• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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• pp.830-833
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• 2003

This paper describes the fabrication and characteristics of 3C-SiCOI sotctures by SDB and etch-back technology for high-temperature MEMS applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si(001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The wafer bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR. The strength of the bond was measured by tensile strengthmeter. The bonded interface was also analyzed by SEM. The properties of fabricated 3C-SiCOI structures using etch-back technology in TMAH solution were analyzed by XRD and SEM. These results indicate that the 3C-SiCOI structure will offers significant advantages in the high-temperature MEMS applications.

• 대한전자공학회논문지TC
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• 제43권2호
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• pp.81-87
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• 2006

MEMS 공정을 이용하여 작은 접지면과 광대역 특성을 가지는 소형 안테나를 제작하였다. 광대역 특성을 얻기 위해서 다층기판을 사용하였으며, 패치 안테나는 네개의 패치로 나누어져 있고 각각의 패치는 금속선으로 연결되어 있다. 한 개의 마스크 공정으로 간단한 제작이 가능하다. 두개의 마이크로스트립 안테나를 만들었다 A 타입 안테나는 패치들이 금속선으로 연결된 안테나이고 B 타입 안테나는 금속선으로 연결이 안된 안테나이다. 제안된 안테나의 크기는 $8{\times}12{\times}2mm^3$ 이었으며 측정결과 A 타입은 5.3GHz 중심주파수에 420MHz 대역폭, B 타입은 5.66 GHB중심주파수에 480MHz 대역폭을 가지는 것으로 나타났다.

• 한국항공우주학회지
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• 제48권7호
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• pp.523-528
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• 2020

스프링-메스 시스템의 원리를 이용하여 수평 구동형 MEMS 관성 스위치를 설계하였다. 본 MEMS 스위치는 외부에서 발생하는 가속도를 감지하여 점화안전장치를 장전시키는 역할을 한다. 성능 모델링을 통하여 다양한 가속도 조건에서의 구동 양상을 분석하였다. 시뮬레이션 결과 가속도의 기울기가 10g/msec 이하인 경우에 MEMS 스위치는 10g에서 잘 작동하는 것으로 나타났다. 반면에, 설계 변수들의 공차를 10%로 고려한 시뮬레이션 결과 스프링 폭과 길이에 의해 임계 동작 가속도가 규격(10±2g)을 벗어났다. 제작 공정상 10% 이하의 공차 관리가 어려운 스프링 폭을 두 배로 늘렸을 때 규격을 만족하는 것을 확인하고 설계보완을 제안하였다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2006년도 춘계학술대회 논문집
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• pp.243-246
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• 2006

In this paper, Experimental results on the measurement of mechanical properties of fine patterns in the MEMS structure are described. The mechanical properties of embossing patterns on metallic thin foil is measured using the nano indentation system, that is developed by Korea Institute of Industrial Technology(KITECH). These micro embossing patterns are fabricated using CIP(Cold Isostatic Press) process on micro metallic thin foils(Al-1100) that are made by rolling process. These embossing patterned metallic thin foils(Al-1100) are used in the reflecting plate of BLU(Back Light Unit) and electrical/mechanical MEMS components. If these mechanical properties of fine patterns are utilized in a design procedure, the optimal design can be achieved in aspects of reliability as well as economy.

• Transactions on Electrical and Electronic Materials
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• 제6권4호
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• pp.135-139
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• 2005

In this paper, negative SU-8 photoresist processed at low temperature is characterized in terms of delamination. Based on a $3^3$ factorial designed experiment, 27 samples are fabricated, and the degree of delamination is measured for each. In addition, nine samples are fabricated for the purpose of verification. Employing the. neural network modeling technique, a process model is established, and response surfaces are generated to investigate degree of delamination associated with three process parameters: post exposure bake (PEB) temperature, PEB time, and exposure energy. From the response surfaces generated, two significant parameters associated with delamination are identified, and their effects on delamination are analyzed. Higher PEB temperature at a fixed PEB time results in a greater degree of delamination. In addition, a higher dose of exposure energy lowers the temperature at which the delamination begins and also results in a larger degree of delamination. These results identify acceptable ranges of the three process variables to avoid delamination of SU-8 film, which in turn might lead to potential defects in MEMS device fabrication.

• 대한기계학회논문집A
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• 제27권7호
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• pp.1234-1242
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• 2003

In this paper we present a simple and efficient robust optimal design formulation for MEMS structures and its application to a resonant-type micro probe. The basic idea is to use the gradient index (GI) to improve robustness of the objective and constraint functions. In the robust optimal design procedure, a deterministic optimization for performance of MEMS structures is followed by design sensitivity analysis with respect to uncertainties such as fabrication errors and change of operating conditions. During the process of deterministic optimization and sensitivity analysis, dominant performance and uncertain variables are identified to define GI. The GI is incorporated as a term of objective and constraint functions in the robust optimal design formulation to make both performance and robustness improved. While most previous approaches for robust optimal design require statistical information on design variations, the proposed GI based method needs no such information and therefore is cost-effective and easily applicable to early design stages. For the micro probe example, robust optimums are obtained to satisfy the targets for the measurement sensitivity and they are compared in terms of robustness and production yield with the deterministic optimums through the Monte Carlo simulation. This method, although shown for MEMS structures, may as well be easily applied to conventional mechanical structures where information on uncertainties is lacking but robustness is highly important.

• Smart Structures and Systems
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• 제1권1호
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• pp.63-82
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• 2005

This paper introduces a technology for robust and low maintenance cost sensor network capable to detect accelerations below a micro-g in a wide frequency bandwidth (above 1,000 Hz). Sensor networks with such performance are critical for navigation, seismology, acoustic sensing, and for the health monitoring of civil structures. The approach is based on the fabrication of an array of high sensitivity accelerometers, each utilizing Fabry-Perot cavity with wavelength-dependent reflectivity to allow embedded optical detection and serialization. The unique feature of the approach is that no local power source is required for each individual sensor. Instead one global light source is used, providing an input optical signal which propagates through an optical fiber network from sensor-to-sensor. The information from each sensor is embedded onto the transmitted light as an intrinsic wavelength division multiplexed signal. This optical "rainbow" of data is then assessed providing real-time sensing information from each sensor node in the network. This paper introduces the Fabry-Perot based accelerometer and examines its critical features, including the effects of imperfections and resolution estimates. It then presents serialization techniques for the creation of systems of arrayed sensors and examines the effects of serialization on sensor response. Finally, a fabrication process is proposed to create test structures for the critical components of the device, which are dynamically characterized.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2009년도 제33회 추계학술대회논문집
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• pp.289-292
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• 2009

본 연구에서는 감광유리를 이용한 PEM 마이크로 연료전지 바이폴라 플레이트의 제작 공정을 확립하고 성능 측정을 수행하였다. 감광유리는 무게가 가볍고 내화학성이 뛰어나며 제작이 용이하다. 비등방성 식각, 열 및 UV 접합, 그리고 금속 층 적층을 통한 MEMS 제작 공정이 확립되었다. 성능 측정 결과 활성화 영역에 은이 적층된 마이크로 연료전지의 성능이 그렇지 않은 것보다 우수하였으며 두 경우에서 측정된 마이크로 연료전지의 성능은 모두 국내외 마이크로 연료전지 연구 수준과 동등한 수준이었다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제2권4호
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• pp.237-245
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• 2002

A new type of RF MEMS switch for low voltage actuation, high broadband application and high power capability is presented. Mechanical and electromagnetic simulations of this new RF MEMS switch type are shown and the fabrication process and measurement results are given. The switching element consists of a cantilever which is fixed by a suspension spring to the ground of the coplanar line. The closing voltage is 16V. The switches exhibit low insertion loss (<0.85dB@30GHz) with good isolation (>22dB@30GHz).

• JSTS:Journal of Semiconductor Technology and Science
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• 제5권3호
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• pp.204-209
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• 2005

A small size broadband microstrip patch antenna with small ground plane has been fabricated using MEMS. Multiple layer substrates are used to realize small size and broadband characteristics. The microstrip patch is divided into 3 pieces and each patch is connected to each other using a metal microstrip line. The fabrication process is simple and only one mask is needed. Two types of microtrip antennas are fabricated. Type A is the micros trip antenna with metal lines and type B is the microstrip antenna without metal lines. The size of proposed microstip antenna is $8^{*}12^{*}2mm^{3}$ and the experimental results show that the antenna type A and type B have the bandwidth of 420 MHz at 5.3 GHz and 480 MHz at 5.66 GHz, respectively.