• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.497-502
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• 2002

This paper describes a design methodology of a tri-axial silicon-based farce sensor with square membrane by using micromachining technology (MEMS). The sensor has a maximum farce range of 5 N and a minimum force range of 0.1N in the three-axis directions. A simple beam theory was adopted to design the shape of the micro-force sensor. Also the optimal positions of piezoresistors were determined by the strain distribution obtained from the commercial finite element analysis program, ANSYS. The Wheatstone bridge circuits were designed to consider the sensitivity of the force sensor and its temperature compensation. Finally the process for microfabrication was designed using micromachining technology.

• Journal of Korea Society of Digital Industry and Information Management
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• v.18 no.4
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• pp.47-54
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• 2022

In this paper, MEMS embedded system design implemented the sensor events via analyzing the characteristics that dynamically happened to an abnormal status in power IoT environments in order to guarantee a maintainable operation. We used three kinds of tools in this paper, at first Bluetooth Low Energy (BLE) technology which is a suitable protocol that provides a low data rate, low power consumption, and low-cost sensor applications. Secondly LSM6DSOX, a system-in-module containing a 3-axis digital accelerometer and gyroscope with low-power features for optimal motion. Thirdly BM1422AGMV Digital Magnetometer IC, a 3-axis magnetic sensor with an I2C interface and a magnetic measurable range of ±120 uT, which incorporates magneto-impedance elements to detect the magnetic field when the current flowed in the power devices. The proposed MEMS system was developed based on an nRF5340 System on Chip (SoC), previously compared to the standalone embedded system without bluetooth technology via mobile App. And also, MEMS embedded system with BLE 5.0 technology broadcasted the MEMS system status to Android mobile server. The experiment results enhanced the performance of MEMS system design by combination of sensors, BLE technology and mobile application.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1951-1956
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• 2008

Various MEMS accelerometers are used in engineering applications including automobiles, mobile phones, military systems, and electronic devices. Among them, the thermal accelerometer employing the temperature difference induced by the convective flow inside the micro cavity has been a topic of interest. As the convective sensor does not utilize a solid proof mass, it is compact, lightweight, inexpensive to manufacture, sensitive and highly endurable to mechanical shock. However, the complexity of the convective flow and various design constraints make optimization of a device a crucial step before fabrication. In this work, optimization of a 2-axis thermal convective MEMS accelerometer is conducted based on 3-dimensional numerical simulation. Parametric studies are performed by varying the several design variables such as the heater shape/size, the cavity size and types of the gas medium and the position of temperature probes in the sensor. The results of optimal design are presented.

• Transactions on Electrical and Electronic Materials
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• v.7 no.4
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• pp.184-188
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• 2006

This work describes efforts in the fabrication and testing of robust microelectromechanical systems (MEMS). Robustness is typically achieved by investigating non-silicon substrates and materials for MEMS fabrication. Some of the traditional MEMS fabrication techniques are applicable to robust MEMS, while other techniques are drawn from other technology areas, such as electronic packaging. The fabrication technologies appropriate for robust MEMS are illustrated through laminated polymer membrane based pressure sensor arrays. Each array uses a stainless steel substrate, a laminated polymer film as a suspended movable plate, and a fixed, surface micromachined back electrode of electroplated nickel. Over an applied pressure range from 0 to 34 kPa, the net capacitance change was approximately 0.14 pF. An important attribute of this design is that only the steel substrate and the pressure sensor inlet is exposed to the flow; i.e., the sensor is self-packaged.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.23 no.12
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• pp.1082-1089
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• 2013

3-Axis sensor measurement system is needed for measuring ride quality of elevator. But because 3-Axis piezoelectric accelerometer is expensive. We developed 3-Axis sensor system which is suitable for measuring ride quality of elevator using cheap MEMS sensor. There are two types of MEMS sensor that are piezoresistive and capacitive type. The excellence of piezoresistive type in characteristic of frequency response and noise is confirmed compare to capacitive type as a result of this paper's experiment and reference. 3-Axis system using MEMS sensor needs MEMS's proper frequency response characteristic. Additionally noise characteristic of sensor and circuit, stiffness of assembly are needed for deciding frequency range and accuracy of amplitude.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.15 no.10
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• pp.3554-3570
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• 2021

With the rapid development of the Chinese water project, the safety monitoring of dams is urgently needed. Many drawbacks exist in dams, such as high monitoring costs, a limited equipment service life, long-term monitoring difficulties. MEMS sensors have the advantages of low cost, high precision, easy installation, and simplicity, so they have broad application prospects in engineering measurements. This paper designs intelligent monitoring based on the collaborative measurement of dual MEMS sensors. The system first determines the endpoint coordinates of the sensor array by the coordinate transformation relationship in the monitoring system and then obtains the dam settlement according to the endpoint coordinates. Next, this paper proposes a dual-MEMS sensor collaborative measurement algorithm that builds a mathematical model of the dual-sensor measurement. The monitoring system realizes mutual compensation between sensor measurement data by calculating the motion constraint matrix between the two sensors. Compared with the single-sensor measurement, the dual-sensor measurement algorithm is more accurate and can improve the reliability of long-term monitoring data. Finally, the experimental results show that the dam subsidence monitoring system proposed in this paper fully meets the engineering monitoring accuracy needs, and the dual-sensor collaborative measurement system is more stable than the single-sensor monitoring system.

• Smart Structures and Systems
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• v.5 no.6
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• pp.663-679
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• 2009

The use of Micro-Electro-Mechanical Systems (MEMS) accelerometers in geotechnical instrumentation is relatively new but on the rise. This paper describes a new MEMS-based system for in situ deformation and vibration monitoring. The system has been developed in an effort to combine recent advances in the miniaturization of sensors and electronics with an established wireless infrastructure for on-line geotechnical monitoring. The concept is based on triaxial MEMS accelerometer measurements of static acceleration (angles relative to gravity) and dynamic accelerations. The dynamic acceleration sensitivity range provides signals proportional to vibration during earthquakes or construction activities. This MEMS-based in-place inclinometer system utilizes the measurements to obtain three-dimensional (3D) ground acceleration and permanent deformation profiles up to a depth of one hundred meters. Each sensor array or group of arrays can be connected to a wireless earth station to enable real-time monitoring as well as remote sensor configuration. This paper provides a technical assessment of MEMS-based in-place inclinometer systems for geotechnical instrumentation applications by reviewing the sensor characteristics and providing small- and full-scale laboratory calibration tests. A description and validation of recorded field data from an instrumented unstable slope in California is also presented.

• Journal of Korea Society of Digital Industry and Information Management
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• v.17 no.3
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• pp.9-15
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• 2021

In this paper, the Embedded MEMS system to the power apparatus used Edge Impulse machine learning tools and therefore an improved predictive system design is implemented. The proposed MEMS embedded system is developed based on nRF52840 system and the sensor with 3-Axis Digital Magnetometer, I2C interface and magnetic measurable range ±120 uT, BM1422AGMV which incorporates magneto impedance elements to detect magnetic field and the ARM M4 32-bit processor controller circuit in a small package. The MEMS embedded platform is consisted with Edge Impulse Machine Learning and system driver implementation between hardware and software drivers using SensorQ which is special queue including user application temporary sensor data. In this paper by experimenting, TensorFlow machine learning training output is applied to the power apparatus for analyzing the status such as "Normal, Warning, Hazard" and predicting the performance at level of 99.6% accuracy and 0.01 loss.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.11
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• pp.1-8
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• 2005

In this paper, we present design and prototyping of a low-cost, integrated multi-functional micro health sensor chip that can be used or embedded in widely consumer devices, such as cell phone and PDA, for monitoring environmental condition including air pressure, temperature and humidity. This research's scope includes basic individual sensor study, architecture for integrating sensors on a chip, fabrication process compatibility and test/evaluation of prototype sensors. The results show that the integrated TPH sensor has good characteristics of ${\pm}\;1\%FS$ of linearity and hysteresis for pressure sensor and temperature sensor and of ${\pm}\;5\%FS$ of linearity and hysteresis But if we use 3rd order approximation for humidity sensor, full scale error becomes much smaller and this will be one of our future study.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.9-17
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• 2017

In these days, MEMS (micro-electro-mechanical system) devices become the crucial sensor components in mobile devices, automobiles and several electronic consumer products. For MEMS devices, the packaging determines the performance, reliability, long-term stability and the total cost of the MEMS devices. Therefore, the packaging technology becomes a key issue for successful commercialization of MEMS devices. As the IoT and wearable devices are emerged as a future technology, the importance of the MEMS sensor keeps increasing. However, MEMS devices should meet several requirements such as ultra-miniaturization, low-power, low-cost as well as high performances and reliability. To meet those requirements, several innovative technologies are under development such as integration of MEMS and IC chip, TSV(through-silicon-via) technology and CMOS compatible MEMS fabrication. It is clear that MEMS packaging will be key technology in future MEMS. In this paper, we reviewed the recent development trends of the MEMS packaging. In particular, we discussed and reviewed the recent technology trends of the MEMS bonding technology, such as low temperature bonding, eutectic bonding and thermo-compression bonding.