• 한국정밀공학회지
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• 제16권8호
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• pp.9-15
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• 1999

Die-sinking electrical discharge machining(EDM) for conductive ceramic matrix composite(CMC) of Tic/$Al_2O_3$ was experienced with addition of ultrasonic emission, and the results were compared with ones obtained by the EDM only. From this experimental study, the values of material removal rate(MRR) and surface roughness($R_{max}$), scanning electron microscope(SEM) micrographs, and weibull probability distribution of bending strength for the specimens were obtained and compared. The trend of MRR was found to be increased slightly with the current and the duty factor for both EDM only and EDM with ultrasonic emission. The MRR values were found to be increased for EDM with ultrasonic emission. The SEM micrographs of EDMed surface by under various operating conditions showed less micro cracks in various places. Although smaller bending strength value was obtained by EDMed surface with ultrasonic emission by weibull probability distribution analysis of bending strength.

• 소성∙가공
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• 제13권3호
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• pp.225-229
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• 2004

Chemical Mechanical Polishing(CMP) process becomes one of the most important semiconductor processes. But the basic mechanism of CMP still does not established. Slurry fluid dynamics that there is a slurry film between a wafer and a pad and contact mechanics that a wafer and a pad contact directly are the two main studies for CMP. This paper based on the latter one, especially on the abrasion wear model. Material Removal Rate(MRR) is calculated using the trajectory length of every point on a wafer during the process time. Both the rotational velocity of a wafer and a pad and the wafer oscillation velocity which has omitted in other studies are considered. For the purpose of the verification of our simulation, we used the experimental results of S.H.Li et al. The simulation results show that the tendency of the calculated MRR using the relative velocity is very similar to the experimental results and that the oscillation effect on MRR at a real CMP condition is lower than 1.5%, which is higher than the relative velocity effect of wafer, and that the velocity factor. not the velocity itself, should be taken into consideration in the CMP wear model.

• 한국정밀공학회지
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• 제14권5호
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• pp.53-59
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• 1997

This study has been performed to inmvestigate MRR(metal removal rate), REW(relative electrode wear), surface roughness, heat transumutation layer and microhardness distribution in cross-section of the machined surface with various pulse-on duration and peak pulse current, using the copper and graphite electrode on the heat treated STD11 which is extensively used for metallic molding steel with the EDM. The results obtained are as follows; a) There exists critical pulse-on duration(If Ip equals 5A, .tau. on is 50 .mu. s) which shows the the maximum MRR in accordance with peak oulse current and the MRR decreases when the pulse-on duration exceeds the critical pulse-on during because of the abnormal electric discharge. b) Safe discharge is needed to make maximum of MRR and the metalic organization must be complicated for discharge induction. c) Graphite has much more benefits than copper electrode when rapid machining is done without electrode wear. d) The most external surface has the highest microhardness because of car- burizing from heat analysis of the dielectric fluid and the lower layar of the white covered layer has lower microhar dness than base matal because of softening.

• Tribology and Lubricants
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• 제30권3호
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• pp.139-145
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• 2014

Nowadays, most micro-patterns are manufactured during flow line production. However, a conventional rotary chemical mechanical polishing (CMP) system has a limited throughput for the fabrication of large and flexible electronics. To overcome this problem, we propose a novel linear roll-CMP system for the planarization of large-area electronics. In this paper, we present a statistical analysis on the linear roll-CMP process of copper-clad laminate (CCL) to determine the impacts of process parameters on the material removal rate (MRR) and its non-uniformity (NU). In the linear roll-CMP process, process parameters such as the slurry flow rate, roll speed, table feed rate, and down force affect the MRR and NU. To determine the polishing characteristics of roll-CMP, we use Taguchi's orthogonal array L16 (44) for the experimental design and F-values obtained by the analysis of variance (ANOVA). We investigate the signal-to-noise (S/N) ratio to identify the prominent control parameters. The "higher is better" for the MRR and "lower is better" for the NU were selected for obtaining optimum CMP performance characteristics. The experimental and statistical results indicate that the down force and roll speed mainly affect the MRR and the down force and table feed rate determine the NU in the linear roll-CMP process. However, over 186.3 N of down force deteriorates the NU because of the bending of substrate. Roll speed has little relationship to the NU and the table feed rate does not impact on the MRR. This study provides information on the design parameter of roll-CMP machine and process optimization.

• 대한핵의학회지
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• 제29권1호
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• pp.61-72
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• 1995

The author performed radionuclide esophageal transit studies(RETS) with liquid and solid boluses using the same day protocol in 90 normal controls and 164 patients with various primary esophageal motility disorders who were diagnosed by manometric criteria and clinical courses. The authors calculated mean esophageal transit time(MTT) and mean residual retention(MRR) in each of the liquid and solid studies, and classified time-activity curve(TAC) patterns. The normal criteria of RETS with liquid bolus were MTT<24 sec, MRR<9%, and the TAC pattern that showed rapid declining slope and flat low residual(Type 1). The normal criteria of RETS with solid bolus were MTT<35 sec, MRR<9% and TAC of type 1. With these normal criteria, the sensitivity and the specificity of the liquid study were 62.2 % and 97.8%, respectively. The sensitivity increased to 75.4% with the solid study. The author also found that the RETS was highly reproducible. The achalasia typically showed no effective emptying of both liquid and solid boluses during the whole study period, and was well differentiated by its extremely long transit time and high retention from the other motility disorders. The diffuse esophageal spasm (DES) and nonspecific esophageal motility disorder(NEMD) showed intermediate delay in transit time and increased retention. In the groups of hypertensive lower esophageal sphincter(LES), hypotensive LES and nutcracker, there noted no significant difference with the normal control group in terms of MTT and MRR. The DES and NEMD could be more easily identified by solid studies that showed more marked delay in MTT and increased MRR as compared with the liquid study. In conclusion, esophageal scintigraphy is a safe, noninvasive and physiologic method for the evaluation of esophageal emptying.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 춘계학술대회 논문집
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• pp.3-7
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• 1996

Metal Matrix Composite(MMC) material of 30% SiC particulate based on A1 matrix was machined by drilling and Electrical Discharge Machining (EDM) processes. When drilling process was executed, surface fracture due to brittle property near the bottom was found. It was also found the possiblity of difficult shape of EDM process for MMC material, but few the research about basic EDM characteristics. Material Removal Rate(MRR) was examined for different conditions and the surface morphology was evaluated by roughness values and Scanning Electron Microscopy(SEM) research. The higher the current is, the more MRR was obtained but the higher MRR was showed around 0.45 duty factor. The average roughness of EDMed surface was slightly changed with increased pulse current and increases with duty factor. The SEM photographs of EDMed surface showed recast region after melting.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1996년도 추계학술대회 논문
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• pp.52-57
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• 1996

Conductive Ceramic Matrix Composite(CMC) of TIC/Al2O3 and Metal Matrix Composite (MMC) of SiC/Al were experienced by the die sinking Electrical Discharge Machining(EDM) for different current and duty factor according to negative polarity. Inthis experimental study Material Removal Rate(MRR) maximum surface roughness four point bending stress distribution and Scanning Electron Microscopy(SEM) Photographs were analysed. the higher MRR was obtained for CMC than MMC but slowly decreased around duty factor of 0.67 for MMC and better surface morphology was found CMC than MMC. The SEM photographs of discharge traces for CMC showe uniform shape about 100 to 200${\mu}{\textrm}{m}$ in diameter but MMC showed irregular shape.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2000년도 춘계학술대회논문집 - 한국공작기계학회
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• pp.473-477
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• 2000

The experimental study of die-sinking electrical discharge machining(EDM) was conducted for Cold Die Alloy Steel of SKD-11 with rotary electrode according to the peak current of 11A, 15A and 19A, and the duty factor of 0.24, 0.45. dielectric fluid flow through the electrode inside according to the change of electrode internal diameter during the EDM working. Material removal rate(MRR) was increased with flushing & rotation of electrode at the condition for the peak current of 15A, 19a but the MRR is decreased at the flushing only. The more surface roughness was obtained for the case of the flushing & rotation under the peak current of 19A.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 추계학술대회 논문집
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• pp.46-50
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• 1996

Die sinking Electrical Discharge Machining(EDM) of TiC/Al$_2$O$_3$Ceramic Matrix Composite(CMC) was conducted for positive and negative polarity according to the change of current and Duty Factor(DF). Also FEM analysis about temperature distribution of workpiece by one spark was executed. Maximum surface roughness( R$_{max}$ ) and SEM photographs of the EDMed surface for different conditions were evaluated. Higher Material Removal Rate(MRR) was obtained for negative polarity than positive one. Better surface morphology was found as the current is decreased, but the MRR was also decreased. From the SEM photographs, the size of melt cavity due to one spark is about 100 to 150${\mu}{\textrm}{m}$ in diameterer

• 한국정밀공학회지
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• 제20권12호
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• pp.183-190
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• 2003

In this paper, investigated are the machining characteristics such as material removal rate and machining time with respect to discharge area and capacitance in micro electrical discharge machining (MEDM). As discharge area determined by the electrode size and capacitance change, the optimal feedrate to allow the minimum machining time changes. The smaller discharge area is, the lower MRR becomes because of the area effect. As the capacitance increases, MRR also increases. However there is the limit capacitance beyond which the MRR does not increase anymore. As the discharge area increases, the limit capacitance also increases.