• Title/Summary/Keyword: MEMS/NEMS

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Fabrication of Miniaturized Shadow-mask for Local Deposition (국부증착용 마이크로 샤도우 마스크 제작)

  • 김규만;유르겐부르거
    • Journal of the Korean Society for Precision Engineering
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    • v.21 no.8
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    • pp.152-156
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    • 2004
  • A new tool of surface patterning technique for general purpose lithography was developed based on shadow mask method. This paper describes the fabrication of a new type of miniaturized shadow mask. The shadow mask is fabricated by photolithography and etching of 100-mm full wafer. The fabricated shadow mask has over 388 membranes with apertures of micrometer length scale ranging from 1${\mu}{\textrm}{m}$ to 100s ${\mu}{\textrm}{m}$ made on each 2mm${\times}$2mm large low stress silicon nitride membrane. It allows micro scale patterns to be directly deposited on substrate surface through apertures of the membrane. This shadow mask method has much wider choice of deposit materials, and can be applied to wider class of surfaces including chemical functional layer, MEMS/NEMS surfaces, and biosensors.

나노/마이크로 구조물의 기계적 특성 평가 기술

  • 이학주;최병익;오충석;김재현
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2004.05a
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    • pp.14-14
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    • 2004
  • 전자 공학 분야의 발전으로 인해 작은 구조물을 제작할 수 있는 리소그라피 (lithography) 기술이 급속하게 발전하고 있으며, 보다 작은 구조물에 대한 수요도 빠르게 증가하고 있다. 지난 수십 년간 반도체 분야에 적용 되어온 Moore's law에 의하면, 수년 내에 수십 나노 미터 크기의 특성 길이 (Critical Dimension)를 지닌 구조물을 이용하여 소자가 제작될 것 이 예견되고 있다. 반도체 공정을 응용하여 작은 구조물을 제작하는 기술은, 전자 공학 분야뿐만 아니라 광전자공학(optoelectronics) 분야, 양자 계산(quantum computing) 분야, 양자 계산(quantum computing) 분야, MEMS/NEMS, 바이오 센서(biosensor)분야 등에 다양한 응용성을 가질 것으로 예상된다.(중략)

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Measurement of Elastic Constants of Thin Metallic Foil by Guided Wave Dispersion Characteristics (유도초음파 분산 특성을 이용한 박판의 탄성계수 측정)

  • Lee, Dong-Jin;Cho, Youn-Ho;Jang, Kang-Won;Cho, Seung-Hyun;Ahn, Bong-Young
    • Journal of the Korean Society for Nondestructive Testing
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    • v.32 no.1
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    • pp.41-46
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    • 2012
  • As the development of MEMS/NEMS structure and application technology the demand for an assessment of the mechanical properties have increased. The mechanical properties are mainly evaluated by using tensile test or ultrasonic wave measurement. However, the new technology have been developed such as nano-indentation, guided wave method because they have a limitation in case of a thin plate and thin film. In the study, the guided wave velocities are measured by electromagnetic-acoustic transducer(EMAT), the material properties of thin metallic foils are obtained using optimization process of the theoretical and experimental group velocity of guided wave. The Young's modulus obtained by the optimization process(201.6 GPa), nano-indentation(207.0 GPa) and literature value(203.7 GPa) of a $50{\mu}m$ thick nickel thin plate shows good agreement within 3%.

An experimental study on the oriented mechanical properties of aluminum micro thin foil material (알루미늄 마이크로 박판소재의 방향성에 관한 실험적 연구)

  • Lee H. J.;Lee N. K.;Choi S.;Lee H. W.;Choi T. H.;Hwang J. H.;Kwag D. G.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2005.10a
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    • pp.295-298
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    • 2005
  • This paper is concerned with the precision material property measurement of a micro metal thin foil that is used in MEMS technology. Since these MEMS components require great precision and accuracy, evaluation of reliability such as the lift cycle endurance test, impact test, and residual stress test is necessary for these components. However, in practice, real reliability tests are not easy to perform due to consideration of various factors. Rather than actual testing, it would be much easier to evaluate the reliability of components by the analytical approach. Although the analytical method is utilized by software tools, it is obviously necessary to acquire fundamental properties of materials through real test methods. In this paper, the oriented mechanical properties of aluminum thin foil are measured by nano scale material property measurement system.

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Contact Fatigue Life Prediction under Elliptical Elastohydrodynamic Lubrication (타원접촉 EHL 상태에서의 접촉피로수명 예측)

  • Kim, Tae-Wan;Lee, Sang-Don;Koo, Young-Pil;Cho, Yang-Joo
    • Tribology and Lubricants
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    • v.22 no.6
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    • pp.320-328
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    • 2006
  • In this study, the simulation of rolling contact fatigue based on stress analysis is conducted under Elastohydrodynamic Lubrication state. To predict a crack initiation life accurately, it is necessary to calculate contact stress and subsurface stresses accurately. Contact stresses are obtained by contact analysis of a semi-infinile solid based on the use of influence functions and the subsurface stress field is obtained using rectangular patch solutions. And a numerical algorithm using Newton-Rapson method was constructed to calculate the Elastohydrodynamic lubrication pressure. Based on these stress values, several multiaxial high-cycle fatigue criteria are used and the critical loads corresponding to fatigue limits are calculated.

Technology and Application of Cells on Chips (세포칩 기술과 응용)

  • Kim, C.B.;Song, K.B.
    • Electronics and Telecommunications Trends
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    • v.26 no.3
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    • pp.95-104
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    • 2011
  • 셀칩(cells on chips)이란, MEMs/NEMs 응용분야 중 생명공학과 관련된 세포분야로의 응용에 이용되는 대표적인 기술로서 현재 전세계에서 경쟁적으로 연구, 개발되고 있다. 셀칩은 생체내부에서 세포가 성장하는 공간적(spatial), 시간적(temporal) 조건을 정교하게 모사(mimicking)함으로써, 복잡한 생화학적 생체 내(in vivo) 환경을 이해할 수 있는 새로운 기회를 창조하고 있다. 또한 셀칩과 다양한 형태의 분석용 센서와의 결합된 시스템을 통하여, 세포기반 질병진단 시스템의 소형화 및 조기진단 시스템 개발을 위한 바이오멤스 핵심 플랫폼 기술로 인식되고 있다. 즉 DNA, 단백질, 세포 등의 바이오 물질을 마이크로/나노시스템 위에서 검출 및 분석함으로써 극미량의 생체물질을 실시간 고감도 분석이 가능하게 할 것이다. 본 고에서는 셀칩분야의 기술 및 응용에 관해 정리하고 있다.

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finite Element Modeling of a Hemispherical Asperity Adhesively Contacting the Plane Surface of Semi-Infinite Rigid Body (강체평면에 흉착접촉하는 반구헝돌기의 유한요소모델링)

  • Cho, Sung-San;Park, Seung-Ho
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.26 no.11
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    • pp.2436-2441
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    • 2002
  • Finite element technique considering adhesive forces is proposed and applied to analyze the behavior of elastic hemispherical asperity adhesively contacting the plane surface of semi -infinite rigid body. It is demonstrated that the finite element model simulates interfacial phenomena such as jump -to-contact and adhesion hysteresis that cannot be simulated with the currently available adhesive contact continuum models. This simulation aiso provides valuable information on contact pressure, contact region and stress distributions. This technique is anticipated to be utilized in designing a low-adhesion surface profile for MEMS/NEMS applications since various contact geometries can be analyzed with this technique.

Photolithographic Silicon Patterns with Z-DOL (perfluoropolyether, PFPE) Coating as Tribological Surfaces for Miniaturized Devices

  • Singh, R. Arvind;Pham, Duc-Cuong;Yoon, Eui-Sung
    • KSTLE International Journal
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    • v.9 no.1_2
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    • pp.10-12
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    • 2008
  • Silicon micro-patterns were fabricated on Si (100) wafers using photolithography and DRIE (Deep Reactive Ion Etching) fabrication techniques. The patterned shapes included micro-pillars and micro-channels. After the fabrication of the patterns, the patterned surfaces were chemically modified by coating Z-DOL (perfluoropolyether, PFPE) thin films. The surfaces were then evaluated for their micro-friction behavior in comparison with those of bare Si (100) flat, Z-DOL coated Si (100) flat and uncoated Si patterns. Experimental results showed that the chemically treated (Z-DOL coated) patterned surfaces exhibited the lowest values of coefficient of friction when compared to the rest of the test materials. The results indicate that a combination of both the topographical and chemical modification is very effective in reducing the friction property. Combined surface treatments such as these could be useful for tribological applications in miniaturized devices such as Micro/Nano-Electro-Mechanical-Systems (MEMS/NEMS).

Analysis of Nano-contact Between Nano-asperities Using Atomic Force Microscopy (나노스케일 표면돌기 간의 미세접촉에 대한 해석)

  • Ahn, Hyo-Sok;Jang, Dong-Young
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.18 no.4
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    • pp.369-374
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    • 2009
  • In micro/nano-scale contacts in MEMS and NEMS, capillary and van der Waals forces generated around contacting micro-asperities significantly influence the performance of concerning device as they are closely related to adhesion and stiction of interacting surfaces. In this regard, it is of prime importance to accurately estimate the magnitude of surface forces so that an optimal solution for reducing friction and adhesion of micro/nano-surfaces may be obtained We introduced an effective method to calculate these surface forces based on topography information obtained from an atomic force microscope. This method was used to calculate surface forces generated in the contact interface formed between diamond-like carbon coating and $Si_3N_4$ ball. This method is shown to effectively demonstrate the influence of capillary force in the contact area, especially in humid atmosphere.

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Elastic modulus measurement of thin films using laser generated guided ultrasonic waves (레이저 초음파 기법을 이용한 박막 탄성계수 측정)

  • Cho, Seung Hyun;Heo, Taehoon;Ji, Bonggyu;Ahn, Bongyoung;Jang, Gang-Won
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2014.10a
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    • pp.550-554
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    • 2014
  • Regarding thin films in MEMS/NEMS structures, the exact evaluation of mechanical properties is very essential to enhance the reliability of their design and manufacturing. However, such methods as a tensile test and a resonance test, general methods to measure elastic moduli, cannot be applied to thin films since its thickness is so small. This work concerns guided wave based elastic modulus measurement method. To this end, guided wave excitation and detection system using a pulsed laser and a laser interferometry has been established. Also an elastic modulus extraction algorithm from the measured guided wave signal was developed. Finally, it was applied to actual thin film structures such as Ni-Si and Al-Si multilayers. From experimental results, we confirm that the proposed method has considerable feasibility to measure elastic properties of thin films.

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