• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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• pp.809-812
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• 2002

This paper presents the structures for a CPW shunt RF switch using MEMS(Micro Electro Mechanical System). Recent development in MEMS technology has made the design and fabrication of micro-mechanical switches as new switching elements. The micro-mechanical switches have low insertion loss, negligible power consumption, and good isolation compared to semiconductor switches. The fabricated structure shows an insertion loss of 2dB at 20GHz When a bias voltages of 12V is apply.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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• pp.372-375
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• 2003

MCA deflection control is a important technology for the development of MEMS applications. In this study, deflection analysis at the MLA/Si diaphragm was investigated by Finite Element Method. Analysis of Si diaphragm combined with MCA has been implemented into the ANSYS (Solid5 and Solid45). On the basis of this structure, deflection versus MCA number of layers has been modelled and MCA/Si contact area characteristics with different diaphragm conditions were analyzed. Consequently, it is expected that fabrication technology of MCA/Si diaphragm could be usefully applied for the fabrication process of high-performance piezoelectric MEMS devices.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2001년도 추계 학술발표강연 및 논문개요집
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• pp.97-97
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• 2001

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집D
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• pp.31-36
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• 2001

As a part of micro engine development feasibility estimation was done through fabrication and test of down scaled combustor and MEMS fabricated spark electrode. In an experimental observation of the down scaled combustion phenomena where flame propagation was observed by optical method and pressure change in combustor which gives the information about the reaction generated thermal energy was recorded and analyzed. Optimal combustor scale was derived to be about 2mm considering increased heat loss effect and thermal energy generation capability. Through the fabrication and discharge test of MEMS electrode effects of electrode width and gap was investigated. Electrode was fabricated by thick PR mold and electroplating. From the result discharge voltage characteristic in sub millimeter scale electrode having thickness of $40{\mu}m$ was obtained. From the result base technology for design and fabrication of micro engine was obtained.

• 소성∙가공
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• 제11권2호
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• pp.108-113
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• 2002

The application fields of medicine and biology are spotlighted because of the increasing concentration of health and the abundance of life. MEMS is very good solution in this fields for the concept of point of care which makes systems more useful and spread wide. This paper shows the major fabrication schemes and application fields of microelectromechanical system specially in medicine and biology fields.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2002년도 ICCAS
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• pp.39.1-39
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• 2002

We present nanoactuators and nanodetectors for high-precision Micro Electro Mechanical System (MEMS) applications. Major technical difficulties in the high-precision MEMS are arising from the fabrication uncertainty and electrical noise problems. In this paper, we present high-precision actuators and detectors, overcoming the technical limitations placed by the conventional MEMS technology. For the nano-precision actuation, we present a nonlinearly modulated digital actuator (NMDA). NMDA composed of a digital microactuator and a nonlinear micromechanical modulator. The nonlinear micromechanical modulator is intended to purify the actuation errors in the stroke of the digital a...

• 마이크로전자및패키징학회지
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• 제24권4호
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• pp.9-17
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• 2017

In these days, MEMS (micro-electro-mechanical system) devices become the crucial sensor components in mobile devices, automobiles and several electronic consumer products. For MEMS devices, the packaging determines the performance, reliability, long-term stability and the total cost of the MEMS devices. Therefore, the packaging technology becomes a key issue for successful commercialization of MEMS devices. As the IoT and wearable devices are emerged as a future technology, the importance of the MEMS sensor keeps increasing. However, MEMS devices should meet several requirements such as ultra-miniaturization, low-power, low-cost as well as high performances and reliability. To meet those requirements, several innovative technologies are under development such as integration of MEMS and IC chip, TSV(through-silicon-via) technology and CMOS compatible MEMS fabrication. It is clear that MEMS packaging will be key technology in future MEMS. In this paper, we reviewed the recent development trends of the MEMS packaging. In particular, we discussed and reviewed the recent technology trends of the MEMS bonding technology, such as low temperature bonding, eutectic bonding and thermo-compression bonding.

• 한국정밀공학회지
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• 제21권10호
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• pp.188-195
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• 2004

In this paper, we fabricated fluidic devices like micro-channel, pump, mixer and particular gas separator with the technology of stereolithouaphy using RP(rapid-prototyping). The fabricated fluidic devices are expected to be applied to develop Lab-on-a chip type liquid analyzer. Stereolithography technology seems effective for fabricating MEMS(Micro Electro Mechanical System) with complicated structure because it makes three dimensional fabrication possible but, exclusive devices are needed to be developed fur fabricating even more microscopic MEMS structure.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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• pp.994-996
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• 2002

We present a novel fabrication method for a V-grooved mold of the light guide plat of TFT-LCD with MEMS technology. This method is performed by the inclined UV lithography and Ni electroplating unlike the previous mechanical processing technique. V-grooves with different dimension can be made simultaneously with single photomask.

• 한국전기전자재료학회논문지
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• 제20권9호
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• pp.749-755
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• 2007

Recently, novel MEMS probe cards can support reliable wafer level chip test with high density probing capacity. However, manufacturing cost and process complexity are crucial weak points for low cost mass production. To overcome these limitations, we have developed micro spring structured MEMS probe card. For fabrication of micro spring module, a wire bonder and electrolytic polished gold wires are used. In this case, stringent tension force control is essential to guarantee the low level contact resistance of micro spring for reliable probing performance. For this, relation between tension force of fabricated probe card and contact resistance is characterized. Compare to conventional probe cards, developed MEMS probe card requires fewer fabrication steps and it can be manufactured with lower cost than other MEMS probe cards. Also, due to the small contact scratch patterns, we expect that it can be applied to bumping types chip test which require higher probing density.