• Title/Summary/Keyword: Matching Module

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A Traffic Pattern Matching Hardware for a Contents Security System (콘텐츠 보안 시스템용 트래픽 패턴 매칭 하드웨어)

  • Choi, Young;Hong, Eun-Kyung;Kim, Tae-Wan;Paek, Seung-Tae;Choi, Il-Hoon;Oh, Hyeong-Cheol
    • Journal of the Institute of Electronics Engineers of Korea CI
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    • v.46 no.1
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    • pp.88-95
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    • 2009
  • This paper presents a traffic pattern matching hardware that can be used in high performance network applications. The presented hardware is designed for a contents security system which is to block various kinds of information drain or intrusion activities. The hardware consists of two parts: the header lookup and string pattern matching parts. For implementing the header lookup part in hardware, the TCAMs(ternary CAMs) are popularly used. Since the TCAM approach is inefficient in terms of the hardware and memory costs and the power consumption, however, we adopt and modify an alternative approach based on the comparator arrays and the HiCuts tree. Our implementation results, using Xilinx FPGA XC4VSX55, show that our design can reduce the usage of the FPGA slices by about 26%, and the Block RAM by about 58%. In the design of string pattern matching part, we design and use a hashing module based on cellular automata, which is hardware efficient and consumes less power by adaptively changing its configuration to reduce the collision rates.

A New Image Quality Optimization System for Mobile TFT-LCD (모바일 TFT-LCD를 위한 새로운 화질 최적화 시스템)

  • Ryu, Jee-Youl;Noh, Seok-Ho
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2008.05a
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    • pp.734-737
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    • 2008
  • This paper presents a new automatic TFT-LCD image quality optimization system. We also have developed new algorithms using 6-point programmable matching technique with reference gamma curve, and automatic power setting sequence. It optimizes automatically gamma adjustment and power setting registers in mobile TFT-LCD driver IC to reduce gamma correction error, adjusting time, and flicker. Developed algorithms and programs are generally applicable for most of the TFT-LCD modules. The proposed optimization system contains module-under-test (MUT, TFT-LCD module), control program, multimedia display tester for measuring luminance and flicker, and control board for interface between PC and TFT-LCD module. The control board is designed with DSP, and it supports various interfaces such as RGB and CPU. Developed automatic image quality optimization system showed significantly reduced gamma adjusting time, reduced flicker, and much less average gamma error than competing system. We believe that the proposed system is very useful to provide high image quality TFT-LCD and to reduce developing process time using optimized gamma-curve setting and automatic power setting.

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Automatic Focus Control for Assembly Alignment in a Lens Module Process (렌즈 모듈 생산 공정에서 조립 정렬을 위한 자동 초점 제어)

  • Kim, Hyung-Tae;Kang, Sung-Bok;Kang, Heui-Seok;Cho, Young-Joon;Park, Nam-Gue;Kim, Jin-Oh
    • Journal of the Korean Society for Precision Engineering
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    • v.27 no.2
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    • pp.70-77
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    • 2010
  • This study proposed an auto focusing method for a multi-focus image in assembling lens modules in digital camera phones. A camera module in a camera phone is composed of a lens barrel, an IR glass, a lens mount, a PCB board and aspheric lenses. Alignment among the components is one of the important factors in product quality. Auto-focus is essential to adjust image quality of an IR glass in a lens holder, but there are two focal points in the captured image due to thickness of IR glass. So, sharpness, probability and a scale factor are defined to find desired focus from a multi-focus image. The sharpness is defined as clarity of an image. Probability and a scale factors are calculated using pattern matching with a registered image. The presented algorithm was applied to a lens assembly machine which has 5 axes, two vacuum chucks and an inspection system. The desired focus can be determined on the local maximum of the sharpness, the probability and the scale factor in the experiment.

Design of a GaN HEMT 4 W Miniaturized Power Amplifier Module for WiMAX Band (WiMAX 대역 GaN HEMT 4 W 소형 전력증폭기 모듈 설계)

  • Jeong, Hae-Chang;Oh, Hyun-Seok;Heo, Yun-Seong;Yeom, Kyung-Whan;Kim, Kyoung-Min
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.22 no.2
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    • pp.162-172
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    • 2011
  • In this paper, a design and fabrication of 4 W power amplifier for the WiMAX frequency band(2.3~2.7 GHz) are presented. The adopted active device is a commercially available GaN HEMT chip of Triquint Company, which is recently released. The optimum input and output impedances are extracted for power amplifier design using a specially self-designed tuning jig. Using the adopted impedances value, class-F power amplifier was designed based on EM simulation. For integration and matching in the small package module, spiral inductors and interdigital capacitors are used. The fabricated power amplifier with $4.4{\times}4.4\;mm^2$ shows the efficiency above 50 % and harmonic suppression above 40 dBc for second(2nd) and third(3rd) harmonic at the output power of 36 dBm.

Millimeter-wave LTCC Front-end Module for Highly Integrated Transceiver (고집적 송수신기를 위한 밀리미터파 LTCC Front-end 모듈)

  • Kim, Bong-Su;Byun, Woo-Jin;Kim, Kwang-Seon;Eun, Ki-Chan;Song, Myung-Sun
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.17 no.10 s.113
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    • pp.967-975
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    • 2006
  • In this paper, design and implementation of a very compact and cost effective front-end module are presented for IEEE 802.16 FWA(fixed Wireless Access) in the 40 GHz band. A multi-layer LTCC(Low Temperature Co-fred Ceramic) technology with cavity process to achieve excellent electrical performances is used to fabricate the front-end module. The wirebond matching circuit design of switch input/output port and waveguide transition to connect antenna are optimally designed to keep transmission loss low. To reduce the size of the front-end module, the dielectric waveguide filter is developed instead of the metal waveguide filter. The LTCC is composed of 6 layers(with the thickness of a layer of 100 um) having a relative dielectric constant of 7.1. The front-end module is implemented in a volume of $30{\times}7{\times}0.8mm^3$ and shows an overall insertion loss < 5.3 dB, and image rejection value > 49 dB.

A Study on the Design and Implementation of a Thermal Imaging Temperature Screening System for Monitoring the Risk of Infectious Diseases in Enclosed Indoor Spaces (밀폐공간 내 감염병 위험도 모니터링을 위한 열화상 온도 스크리닝 시스템 설계 및 구현에 대한 연구)

  • Jae-Young, Jung;You-Jin, Kim
    • KIPS Transactions on Computer and Communication Systems
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    • v.12 no.2
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    • pp.85-92
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    • 2023
  • Respiratory infections such as COVID-19 mainly occur within enclosed spaces. The presence or absence of abnormal symptoms of respiratory infectious diseases is judged through initial symptoms such as fever, cough, sneezing and difficulty breathing, and constant monitoring of these early symptoms is required. In this paper, image matching correction was performed for the RGB camera module and the thermal imaging camera module, and the temperature of the thermal imaging camera module for the measurement environment was calibrated using a blackbody. To detection the target recommended by the standard, a deep learning-based object recognition algorithm and the inner canthus recognition model were developed, and the model accuracy was derived by applying a dataset of 100 experimenters. Also, the error according to the measured distance was corrected through the object distance measurement using the Lidar module and the linear regression correction module. To measure the performance of the proposed model, an experimental environment consisting of a motor stage, an infrared thermography temperature screening system and a blackbody was established, and the error accuracy within 0.28℃ was shown as a result of temperature measurement according to a variable distance between 1m and 3.5 m.

A study on the design of LNA for Ku-band LNB module (Ku-band에서의 LNB 모듈을 위한 LNA 설계에 관한 연구)

  • Kwak, Yong-Soo;Chung, Tae-Kyung;Kim, Hyeong-Seok
    • Proceedings of the KIEE Conference
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    • 2004.07c
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    • pp.2034-2036
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    • 2004
  • In this paper, a low noise amplifier (LNA) in receiver of Low Noise Block Down Converter (LNB) for direct broadcasting service (DBS) is implemented by using GaAs HEMT. The LNA is designed for operation between 10.7GHz-12.7GHz. The LNA consists of input, output matching circuits, DC-blocks and RF-chokes. Simulation result of the LNA shows that a noise figure is less than 1.4dB and a gain is greater than 9.2dB in the bandwidth of 10.7 to 12.7GHz with good flatness of 0.1dB.

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Thermal Characteristics of a Laser Diode Integrated on a Silica-Terraced PLC Platform

  • Kim, Duk-Jun;Han, Young-Tak;Park, Yoon-Jung;Park, Sang-Ho;Shin, Jang-Uk;Sung, Hee-Kyung
    • ETRI Journal
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    • v.27 no.3
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    • pp.337-340
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    • 2005
  • A spot-size converted Fabry-Perot laser diode (LD) was flip-chip bonded to a silica-terraced planar lightwave circuit(PLC) platform to examine the effect of the silica terrace on the heat dissipation of the LD module. From the measurement of the light-current characteristics, it was discovered that the silica terrace itself is not a strong thermal barrier, but the encapsulation of the integrated LD with an index-matching polymer resin more or less deteriorates the heat dissipation.

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Ultra-small Form-Factor Helix on Pad-Type Stage-Bypass WCDMA Tx Power Amplifier Using a Chip-Stacking Technique and a Multilayer Substrate

  • Yoo, Chang-Hyun;Kim, Jung-Hyun
    • ETRI Journal
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    • v.32 no.2
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    • pp.327-329
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    • 2010
  • A fully integrated small form-factor HBT power amplifier (PA) was developed for UMTS Tx applications. For practical use, the PA was implemented with a well configured bottom dimension, and a CMOS control IC was added to enable/disable the HBT PA. By using helix-on-pad integrated passive device output matching, a chip-stacking technique in the assembly of the CMOS IC, and embedding of the bulky inductive lines in a multilayer substrate, the module size was greatly reduced to 2 mm ${\times}$ 2.2 mm. A stage-bypass technique was used to enhance the efficiency of the PA. The PA showed a low idle current of about 20 mA and a PAE of about15% at an output power of 16 dBm, while showing good linearity over the entire operating power range.

Simulation of Solar Cell Maximum Power Point Using Matlab (Matlab을 이용한 솔라셀의 최대전력점 시뮬레이션)

  • Lee K.Y.;Kim H.S.;Park J.M.;Cho G.B.;Baek H.L.;Hanyeong College D.H. Kim
    • Proceedings of the KIPE Conference
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    • 2003.07a
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    • pp.204-207
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    • 2003
  • PV model is presented based on the shockley diode equation. The simple model has a photo-current source, an single diode junction and a series resistance and includes temperature dependences. An accurate PV module electrical model is presented, matching with boost converter MPPT strategy and demonstrated in Matlab for a typical general purpose solar cell. Given solar insolation and temperature, the model returns current vector and MPP.

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