1997
  • Electrical discharge machining (EDM) was attempted on a ceramic matrix composite containing non-conductive alumina as a matrix and conductive titania as a second phase, and was found successful. As the current or duty factor increased, the material removal rate (MRR) increased and the surface roughness also increased. The EDMed surface was covered with a number of craters of a circular shape having 100-200 microns of diameter. The melting and evaporation was suggested for the EDM mechanism. The bending strength decreased 44% after EDM, but the Weibull modulus increased more than twice. Combination of EDM and barre이 polishing resulted in the maintenance of the bending strength level. Temperature distribution near a spark in the sample was computer-simulated by use of finite element method, and was found to have similar shape to the one which the observed craters have.

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산화제 첨가에 따른 $WO_3$ 박막의 CMP 특성 (Characteristic of Addition Oxidizer on the $WO_3$ Thin Film CMP)

  • 이우선;고필주;최권우;김태완;최창주;오금곤;서용진
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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    • pp.313-316
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    • 2004
  • Chemical mechanical polishing(CMP) process has been widely used to planarize dielectric layers, which can be applied to the integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of in the defect-free inter-level dielectrics(ILD). we investigated the performance of $WO_3$ CMP used silica slurry, ceria slurry, tungsten slurry In this paper, the effects of addition oxidizer on the $WO_3$ CMP characteristics were investigated to obtain the higher removal rate and lower non-uniformity.

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$WO_3$ CMP의 광역평탄화 특성 (Global planarization Characteristic of $WO_3$ CMP)

  • 이우선;고필주;최권우;이영식;서용진
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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    • pp.188-191
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    • 2003
  • Chemical mechanical polishing (CMP) process has been widely used to planarize dielectric layers, which can be applied to the integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of in the defect-free inter-level dielectrics (ILD). we investigated the performance of $WO_3$ CMP used silica slurry, ceria slurry, tungsten slurry. In this paper, the effects of addition oxidizer on the $WO_3$ CMP characteristics were investigated to obtain the higher removal rate and lower non-uniformity.

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적응모델링과 유전알고리듬을 이용한 절삭공정의 최적화(II) - 절삭실험 - (Optimization of Machining Process Using an Adaptive Modeling and Genetic Algorithms(ll) - Cutting Experiment-)

  • 고태조;김희술;안병욱
    • 한국정밀공학회지
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    • 제13권11호
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    • pp.82-91
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    • 1996
  • In this study, we put our object to carry out adaptive modeling of cutting process in turning system, and to find out the optimal cutting conditions to maximize material removal rate under some constraints. We used a back-propagation neural network to model the cutting process adaptively and a genetic algorithm to find out optimal cutting conditions. The experimental results show that a back-propagation neural network could model the cutting process effciently, and optimized cutting conditions for maximizing the material removal rate were obtained through the adaptive process model and genetic algorithms. Therefore, the proposed approach can be applied to the real machining system.

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