• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2002년도 춘계학술대회 논문집
• /
• pp.497-502
• /
• 2002

This paper describes a design methodology of a tri-axial silicon-based farce sensor with square membrane by using micromachining technology (MEMS). The sensor has a maximum farce range of 5 N and a minimum force range of 0.1N in the three-axis directions. A simple beam theory was adopted to design the shape of the micro-force sensor. Also the optimal positions of piezoresistors were determined by the strain distribution obtained from the commercial finite element analysis program, ANSYS. The Wheatstone bridge circuits were designed to consider the sensitivity of the force sensor and its temperature compensation. Finally the process for microfabrication was designed using micromachining technology.

• 디지털산업정보학회논문지
• /
• 제18권4호
• /
• pp.47-54
• /
• 2022

In this paper, MEMS embedded system design implemented the sensor events via analyzing the characteristics that dynamically happened to an abnormal status in power IoT environments in order to guarantee a maintainable operation. We used three kinds of tools in this paper, at first Bluetooth Low Energy (BLE) technology which is a suitable protocol that provides a low data rate, low power consumption, and low-cost sensor applications. Secondly LSM6DSOX, a system-in-module containing a 3-axis digital accelerometer and gyroscope with low-power features for optimal motion. Thirdly BM1422AGMV Digital Magnetometer IC, a 3-axis magnetic sensor with an I2C interface and a magnetic measurable range of ±120 uT, which incorporates magneto-impedance elements to detect the magnetic field when the current flowed in the power devices. The proposed MEMS system was developed based on an nRF5340 System on Chip (SoC), previously compared to the standalone embedded system without bluetooth technology via mobile App. And also, MEMS embedded system with BLE 5.0 technology broadcasted the MEMS system status to Android mobile server. The experiment results enhanced the performance of MEMS system design by combination of sensors, BLE technology and mobile application.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2008년도 추계학술대회A
• /
• pp.1951-1956
• /
• 2008

Various MEMS accelerometers are used in engineering applications including automobiles, mobile phones, military systems, and electronic devices. Among them, the thermal accelerometer employing the temperature difference induced by the convective flow inside the micro cavity has been a topic of interest. As the convective sensor does not utilize a solid proof mass, it is compact, lightweight, inexpensive to manufacture, sensitive and highly endurable to mechanical shock. However, the complexity of the convective flow and various design constraints make optimization of a device a crucial step before fabrication. In this work, optimization of a 2-axis thermal convective MEMS accelerometer is conducted based on 3-dimensional numerical simulation. Parametric studies are performed by varying the several design variables such as the heater shape/size, the cavity size and types of the gas medium and the position of temperature probes in the sensor. The results of optimal design are presented.

• Transactions on Electrical and Electronic Materials
• /
• 제7권4호
• /
• pp.184-188
• /
• 2006

This work describes efforts in the fabrication and testing of robust microelectromechanical systems (MEMS). Robustness is typically achieved by investigating non-silicon substrates and materials for MEMS fabrication. Some of the traditional MEMS fabrication techniques are applicable to robust MEMS, while other techniques are drawn from other technology areas, such as electronic packaging. The fabrication technologies appropriate for robust MEMS are illustrated through laminated polymer membrane based pressure sensor arrays. Each array uses a stainless steel substrate, a laminated polymer film as a suspended movable plate, and a fixed, surface micromachined back electrode of electroplated nickel. Over an applied pressure range from 0 to 34 kPa, the net capacitance change was approximately 0.14 pF. An important attribute of this design is that only the steel substrate and the pressure sensor inlet is exposed to the flow; i.e., the sensor is self-packaged.

• 한국소음진동공학회논문집
• /
• 제23권12호
• /
• pp.1082-1089
• /
• 2013

3-Axis sensor measurement system is needed for measuring ride quality of elevator. But because 3-Axis piezoelectric accelerometer is expensive. We developed 3-Axis sensor system which is suitable for measuring ride quality of elevator using cheap MEMS sensor. There are two types of MEMS sensor that are piezoresistive and capacitive type. The excellence of piezoresistive type in characteristic of frequency response and noise is confirmed compare to capacitive type as a result of this paper's experiment and reference. 3-Axis system using MEMS sensor needs MEMS's proper frequency response characteristic. Additionally noise characteristic of sensor and circuit, stiffness of assembly are needed for deciding frequency range and accuracy of amplitude.

• KSII Transactions on Internet and Information Systems (TIIS)
• /
• 제15권10호
• /
• pp.3554-3570
• /
• 2021

With the rapid development of the Chinese water project, the safety monitoring of dams is urgently needed. Many drawbacks exist in dams, such as high monitoring costs, a limited equipment service life, long-term monitoring difficulties. MEMS sensors have the advantages of low cost, high precision, easy installation, and simplicity, so they have broad application prospects in engineering measurements. This paper designs intelligent monitoring based on the collaborative measurement of dual MEMS sensors. The system first determines the endpoint coordinates of the sensor array by the coordinate transformation relationship in the monitoring system and then obtains the dam settlement according to the endpoint coordinates. Next, this paper proposes a dual-MEMS sensor collaborative measurement algorithm that builds a mathematical model of the dual-sensor measurement. The monitoring system realizes mutual compensation between sensor measurement data by calculating the motion constraint matrix between the two sensors. Compared with the single-sensor measurement, the dual-sensor measurement algorithm is more accurate and can improve the reliability of long-term monitoring data. Finally, the experimental results show that the dam subsidence monitoring system proposed in this paper fully meets the engineering monitoring accuracy needs, and the dual-sensor collaborative measurement system is more stable than the single-sensor monitoring system.

• Smart Structures and Systems
• /
• 제5권6호
• /
• pp.663-679
• /
• 2009

The use of Micro-Electro-Mechanical Systems (MEMS) accelerometers in geotechnical instrumentation is relatively new but on the rise. This paper describes a new MEMS-based system for in situ deformation and vibration monitoring. The system has been developed in an effort to combine recent advances in the miniaturization of sensors and electronics with an established wireless infrastructure for on-line geotechnical monitoring. The concept is based on triaxial MEMS accelerometer measurements of static acceleration (angles relative to gravity) and dynamic accelerations. The dynamic acceleration sensitivity range provides signals proportional to vibration during earthquakes or construction activities. This MEMS-based in-place inclinometer system utilizes the measurements to obtain three-dimensional (3D) ground acceleration and permanent deformation profiles up to a depth of one hundred meters. Each sensor array or group of arrays can be connected to a wireless earth station to enable real-time monitoring as well as remote sensor configuration. This paper provides a technical assessment of MEMS-based in-place inclinometer systems for geotechnical instrumentation applications by reviewing the sensor characteristics and providing small- and full-scale laboratory calibration tests. A description and validation of recorded field data from an instrumented unstable slope in California is also presented.

• 디지털산업정보학회논문지
• /
• 제17권3호
• /
• pp.9-15
• /
• 2021

In this paper, the Embedded MEMS system to the power apparatus used Edge Impulse machine learning tools and therefore an improved predictive system design is implemented. The proposed MEMS embedded system is developed based on nRF52840 system and the sensor with 3-Axis Digital Magnetometer, I2C interface and magnetic measurable range ±120 uT, BM1422AGMV which incorporates magneto impedance elements to detect magnetic field and the ARM M4 32-bit processor controller circuit in a small package. The MEMS embedded platform is consisted with Edge Impulse Machine Learning and system driver implementation between hardware and software drivers using SensorQ which is special queue including user application temporary sensor data. In this paper by experimenting, TensorFlow machine learning training output is applied to the power apparatus for analyzing the status such as "Normal, Warning, Hazard" and predicting the performance at level of 99.6% accuracy and 0.01 loss.

• 대한전자공학회논문지SD
• /
• 제42권11호
• /
• pp.1-8
• /
• 2005

본 논문은 MEMS (Micro-Mechanical-Electronic System) 기술을 이용한 온도, 압력, 습도 복합 센서의 설계와 제작, 그리고 평가에 관한 것이다. 이러한 MEMS 복합 센서는 휴대 전화나 PDA와 같이 가정용 제품에 사용되어 환경을 모니터링하는 건강 측정용 센서로서 사용될 것이다. 이 연구의 범위는 이러한 개별 센서의 연구 및 모든 센서를 하나의 실리콘 웨이퍼 상에서 집적할 수 있는 구조에 관한 연구, 그리고 복합 센서를 MEMS 공정에서 제작할 수 있는 공정 호환성에 대한 연구와 얻어진 센서 prototype의 측정, 평가로 이루어져 있다. 이 연구에서 우리는 온도와 압력 센서의 경우에는 선형성과 이력특성이 $1\%FS$안에 들어오는 특성을 얻었으며 단지 습도 센서의 경우에는 $5\%FS$에 해당하는 선형성과 이력 특성을 얻었다. 다만 원리적으로 습도 센서의 동작 특성은 비선형적이며 우리가 3차로 근사화할 경우에 보다 낳은 결과를 얻을 것을 기대할 수 있다. 이러한 특성을 더욱 개선하기 위한 것은 추후의 연구 영역이 될 것이다.

• 마이크로전자및패키징학회지
• /
• 제24권4호
• /
• pp.9-17
• /
• 2017

In these days, MEMS (micro-electro-mechanical system) devices become the crucial sensor components in mobile devices, automobiles and several electronic consumer products. For MEMS devices, the packaging determines the performance, reliability, long-term stability and the total cost of the MEMS devices. Therefore, the packaging technology becomes a key issue for successful commercialization of MEMS devices. As the IoT and wearable devices are emerged as a future technology, the importance of the MEMS sensor keeps increasing. However, MEMS devices should meet several requirements such as ultra-miniaturization, low-power, low-cost as well as high performances and reliability. To meet those requirements, several innovative technologies are under development such as integration of MEMS and IC chip, TSV(through-silicon-via) technology and CMOS compatible MEMS fabrication. It is clear that MEMS packaging will be key technology in future MEMS. In this paper, we reviewed the recent development trends of the MEMS packaging. In particular, we discussed and reviewed the recent technology trends of the MEMS bonding technology, such as low temperature bonding, eutectic bonding and thermo-compression bonding.