• Title/Summary/Keyword: MMX$^{}$ TM/

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인텔 $MMX^TM$ 기술고찰

  • 김경효
    • The Magazine of the IEIE
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    • v.23 no.7
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    • pp.27-36
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    • 1996
  • MMX 기술은 멀티미디어 및 통신 애플리케이션을 좀더 강력하게 실행할 수 있도록 해준다. MMX 기술은 데이터를 병렬로 처리할 수 있도록 해주는 새로운 데이터 형태와 명령을 추가한 새로운 프로세서 아키텍춰이다. MMX기술은 기존 운영체계 및 애플리케이션과 완벽하게 호환된다. MMX 기술은 PC 플랫폼에 새로운 향상을 가져와 새로운 애플리케이션과 PC의 새로운 활용을 가능케 해준다. 또한 PC를 통신 및 멀티미디어 기기로 자리매김할 수 있도록 하는 업계의 새로운 파라다임을 설정할 것이다. MMX 기술을 채용한 프로세서가 장착된 시스템은 인텔이 MMX기술을 장착한 여러세대의 프로세서를 발표하는 1997년부터 대량으로 사용될 전망이다.

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2-D/3-D Combined Algorithm for Automatic Solder Paste Inspection (솔더 페이스트 자동검사를 위한 2-D/3-D 복합 알고리즘)

  • 조상현;이상윤;임쌍근;최흥문
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.05a
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    • pp.173-176
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    • 2002
  • In this paper, we present the combined 2-D and 3-D algorithms for automatic solder paste inspection. For automatic inspection, optical system for the combined inspection and driving unit is made. One-pass run length algorithm that has fast and efficient memory space is applied to the input image fur extracting solder paste patterns. The path of probe movement is then calculated for an automatic inspection. For a fast 3-D inspection, the phase shift algorithm based on Moire interferometry is also used. In addition, algorithms used in this paper are coded by $MMX^{TM}$. A probe system is manufactured to simultaneously inspect 2-D and 3-D for 10mm$\times$10mm field of view, with resolutions of 10 $\mu\textrm{m}$for both x, y axis and 17 $\mu\textrm{m}$for z axis, and then, experiments on several PCBs are conducted. The processing times of 2-D and 3-D, excluding an image capturing, is 0.039 sec and 0.047 sec, respectively. The credible result with $\pm$ 1$\mu\textrm{m}$uncertainty can be also achieved.

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Implementation of a H.26X Software Encoding Speed up Research (H.26X 인코딩 속도향상 구현)

  • Lee, Seung-Hyeon;Kang, Eui-Sun;Kang, Seock-Chan;Yoon, Sung-Kyu;Lim, Young-Hwan
    • Proceedings of the Korea Information Processing Society Conference
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    • 2000.04a
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    • pp.1148-1152
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    • 2000
  • 본 논문에서는 기존의 H.26X 부호화 시의 속도 저하의 원인인 움직임 추정의 높은 복잡도를 개선하여 소프트웨어만으로 실시간 부호화를 하는 방법을 모색하고자 한다. 논문에서는 스탠포드 대학에서 작성한 소프트웨어 부호기를 분석하여 속도를 높이기 위한 해결 방법으로 두 가지 방법으로 접근하였다. 첫째로 부호기의 속도 저하의 원인인 움직임 추정의 시간을 줄이기 위하여 현재 많이 사용되고 있는 4단계 탐색 알고리즘을 개선한 새로운 알고리즘을 제안하였다. 둘째로 현재 작성된 코드를 인텔사에서 제공하는 ${MMX^{TM}}$ 명령어를 사용, 병렬처리 하여 속도 향상을 꾀하였다.

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A Study on a Compensation of Decoded Video Quality and an Enhancement of Encoding Speed

  • Sir, Jaechul;Yoon, Sungkyu;Lim, Younghwan
    • Journal of the Korea Computer Graphics Society
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    • v.6 no.3
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    • pp.35-40
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    • 2000
  • There are two problems in H.26X compression technique. One is compressing time in encoding process and the other is degradation of the decoded video quality due to high compression rate. For transferring moving pictures in real-time, it is required to adopt massively high compression. In this case, there are a lot of losses of an original video data and that results in degradation of quality. Especially degradation called by blocking artifact may be produced. The blocking artifact effect is produced by DCT-based coding techniques because they operate without considering correlation between pixels in block boundaries. So it represents discontinuity between adjacent blocks. This paper describes methods of quality compensation for H.26x decoded data and enhancing encoding speed for real-time operation. Our goal of the quality compensation is not to make the decoded video identical to a original video but to make it perceived better through human eyes. We suggest an algorithm that reduces block artifact and clears decoded video in decoder. To enhance encoding speed, we adopt new four-step search algorithm. As shown in the experimental result, the quality compensation provides better video quality because of reducing blocking artifact. And then new four-step search algorithm with $MMX^{TM}$ implementation improves encoding speed from 2.5 fps to 17 fps.

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STUDY ON THE INTERFACE BETWEEN LIGHT-CURED GLASS IONOMER BASE AND INDIRECT COMPOSITE RESIN INLAY AND DENTIN (기저재용 광중합형 글래스아이오노머의 치질 및 복합 레진 인레이에 대한 접착양상)

  • Lee, Song-Hee;Kim, Dong-Jun;Hwang, Yun-Chan;Oh, Won-Mann;Hwang, In-Nam
    • Restorative Dentistry and Endodontics
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    • v.30 no.3
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    • pp.158-169
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    • 2005
  • This study was done to evaluate the shear bond strength between light-cured glass ionomer cement (GIC) base and resin cement for luting indirect resin inlay and to observe bonding aspects which is produced at the interface between them by SEM. Two types of light cured GIC (Fuji II LC Improved, GC Co. Tokyo, Japan and Vitrebond$^{TM}$, 3M, Paul Minnesota U.S.A) were used in this study. For shear bond test, GIC specimens were made and immersed in 37$^{\circ}C$ distilled water for 1 hour, 24 hours, 1 week and 2 weeks. Eighty resin inlays were prepared with Artglass$^{(R)}$ (Heraeus Kultzer Germany) and luted with Variolink$^{(R)}$ II (Ivoclar Vivadent, Liechtenstein). Shear bond strength of each specimen was measured and fractured surface were examined. Statistical analysis was done with one-way ANOVA. Twenty four extracted human third molars were selected and Class II cavities were prepared and GIC based at axiopulpal lineangle. The specimens were immersed in 37$^{\circ}C$ distilled water for 1 hour, 24 hours, 1 week and 2 weeks. And then the resin inlays were luted to prepared teeth. The specimens were sectioned vertically with low speed saw. The bonding aspect of the specimens were observed by SEM (JSM-5400$^{(R)}$, Jeol, Tokyo, Japan) .There was no significant difference between the shear bond strength according to storage periods of light cured GIC base. And cohesive failure was mostly appeared in GIC On scanning electron micrograph, about 30 - 120 $\mu$m of the gaps were observed on the interface between GIC base and dentin. No gaps were observed on the interface between GTC and resin inlay.