• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.2
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• pp.93-100
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• 2009

This paper presents a step up four channel DC-DC converter using charge pump voltage doubler structure. Our goal is to design and implement DC-DC converter for capacitive SP4T RF MEMS switch in front end module in wireless transceiver system. Charge pump structure is small and consume low power 3.3V input voltage is boosted by DC-DC Converter to $11.3{\pm}0.1V$, $12.4{\pm}0.1V$, $14.1{\pm}0.2V$ output voltage With 10MHz switching frequency. By using voltage level shifter structure, output of DC-DC converter is selected by 3.3V four channel selection signals and transferred to capacitive MEMS devices. External passive devices are not used for driving DC-DC converter. The total chip area is $2.8{\times}2.1mm^2$ including pads and the power consumption is 7.52mW, 7.82mW, 8.61mW.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1988-1991
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• 2005

A micro fluid actuator driven by electromagnetic force at MEMS(Micro Electro Mechanical System) level has been designed. The operation of the actuator was simulated in three steps. First, fluid flow analysis has been performed to determine the actuator load. With the load, dynamic behavior of the actuator structure has been analysed. Finally, fluid-structure interaction analysis has been performed to predict the performance of the actuator. To avoid excessive amount of computation, axisymmetric and plane strain 2-D models were used.

• Transactions on Electrical and Electronic Materials
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• v.18 no.1
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• pp.25-29
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• 2017

This paper presents a unique pressure sensor design for environmental applications. The design uses a new geometry for a multi bossed beam-membrane structure with a SOI (silicon-on-insulator) substrate and a mechanical transducer. The Intellisuite MEMS CAD design tool was used to build and analyze the structure with FEM (finite element modeling). The working principle of the multi bossed beam structure is explained. FEM calculations show that a sensing diaphragm with Mises stress can provide superior linear response compared to a stress-free diaphragm. These simulation results are validated by comparing the estimated deflection response. The results show that, the sensitivity is enhanced by using both the novel geometry and the SOI substrate.

• Journal of Sensor Science and Technology
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• v.30 no.5
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• pp.273-278
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• 2021

Here, we studied the change in the mechanical stiffness of a diaphragm according to the corrugation pattern. The diaphragm consists of a silicon oxide and nitride double layer; a corrugation pattern was formed by dry etching, and the diaphragm was released by wet etching. The fabrication of the thin film was verified using focused ion beam and scanning electron microscopy images. The mechanical stiffness of the diaphragm was obtained by measuring the surface vibration using a laser Doppler vibrometer while applying external sound pressure. Flat squares, diaphragms with square corrugations, and circular corrugation patterns were measured and compared. The stiffness of the diaphragm with a corrugation structure was found to be smaller than that without a corrugation structure; in particular, circular corrugation showed a better effect because of the high symmetry. Furthermore, the effect of corrugation was theoretically predicted. The proposed corrugated diaphragm showed comparable flexibility with the state-of-the-art MEMS microphone diaphragm.

• Journal of Sensor Science and Technology
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• v.13 no.6
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• pp.430-435
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• 2004

The resolution of the accelerometer, fabricated with MEMS technology is mainly affected by mechanical and electrical noise. To reduce mechanical noise, we have to increase mass of the structure part and quality factor related with the degree of vacuum packaging. On the other hand, to increase mass of the structure part, the thickness of the structure must be increased and ICP-RIE is used to fabricate the high aspect ratio structure. At this time, footing effect make the sensitivity of the accelerometer decreasing. This paper presents a hybrid SOG(Silicon On Glass) Process to fabricate a lateral silicon accelerometer with differential capacitance sensing scheme which has been designed and simulated. Using hybrid SOG Process, we could make it a real to increase the structural thickness and to prevent the footing effect by deposition of metal layer at the bottom of the structure. Moreover, we bonded glass wafer to structure wafer anodically, so we could realize the vacuum packaging at wafer level. Through this way, we could have an idea of controlling of quality factor.

• Journal of the Korean institute of surface engineering
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• v.32 no.3
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• pp.331-335
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• 1999

Electroless plating nickel has superior mechanical property to electroplated nickel. Furthermore nickel can be coated on nonconducting substrate. In this research, electroless plating of nickel were conducted in different bath condition to find optimum conditions of electroless nickel plating for MEMS applications. The selectivity of activation method on several substrates was investigated. The effects of nickel concentration, reducing agent concentration and inhibitor on deposition rate were investigated. The effect of pH on deposition rate and content of phosphorous in deposited nickel was also investigated.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.5
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• pp.416-421
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• 2011

Nowadays, the increasing demands upon mobile devices such as wireless sensor networks and the recent advent of low power electrical devices such as MEMS make such renewable power sources attractive. A vibration-driven MEMS lead zirconate titanate $Pb(Zr,Ti)O_3$ (PZT) cantilever device is developed for energy harvesting application. This paper presents a piezoelectric based energy harvester which is suitable for power generating from conventional vibration and has in providing energy for low power electron ic devices. The PZT cantilever is used d33 mode to get the electrical power. The PZT cantilever based energy harvester with the dimension of 7 mm${\times}$3 mm${\times}$0.03 mm is fabricated using micromachining technologies. This PZT cantilever has the mechanical resonance frequency with a 900 Hz. With these conditions, we get experimentally the 37 uW output power from this device with the application of 1g acceleration using the 900 Hz vibration. From this study, we show the feasibility of one of energy harvesting candidates using PZT based structure. This PZT energy harvester could be used for various applications such a batteryless micro sensors and micro power generators.

• Journal of Mechanical Science and Technology
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• v.20 no.4
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• pp.505-512
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• 2006

This paper presents an integrated multifunctional sensor based on MEMS technology, which can be used or embedded in mobile devices for environmental monitoring. An absolute pressure sensor, a temperature sensor and a humidity sensor are integrated in one silicon chip of which the size is $5mm\times5mm$. The pressure sensor uses a bulk-micromachined diaphragm structure with the piezoresistors. For temperature sensing, a silicon temperature sensor based on the spreading-resistance principle is designed and fabricated. The humidity sensor is a capacitive humidity sensor which has the polyimide film and interdigitated capacitance electrodes. The different piezoresistive orientation is used for the pressure and temperature sensor to avoid the interference between sensors. Each sensor shows good sensor characteristics except for the humidity sensor. However, the linearity and hysteresis of the humidity sensor can be improved by selecting the proper polymer materials and structures.

• Proceedings of the KIEE Conference
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• 1995.07c
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• pp.1025-1027
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• 1995

SEG(Selective Epitaxial Growth) and ELO(Epitaxial Lateral Growth) of Silicon offer new opportunities in the fabrication of MEMS(Micro Electro-Mechanical Systems) structures. SEG of silicon enables the stacking of junctions in addition to those resulting from the standard bipolar process and this properly was utilized for the fabrication of an improved-performance color sensor. When the crystalline growth takes place through the seed windows and proceeds over the dielectric, after reaching the surface, it form an ELO silicon layer and this ELO-Si can be modified into various structures for MEMS application such as cantilevers, beams, diaphragms.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.10b
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• pp.103-104
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• 2002

The influence of the slip flow on the MEMS/MST based gas-lubricated proceeding bearing is investigated. Based on the modified Reynolds equation, the numerical analysis of the finite difference method was developed by applying the first order slip flow approximation. The numerical prediction of bearing performance provides the significant results concerning the slip flow effect in micro scale gas-lubricated proceeding bearing. The result indicates that the load-carrying capacity as well as the rotordynamic coefficients were significantly reduced due to the slip flow. Through this work, it is concluded that the slip flow effect could not be ignored in the micro gas-lubricated proceeding bearing.