• 한국전기화학회:학술대회논문집
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• 2001.10a
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• pp.38-38
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• 2001

• Proceedings of the Korean Vacuum Society Conference
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• 1994.06a
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• pp.160-161
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• 1994

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.377-377
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• 2012

Microprocessor technology now relies on copper for most of its electrical interconnections. Because of the high diffusivity of copper, Atomic layer deposition (ALD) $TaN_x$ is used as a diffusion barrier to prevent copper diffusion into the Si or $SiO_2$. Another problem with copper is that it has weak adhesion to most materials. Strong adhesion to copper is an essential characteristic for the new barrier layer because copper films prepared by electroplating peel off easily in the damascene process. Thus adhesion-enhancing layer of cobalt is placed between the $TaN_x$ and the copper. Because, cobalt has strong adhesion to the copper layer and possible seedless electro-plating of copper. Until now, metal film has generally been deposited by physical vapor deposition. However, one draw-back of this method is poor step coverage in applications of ultralarge-scale integration metallization technology. Metal organic chemical vapor deposition (MOCVD) is a good approach to address this problem. In addition, the MOCVD method has several advantages, such as conformal coverage, uniform deposition over large substrate areas and less substrate damage. For this reasons, cobalt films have been studied using MOCVD and various metal-organic precursors. In this study, we used $C_{12}H_{10}O_6(Co)_2$ (dicobalt hexacarbonyl tert-butylacetylene, CCTBA) as a cobalt precursor because of its high vapor pressure and volatility, a liquid state and its excellent thermal stability under normal conditions. Furthermore, the cobalt film was also deposited at various $H_2/NH_3$ gas ratio(1, 1:1,2,6,8) producing pure cobalt thin films with excellent conformality. Compared to MOCVD cobalt using $H_2$ gas as a reactant, the cobalt thin film deposited by MOCVD using $H_2$ with $NH_3$ showed a low roughness, a low resistivity, and a low carbon impurity. It was found that Co/$TaN_x$ film can achieve a low resistivity of $90{\mu}{\Omega}-cm$, a low root-mean-square roughness of 0.97 nm at a growth temperature of $150^{\circ}C$ and a low carbon impurity of 4~6% carbon concentration.

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.42.4-42
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• 1998

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.8
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• pp.24-30
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• 1998

A blue LED of $In_{x}Ga_{1-x}N$ multiple quantum well structure which had the blue emission spectrum of donor-acceptor pair transition generated form Si-Zn co-doped $In_{x}Ga_{1-x}N$ active layer, was fabricated. The $In_{x}Ga_{1-x}N$ MQW heterojunction LED structure was grown by MOCVD on the sapphire substrate with (0001) surface orientation at 800.deg. C. The fabricated LED exhibited forward cut-in voltage of 4~4.5V and reverse breakdown voltage of -13V. Its optical chracteristics showed that the center wavelength of peak emission occurred at 460nm and the optical intensity was increased linearly with respect to the injected electrical current above 5mA.

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.76.4-76
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• 1998

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.13 no.6
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• pp.272-278
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• 2003

$Bi_4Ti_3O_{12}$ (BIT) and $(Bi_{3.25}La_{0.75})(Ti_{2.97}V_{0.03})O_{12}$ (BLTV) thin films were deposited on ITO/glass substrates by metal organic chemical vapor deposition (MOCVD) using ultrasonic spraying. After deposition of the films in oxygen atmosphere for 30 min, the films were heated by rapid thermal annealing (RTA) method, especially direct insertion, at various temperatures. The films were investigated on phase formation temperature, microstructure and electrical properties. From x-ray diffraction (XRD) patterns, the perovskite phase formation temperature of BLTV thin film was about $600^{\circ}C$ which was lower than that of BIT, $650^{\circ}C$. The leakage current of the BLTV thin film was measured to be $1.52\times 10^{-9}$A/$cm^2$ at an applied voltage of 1 V. The remanent polarization (Pr) and coercive field (Ec) values of the BLTV film deposited at $650^{\circ}C$ were $5.6\muC/cm^2$ and 96.5 kV/cm, respectively.

• Resources Recycling
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• v.24 no.4
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• pp.50-55
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• 2015

In this study, we have investigated solvent extraction of Ga and recovery of high pure Ga solution from MOCVD dust for manufacturing of LED chip. Effect of extractan, concentration of extractant were examined for choosing the more effective extractant and high pure Ga solution was fabricated by multi-stage extraction/stripping process. For extraction/separation of Ga based on the analysis of raw-material in previous study, 3 different extractants PC 99A, DP-8R, Cyanex 272 has been investigated and the extraction efficiency of 1.5 M Cyanex 272 was 43.8%. It was conformed that extraction efficiency of Ga was 83% in multi-stage extraction and 5N high purity Ga stripping solution without impurities also obtained.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2000.11a
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• pp.22-22
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• 2000

DRAM의 고접적화에 따라 기존의 반도체 공정에서 사용중인 여러 가지 기술들이 대부분 그 한계를 보이고 었으며, 대표적인 것이 캐퍼시터 형성기술이다. 따라서 1G DRAM급 이상의 초고집적 회로를 실용화하기 위해서 유전율이 높은 BST ($BrSrTiO_3$) 박막을 이용하여 캐패시터를 제조하려는 기술도 반드시 해결되어야 현재 활발히 실용화 연구가 진행중에 있다. BST 박막을 제조하는 방법은 RF magnetron sputtering, Ion beam reactive co-evaporation, LSM (Liquid Source Misted) CVD, MOCVD 등의 법으로 제조되고 있다. 본 연구에서는 전기-수력 학적 분무(Electro-Hydrodynamic Spray)현상을 이용한 MOCVD에 BaO, SrO, $TiO_2$ 박막을 증착 하여 전기장세기, 기판온도, 시간 등에 따른 특성을 조사하였다. 전기수력학적 분무를 이용한 증착법은 원료를 함유하는 용액을 이용함으로써 이송관의 가열이 필요 없이 장치를 간단하게 할 수 있고, 용액의 유량과 전기장의 세기에 따라 초미세 입자제어도 가능하며, 박막의 조성을 출발 용액으로 부터 조절하는 등의 특징을 가지고 있다. 증착한 박막의 표면, 단면 형상 및 조성을 분석하였고 결정화 여부 및 우선 배향성을 조사하였다. 현재는 개별 박막의 표현 형상과 조성에 대한 연구 결과를 얻었으며, 계속해서 박 막의 여러 특성에 대하 연구할 계획이다.

• Resources Recycling
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• v.24 no.5
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• pp.80-86
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• 2015

The separation of In from the synthesis solution with Ga, Fe, and Al has been studied by the solvent extraction using D2EHPA as an extractant. The effects as a function of the concentration of extractant and HCl on the extraction of In were investigated. The extraction of In and Ga increased with decreasing HCl concentration, but that of Fe and Al was independent. Separation factor between In and Ga of 115 was obtained at 1.0 M D2EHPA in the presence of 0.5 M HCl of feed solution. Consequently, this study shows that D2EHPA is suitable extractant for In extraction from the synthesis solution. Extraction efficiency and separation factor could be increased by controlling HCl and extractant concentration.