• Korean Journal of Materials Research
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• v.5 no.6
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• pp.754-762
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• 1995

Strontium titanate(SrTiO$_3$) thin film was prepared on Si substrates by RF magnetron sputtering for a high capacitance density required for the next generation of LSTs. The optimum deposition conditions for SrTiO$_3$thin film were investigated by controlling the deposition parameters. The crystallinity of films and the interface reactions between SrTO$_3$film and Si substrate were characterized by XRD and AES respectively. High quality films were obtained by using the mixed gas of Ar and $O_2$for sputtering. The films were deposited at various bias voltages to obtain the optimum conditions for a high quality file. The best crystallinity was obtained at film thickness of 300nm with the sputtering gas of Ar+20% $O_2$and the bias voltage of 100V. The barrier layer of Pt(100nm)/Ti(50nm) was very effective in avoiding the formation of SiO$_2$layer at the interface between SrTiO$_3$film and Si substrate. The capacitor with Au/SrTiO$_3$/Pt/Ti/SiO$_2$/Si structure was prepared to measure the electric and the dielectric properties. The highest capacitance and the lowest leakage current density were obtained by annealing at $600^{\circ}C$ for 2hrs. The typical specific capacitance was 6.4fF/$\textrm{cm}^2$, the relative dielectric constant was 217, and the leakage current density was about 2.0$\times$10$^{-8}$ A/$\textrm{cm}^2$ at the SrTiO$_3$film with the thickness of 300nm.

• Journal of the Korean Society of Radiology
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• v.4 no.1
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• pp.5-9
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• 2010

In recent, a digital x-ray detector attracted worldwide attention and there are many studies to commercialize. There are two methods in digital x-ray detector. This method is an Indirect method and Direct method. This study is to see the differences between the digital x-ray detector based on a-Se used in the existing indirect conversion method and an x-ray conversion material that has better SNR(Signal-to-noise ratio) and property than the a-Se. To solve the problem that is difficult to make a large area film using Screen-Print method, we used a Screen-Print method. In this study, we used a polyclystal $HgI_2$ as x-ray conversion material and a sample thickness is $150{\mu}m$ and an area is $3cm{\times}3cm$. ITO(Indium-Tin-Oxide) electrode was used as top electrode using a Magnetron Sputtering System and each area is $3cm{\times}3cm$, $2cm{\times}2cm$ and $1cm{\times}1cm$ and then we evaluated darkcurrent, sensitivity and SNR of the $HgI_2$ film are measured, then we evaluated the electrical properties. And we used a current integration mode when I-V test. This experiment shows that the sensitivity increases in accordance with the area of the electrode but the SNR is decreased because of the high darkcurrent. Through fabricating of various thicknesses and optimal electrodes, we will optimize SNR in the future work.

• Journal of the Korean Magnetics Society
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• v.6 no.3
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• pp.151-157
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• 1996

Magnetic properties and microstructures of FeTaNC thin films, which were deposited by magnetron reactive sputtering rrethod, were investigated as a function of $CH_{4}$ and $N_{2}$ gas partial pressures. Magnetic properties of FeTaNC films depended on total reactive gas pressure as well as $CH_{4}/N_{2}$ pressure ratios. For reactive gas partial pressures of 5~10 %, optimum magnetic properties were observed in the FeTaNC films with proper $CH_{4}/N_{2}$ ratio. On the other hand, at 15% of gas partial pressure, FeTaN and FeTaC films showed superior properties to FeTaNC films. Above 15%, the magnetic properties of films rapidly degraded due to an excess incorporation of C and/or N atoms. Excellent soft magnetic properties of 17 kG of Bs, 0.3 Oe of He, and 4000 of $\mu'$(at 5 MHz) were obtained in the FeTaNC films. High permeabilities of FeTaNC films could be explained by the Fe lattice distortion caused by N atoms, hence reduction of magnetic anisotopy. While precipitated TaN and TaC particles effectively supress the growth of $\alpha-Fe$ grains leading to a good soft magentic properties, FeN and FeC phases such as $Fe_3N$, $Fe_4N$, FexC have detrimental effects.

• Journal of the Korean Magnetics Society
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• v.12 no.6
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• pp.212-217
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• 2002

The pseudo spin valve with a structure of Tl/CoFe(t $\AA$)/Cu(30 $\AA$)/NiFe(50 $\AA$)/Ta, showing giant magnetoresistance properties by utilizing coercivity difference between only two soft ferromagnetic layers were produced by d.c UHV magnetron sputtering system. In pseudo spin valve Ta/CoFe/Cu/NiFe/Ta, the magnetic and magnetoresistance properties with change of CoFe thickness were investigated. When the thickness of CoFe was 60 $\AA$, a typical MR curve of pseudo spin valve structure was obtained, showing MR ratio of 3.8 cio and the coercivity difference of 27.4 Oe with a sharp change of hard layer switching. When the CoFe thickness was varied from 20 to 100 $\AA$, coercivity difference between two layers was increased to 40 $\AA$. and decreased to 100 $\AA$ gradually. It is thought the change in coercivity of hard layer was due to the crystallinity and magnetostriction of thin CoFe layer. In order to improve the MR property in CoFe/Cu/NiFe trier layer structure, CoFe layer with change of 2-20 $\AA$ thick was inserted between Cu and NiFe. When the thickness of CoFe was 10 $\AA$, MR ratio was 6.7％, showing excellent MR property. This indicates 50 ％ higher than that of CoFe/Cu/NiFe pseudo spin valve.

• Journal of the Korean Magnetics Society
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• v.11 no.6
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• pp.272-277
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• 2001

A spin valve structure of Ta/NiFe/CoFe/Cu/CoFe/Ru/CoFe/FeMn/Ta which has a synthetic antiferromagnet (CoFe/Ru/CoFe), was fabricated by using a magnetron sputtering system. The thickness and composition of magnetic free and pinned layers affect the magnetic properties such as exchange interaction strength of each layer and so on. Even though Rutherford Backscattering Spectrometry (RBS) has advantages of quantitative and non-destructive analysis, it is almost impossible to determine the thickness and composition of magnetic thin films using lBS because of its poor mass resolution for a higher atom number (Z>20). In this study, quantitative analysis of the element composition and thickness for the spin valve sample was performed by combining both Proton Induced X-ray Emission Spectrometry (PIXE), which is one of element specific analysis techniques, and grazing-exit RBS with a highly improved depth resolution and absolute quantitative analysis. For the quantitative analysis, standardization of PIXE was carried out with NiFe, CoFe, and FeMn layers, which are one of constituent layers of spin valve films. Through PIXE standardization and the aid of PHE experimental results of the spin valve sample, ire overlapped signal in a grazing-exit RBS spectrum were successfully resolved and the thickness of the Ru layer was determined with a resolution of ∼1 .

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.251-252
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• 2012

Recently, the growing interest in organic microelectronic devices including OLEDs has led to an increasing amount of research into their many potential applications in the area of flexible electronic devices based on plastic substrates. However, these organic devices require a gas barrier coating to prevent the permeation of water and oxygen because organic materials are highly susceptible to water and oxygen. In particular, high efficiency OLEDs require an extremely low Water Vapor Transition Rate (WVTR) of $1{\times}10^{-6}g/m^2$/day. The Key factor in high quality inorganic gas barrier formation for achieving the very low WVTR required ($1{\times}10^{-6}g/m^2$/day) is the suppression of defect sites and gas diffusion pathways between grain boundaries. In this study, we developed an $Al_2O_3$ nano-crystal structure single gas barrier layer using a Neutral Beam Assisted Sputtering (NBAS) process. The NBAS system is based on the conventional RF magnetron sputtering and neutral beam source. The neutral beam source consists of an electron cyclotron Resonance (ECR) plasma source and metal reflector. The Ar+ ions in the ECR plasma are accelerated in the plasma sheath between the plasma and reflector, which are then neutralized by Auger neutralization. The neutral beam energies were possible to estimate indirectly through previous experiments and binary collision model. The accelerating potential is the sum of the plasma potential and reflector bias. In previous experiments, while adjusting the reflector bias, changes in the plasma density and the plasma potential were not observed. The neutral beam energy is controlled by the metal reflector bias. The NBAS process can continuously change crystalline structures from an amorphous phase to nano-crystal phase of various grain sizes within a single inorganic thin film. These NBAS process effects can lead to the formation of a nano-crystal structure barrier layer which effectively limits gas diffusion through the pathways between grain boundaries. Our results verify the nano-crystal structure of the NBAS processed $Al_2O_3$ single gas barrier layer through dielectric constant measurement, break down field measurement, and TEM analysis. Finally, the WVTR of $Al_2O_3$ nano-crystal structure single gas barrier layer was measured to be under $5{\times}10^{-6}g/m^2$/day therefore we can confirm that NBAS processed $Al_2O_3$ nano-crystal structure single gas barrier layer is suitable for OLED application.

• Korean Journal of Materials Research
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• v.22 no.4
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• pp.180-184
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• 2012

Nanostructures of ZnO, such as nanowires, nanorods, nanorings, and nanobelts have been actively studied and applied in electronic or optical devices owing to the increased surface to volume ratio and quantum confinement that they provide. ZnO seed layer (about 40 nm thick) was deposited on Si(100) substrate by RF magnetron sputtering with power of 60 W for 5 min. ZnO nanorods were grown on ZnO seed layer/Si(100) substrate at $95^{\circ}C$ for 5 hr by hydrothermal method with concentrations of $Zn(NO_3)_2{\cdot}6H_2O$ [ZNH] and $(CH_2)_6N_4$ [HMT] precursors ranging from 0.02M to 0.1M. We observed the microstructure, crystal structure, and photoluminescence of the nanorods. The ZnO nanorods grew with hexahedron shape to the c-axis at (002), and increased their diameter and length with the increase of precursor concentration. In 0.06 M and 0.08 M precursors, the mean aspect ratio values of ZnO nanorods were 6.8 and 6.5; also, ZnO nanorods had good crystal quality. Near band edge emission (NBE) and a deep level emission (DLE) were observed in all ZnO nanorod samples. The highest peak of NBE and the lower DLE appeared in 0.06 M precursor; however, the highest peak of DLE and the lower peak of NBE appeared in the 0.02 M precursor. It is possible to explain these phenomena as results of the better crystal quality and homogeneous shape of the nanorods in the precursor solution of 0.06 M, and as resulting from the bed crystal quality and the formation of Zn vacancies in the nanorods due to the lack of $Zn^{++}$ in the 0.02 M precursor.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.5-5
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• 2009

Thin-film-transistors (TFTs) that can be prepared at low temperatures have attracted much attention because of the great potential for transparent and flexible electronics. One of the mainstreams in this field is the use of organic semiconductors such as pentacene. But device performance of the organic TFTs is still limited due to low field-effect mobility and rapid degradation after exposing to air. Alternative approach is the use of amorphous oxide semiconductors as a channel. Amorphous oxide semiconductors (AOSs) based TFTs showed the fast technological development, because AOS films can be fabricated at room temperature and exhibit the possibility in application like flexible display, electronic paper, and larges solar cells. Among the various AOSs, a-IGZO has lots of advantages because it has high channel mobility, uniform surface roughness and good transparency. [1] The high mobility is attributed to the overlap of spherical s-orbital of the heavy post-transition metal cations. This study demonstrated the effect of the variation in channel thickness from 30nm to 200nm on the TFT device performance. When the thickness was increased, turn-on voltage and subthreshold swing was decreased. The a-IGZO channels and source/drain metals were deposited with shadow mask. The a-IGZO channel layer was deposited on $SiO_2$/p-Si substrates by RF magnetron sputtering, where RF power is 150W. And working pressure is 3m Torr, at $O_2/Ar$ (2/28 sccm) atmosphere. The electrodes were formed with electron-beam evaporated Ti (30 nm) and Au (70 nm) bilayer. Finally, Al (150nm) as a gate metal was thermal-evaporated. TFT devices were heat-treated in a furnace at 250 $^{\circ}C$ and nitrogen atmosphere for 1hour. The electrical properties of the TFTs were measured using a probe-station. The TFT with channel thickness of 150nm exhibits a good subthreshold swing (SS) of 0.72 V/decade and on-off ratio of $1{\times}10^8$. The field effect mobility and threshold voltage were evaluated as 7.2 and 8 V, respectively.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.265-266
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• 2012

의료용 X-ray의 발전에 따라, 영상의 Digital화가 필요하게 되었다. Digital 영상 구현을 위해 다양한 형태의 영상 검출기가 개발되었다. 진단 영상의 조건으로는 구현 시간이 빠르고 해상도가 높아야 한다. 조건에 부합하는 Flat panel 형태의 직접방식과 간접방식 검출기의 개발이 주로 이루어졌으며, X-ray 검출 효율이 높고 공간 분해능이 높은 직접 방식의 검출기에 대한 연구가 활발히 진행되고 있다. 기존 직접방식의 X-ray 검출물질로는 A-Se이 이용되었다. 하지만 A-Se의 경우 낮은 원자번호로 인해 X-ray에 대한효율이 낮으며, 제조 공정과 수율의 문제로 인해 대체 물질의 개발과 공정의 개선이 필요하다. 선행 연구를 통해 X-ray 검출물질의 전기적 특성을 파악을 통해 대체 물질로서 가능성을 알아보았다. 본 연구에서는 기존에 제작된 X-ray 검출물질의 상부전극 증착 물질과 증착법 선정에 대한 연구이다. 선행 연구를 통해 선정된 X-ray 검출물질은 HgI2이다. 상, 하부 전극 선택에 있어 HgI2의 일함수 값(4.15eV)을 고려하여 그와 비슷한 일함수 값을 가진 물질로 전기적 장벽을 제거하여야 한다. 따라서, ITO (일함수 4.45eV)와 Au (일함수 5.1eV)을 선택하였다. ITO의 증착으로 이용된 방법으로는 on-axis 형태의 magnetron plasma sputtering을 이용하였으며, Au의 증착으로 이용된 방법은 Thermal evaporation deposition을 이용하였다. plasma sputtering에 이용된 타겟은 In2O3;SnO2 (조성비:90:10wt%)를 사용하였으며, Chamber의 크기는 넓이 456 ${\phi}cm^2$ 높이 25 cm이며, 로 target과 기판과의 거리는 15cm이다. plasma발생에 필요한 가스로는 Ar과 O2를 이용하였다. 고 진공 환경 조성에 이용된 장비로는 Rotary pump와 Turbo molecular pump이다. plasma 발생 전 진공도는 $3.2{\times}10^{-5}$ Torr, 발생 후 진공도는 $5.1{\times}10^{-5}$ Torr이다. plasma 환경이 조성된 후 증착 시간은 1분 30초이다. Au는 순도 99.999%를 이용하였으며, 이용된 금은 1회 증착에 0.3 g을 이용하였다. Chamber의 넓이 1,444 ${\phi}cm^2$이며, 높이 40 cm, boat와 기판과의 거리는 25 cm이다. 고 진공 환경 조성에 이용된 장비로는 Rotary pump와 diffusion pump를 이용하였다. Au의 승화 전 진공도는 $2.4{\times}10^{-5}$ Torr 증착 시 진공도는 $4.2{\times}10^{-5}$ Torr이며, Boat에 가해준 전압, 전류는 0.97 V, 47 A이며, 증착 시간은 1분 30초이다. 광도전체 층에 각각 증착된 전극의 저항을 통해 증착상태를 판단하였다. DMM (Digital Multimeter)로 1 cm 간격으로 측정된 표면의 저항은 ITO 약 $8{\Omega}$, Au 약 $3{\Omega}$으로 전극으로서 이용이 가능한 상태이다. Au와 ITO가 증착된 HgI2 시편의 전기적 특성은 기존에 이용된 X-ray 변환물질의 성능보다 우수하였다. 하지만 Au와 ITO가 각각 증착된 시편의 전기적 특성은 큰 차이를 보이지 않았다. ITO의 경우 진공 상태에서 이용되는 Gas가 이용되며, Plasma 환경 조성 유지가 어려운 점이 있다. Au전극은 증착 환경 조성이 쉽지만, 전극 물질 이용효율이 떨어지는 단점이 있다. 본 연구를 통해 X-ray 변환물질인 HgI2의 전극물질로 Au와 ITO의 이용가능성을 알아보았다. 두 전극으로 제작된 검출기의 성능은 큰 차이 없이 우수하였고, 전기적 장벽 상태가 낮아 높은 검출 효율을 보였다. 상대적으로 Au 전극의 공정이 간단하고 수율이 높다. 하지만 Au Source의 이용 효율이 떨어지는 단점이 있다. 본 연구의 결과를 통해 공정상의 유리함과 Source의 이용효율을 고려한 분석에 대한 연구가 필요할 것으로 사료된다.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.77-77
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• 2016

Thin films synthesized by plasma processes have been widely applied in a variety of industrial sectors. The structure control of thin film is one of prime factor in most of these applications. It is well known that the structure of this film is closely associated with plasma parameters and species of plasma which are electrons, ions, radical and neutrals in plasma processes. However the precise control of structure by plasma process is still limited due to inherent complexity, reproducibility and control problems in practical implementation of plasma processing. Therefore the study on the fundamental physical properties that govern the plasmas becomes more crucial for molecular scale control of film structure and corresponding properties for new generation nano scale film materials development and application. The thin films are formed through nucleation and growth stages during thin film depostion. Such stages involve adsorption, surface diffusion, chemical binding and other atomic processes at surfaces. This requires identification, determination and quantification of the surface activity of the species in the plasma. Specifically, the ions and neutrals have kinetic energies ranging from ~ thermal up to tens of eV, which are generated by electron impact of the polyatomic precursor, gas phase reaction, and interactions with the substrate and reactor walls. The present work highlights these aspects for the controlled and low-temperature plasma enhanced chemical vapour disposition (PECVD) of Si-based films like crystalline Si (c-Si), Si-quantum dot, and sputtered crystalline C by the design and control of radicals, plasmas and the deposition energy. Additionally, there is growing demand on the low-temperature deposition process with low hydrogen content by PECVD. The deposition temperature can be reduced significantly by utilizing alternative plasma concepts to lower the reaction activation energy. Evolution in this area continues and has recently produced solutions by increasing the plasma excitation frequency from radio frequency to ultra high frequency (UHF) and in the range of microwave. In this sense, the necessity of dedicated experimental studies, diagnostics and computer modelling of process plasmas to quantify the effect of the unique chemistry and structure of the growing film by radical and plasma control is realized. Different low-temperature PECVD processes using RF, UHF, and RF/UHF hybrid plasmas along with magnetron sputtering plasmas are investigated using numerous diagnostics and film analysis tools. The broad outlook of this work also outlines some of the 'Grand Scientific Challenges' to which significant contributions from plasma nanoscience-related research can be foreseen.