• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.830-833
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• 2003

This paper describes the fabrication and characteristics of 3C-SiCOI sotctures by SDB and etch-back technology for high-temperature MEMS applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si(001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The wafer bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR. The strength of the bond was measured by tensile strengthmeter. The bonded interface was also analyzed by SEM. The properties of fabricated 3C-SiCOI structures using etch-back technology in TMAH solution were analyzed by XRD and SEM. These results indicate that the 3C-SiCOI structure will offers significant advantages in the high-temperature MEMS applications.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.43 no.2 s.344
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• pp.81-87
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• 2006

A small size broadband microstrip patch antenna with small ground plane has been fabricated using MEMS. Multiple layer substrates we used to realize small size and broadband characteristics. The microstrip patch is divided into 4 pieces and each patch is connected to each other using a metal microstrip line. The fabrication please process is simple and only one mask is needed. Two types of microtrip antennas are fabrication Type A is the microstrip antenna with metal lines and type B is the microstrip antenna without metal lines. The size of proposed microstip antenna is $8{\times}12{\times}2mm^3$ and the experimental results show that the antenna type A and type B have the bandwidth of 420MHz at 5.3 GHz and 480MHz at 5.66 GHz, respectively

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.48 no.7
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• pp.523-528
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• 2020

A lateral type MEMS inertial switch was designed on the same principle as spring-mass system. The MEMS switch is used for arming mechanism of the arm-fire device by sensing the applied acceleration. We analyzed the switching capability of the MEMS switch under various acceleration conditions via performance model. Simulation results showed that the MEMS switch works very well at 10 g when the applied acceleration slope does not exceed 10 g/msec. On the other hand, the threshold operating acceleration level simulation exceeded the requirement (10±2 g) due to the width and length of the spring by considering 10% tolerance of the design values. Design modification of doubling the width of the spring, which is difficult to reduce less than 10% tolerance in fabrication process, was proposed after confirming the simulation results comply the requirement.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2006.05a
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• pp.243-246
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• 2006

In this paper, Experimental results on the measurement of mechanical properties of fine patterns in the MEMS structure are described. The mechanical properties of embossing patterns on metallic thin foil is measured using the nano indentation system, that is developed by Korea Institute of Industrial Technology(KITECH). These micro embossing patterns are fabricated using CIP(Cold Isostatic Press) process on micro metallic thin foils(Al-1100) that are made by rolling process. These embossing patterned metallic thin foils(Al-1100) are used in the reflecting plate of BLU(Back Light Unit) and electrical/mechanical MEMS components. If these mechanical properties of fine patterns are utilized in a design procedure, the optimal design can be achieved in aspects of reliability as well as economy.

• Transactions on Electrical and Electronic Materials
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• v.6 no.4
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• pp.135-139
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• 2005

In this paper, negative SU-8 photoresist processed at low temperature is characterized in terms of delamination. Based on a $3^3$ factorial designed experiment, 27 samples are fabricated, and the degree of delamination is measured for each. In addition, nine samples are fabricated for the purpose of verification. Employing the. neural network modeling technique, a process model is established, and response surfaces are generated to investigate degree of delamination associated with three process parameters: post exposure bake (PEB) temperature, PEB time, and exposure energy. From the response surfaces generated, two significant parameters associated with delamination are identified, and their effects on delamination are analyzed. Higher PEB temperature at a fixed PEB time results in a greater degree of delamination. In addition, a higher dose of exposure energy lowers the temperature at which the delamination begins and also results in a larger degree of delamination. These results identify acceptable ranges of the three process variables to avoid delamination of SU-8 film, which in turn might lead to potential defects in MEMS device fabrication.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.7
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• pp.1234-1242
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• 2003

In this paper we present a simple and efficient robust optimal design formulation for MEMS structures and its application to a resonant-type micro probe. The basic idea is to use the gradient index (GI) to improve robustness of the objective and constraint functions. In the robust optimal design procedure, a deterministic optimization for performance of MEMS structures is followed by design sensitivity analysis with respect to uncertainties such as fabrication errors and change of operating conditions. During the process of deterministic optimization and sensitivity analysis, dominant performance and uncertain variables are identified to define GI. The GI is incorporated as a term of objective and constraint functions in the robust optimal design formulation to make both performance and robustness improved. While most previous approaches for robust optimal design require statistical information on design variations, the proposed GI based method needs no such information and therefore is cost-effective and easily applicable to early design stages. For the micro probe example, robust optimums are obtained to satisfy the targets for the measurement sensitivity and they are compared in terms of robustness and production yield with the deterministic optimums through the Monte Carlo simulation. This method, although shown for MEMS structures, may as well be easily applied to conventional mechanical structures where information on uncertainties is lacking but robustness is highly important.

• Smart Structures and Systems
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• v.1 no.1
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• pp.63-82
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• 2005

This paper introduces a technology for robust and low maintenance cost sensor network capable to detect accelerations below a micro-g in a wide frequency bandwidth (above 1,000 Hz). Sensor networks with such performance are critical for navigation, seismology, acoustic sensing, and for the health monitoring of civil structures. The approach is based on the fabrication of an array of high sensitivity accelerometers, each utilizing Fabry-Perot cavity with wavelength-dependent reflectivity to allow embedded optical detection and serialization. The unique feature of the approach is that no local power source is required for each individual sensor. Instead one global light source is used, providing an input optical signal which propagates through an optical fiber network from sensor-to-sensor. The information from each sensor is embedded onto the transmitted light as an intrinsic wavelength division multiplexed signal. This optical "rainbow" of data is then assessed providing real-time sensing information from each sensor node in the network. This paper introduces the Fabry-Perot based accelerometer and examines its critical features, including the effects of imperfections and resolution estimates. It then presents serialization techniques for the creation of systems of arrayed sensors and examines the effects of serialization on sensor response. Finally, a fabrication process is proposed to create test structures for the critical components of the device, which are dynamically characterized.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2009.11a
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• pp.289-292
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• 2009

The fabrication method of glass bipolar plates for micro PEM fuel cell application has been established and performance evaluation has been carried out. The advantages of glass bipolar plates for micro PEM fuel cells are light weight, high chemical resistivity, and easy manufacture. The MEMS fabrication process of anisotropic wet etching, thermal & UV bonding along with metal layer deposition has been introduced. From performance evaluation, it was shown that the micro fuel cell with a metal layer deposited on the reactive area yielded higher power density than the one without it. But both power densities of the two cases showed out to be adequate with the current status of micro fuel cell technology.

• JSTS:Journal of Semiconductor Technology and Science
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• v.2 no.4
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• pp.237-245
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• 2002

A new type of RF MEMS switch for low voltage actuation, high broadband application and high power capability is presented. Mechanical and electromagnetic simulations of this new RF MEMS switch type are shown and the fabrication process and measurement results are given. The switching element consists of a cantilever which is fixed by a suspension spring to the ground of the coplanar line. The closing voltage is 16V. The switches exhibit low insertion loss (<0.85dB@30GHz) with good isolation (>22dB@30GHz).

• JSTS:Journal of Semiconductor Technology and Science
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• v.5 no.3
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• pp.204-209
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• 2005

A small size broadband microstrip patch antenna with small ground plane has been fabricated using MEMS. Multiple layer substrates are used to realize small size and broadband characteristics. The microstrip patch is divided into 3 pieces and each patch is connected to each other using a metal microstrip line. The fabrication process is simple and only one mask is needed. Two types of microtrip antennas are fabricated. Type A is the micros trip antenna with metal lines and type B is the microstrip antenna without metal lines. The size of proposed microstip antenna is $8^{*}12^{*}2mm^{3}$ and the experimental results show that the antenna type A and type B have the bandwidth of 420 MHz at 5.3 GHz and 480 MHz at 5.66 GHz, respectively.