• Proceedings of the KIEE Conference
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• 1998.07d
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• pp.1419-1421
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• 1998

Many kind of factors have influence on the electrical properties of polymer such as mechanical stress, impurity, additives, chemical blend, interfacial phenomena and so on. In this study, we lay emphasis on interfacial phenomena which is important part in insulating design of power cable. The electrical conduction characteristics of XLPE film are investigated as a function of different electrode materials in MIM Interfaces.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.8
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• pp.557-562
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• 1999

Electrical conduction characteristics of XLPE film evaporated with different metal electrode are discussed. The relation between electrical current(I) and Voltage(V) in the M(metal)-I(XLPE)-M(metal) structure are measured in the temperature range from 25$[^{\circ}C]$ to 90[$[^{\circ}C]$ . Several kinds of metals are used as electrode, such as, Al, Ag and Cu.From the experimental results, it is conclused that the conduction mechanism at highelectric field is SCLC. The dependences of temperature and kinds of metal on the trap filled electric field level can be well explained by this theory.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.16 no.7 s.98
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• pp.760-767
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• 2005

In this paper, we proposed a new type SIR bandpass filter using DAMLs. This filter is consisted of 2 layers with MEMS resonator layer and CPW feed line. DAMLs ring resonator is elevated with $10{\mu}m$ height from GaAs substrate. Using MEMS processing, we are able to realize SIR bandpass filter easily. Furthermore it is useful to integrate on conventional MMICs because it has CPW interfaces and ring resonator is isolated from substrate by air-gap. We optimized and measured the results that $S_{21}$ attenuation at rejected band is over 15 dB, insertion loss is inside the limit of 3 dB, and relative bandwidth is about $10\%$ at 60 GHz.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.4 no.4
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• pp.378-387
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• 1994

To improve the properties of $PbTiO_3$ thin films successfully grown by thermal diffusion of 3 component layers of $Ti0_2/Pb/TiO_2(900{\AA}/900{\AA}/900{\AA})$ in preceding research, 3, 5, 7, 9, and 11 multilayer structures $(TiO_2/Pb/.../Tio_2)$ with thinner component layer of $200~300 {\AA}$ thick were deposited on Si substrate by RF sputtering, which were followed by RTA to form $PbTiO_3$ thin films. As a result, $PbTiO_3$ single phase was formed above $500^{\circ}C$. When the thickness of component layer reduced and the number of component layers increased, suppression of Pb-silicate and voids formation resulted in relatively sharp interfaces and the film composition became more homogeneous. Relative dielectric constants in MIM structure were independent of the annealing condition, but they increased with increasing thickness of the $PbTiO_3$ thin films. The maximum breakdown field in MIS structure reached 150kV/cm.