• Journal of the Korean institute of surface engineering
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• v.25 no.1
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• pp.8-15
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• 1992

To investigate the effects of substrate on transverse-rupture strength(TRS) and bonding strength between substrate and TiC layer coated by CVD, two kinds of substrate (substrate A: WC-9.5wt% Co-MC＊[low C], substrate B: WC -6wt% Co-MC＊[high C]) were studied in terms of Cobalt and C contents respectively. For preparation of test samples the coating parameters of deposition time, deposition temperature and deposition pressure were varied. The results show that the carbon contents in substrates have greater effects on the TRS of the CVD TiC coated cemented carbide than Co contents in substrates. ＊MC:TiC+TaC

• Textile Coloration and Finishing
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• v.19 no.1 s.92
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• pp.45-52
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• 2007

Polyacrylonitrile(PAN) fiber was treated with low-temperature plasmas of argon and oxygen for surface modification, and its surface chemical structure and morphology were examined by a field emission scanning electron microscope(FESEM) and a Fourier-transform infrared microspectroscopy(IMS). The argon-plasma treatment caused the only mechanical effect by sputtering of ion bombardment, whereas the oxygen plasma brought about a chemical effect on the PAN fiber surface. The experimental evidences strongly suggested that cyclization of nitrile group and crosslinking were likely to occur in the oxygen-plasma treatment. On the other hand, with the argon-plasma treatment, numerous my pits resulted in ranging from several tens to hundreds nanometers in radius. The plasma sensitivity of functional groups such as C-H, $C{\equiv}N$, and O-C=O groups in the PAN fiber was dependent on their chemical nature of bonding in the oxygen-plasma, in which the ester group was the most sensitive to the plasma. Vacuum-ultraviolet(VUV) radiation emitted during plasma treatment played no substantial role to alter the surface morphology.

• Journal of the Korean Wood Science and Technology
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• v.21 no.1
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• pp.51-58
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• 1993

The phenol resorcinol formaldehyde resin (PRF) adhesives which are curing at ambient temperature for structural purposes were synthesized. A PRF resin is produced according to the two-stage reaction system. In first stage, a low-condensed resol or methylolated phenol were prepared from phenol by reaction with a formaldehyde in alkaline condition. The molar ratio of phenol to formaldehyde was 1.0~1.4. And in second-stage, resorcinol was added to combine with the methylol group of a low-condensed resol(R/P molar ratio 0.3). The glue-joint strength, pot-life and workability of this synthetic PRF resin were superior to conventional ambient temperature setting adhesives such as oilic urethane or water based polymer-isocyanate resin for wood adhesives.

• Journal of Adhesion and Interface
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• v.7 no.4
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• pp.60-64
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• 2006

In modern vehicle construction the search for means of weight reduction, improving durability, increasing comfort and raising body stiffness are issues of priority to the design engineer. The intelligent usage of many materials such as high strength steel, light-alloys and plastics enables a significant vehicle weight reduction to be achieved. The classical joining techniques used in the automobile industry need to be newly-evaluated since they often do not present workable solutions for such mixed-material connections, for example aluminium/steel. Calculation/simulation methods have made progress as a key factor for broader and more cost-effective implementation of structural bonding. This will lead to reduction of spotwelds and accelerate the car development. A special focus of the paper is the use of high strength steel grades. It will be shown that adhesive bonding is a key tool for yielding the potential of advanced high strength steel for low gauging without compromising the stiffness. The latest status of adhesive development has been described. Improvements with physical strength and glass temperature as well as of process relevant properties are shown. Also the situation regarding occupational hygiene is treated, showing that by further spotweld point reduction the emission around the working area can be even lowered against the current praxis. High performing lightweight design cannot longer do without high performing crash durable adhesives.

• Journal of Sensor Science and Technology
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• v.27 no.5
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• pp.300-305
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• 2018

The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.

• Structural Engineering and Mechanics
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• v.82 no.2
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• pp.163-172
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• 2022

Zinc-rich epoxy (ZRE) is used to overcome corrosion problems in reinforced concrete (RC) beams and coat steel rebars to protect them from humidity and chlorides. An extra coating layer of Sikadur-31 epoxy (SDE) is utilised to increase bond strength because the use of ZRE reduces the bond strength between concrete and steel rebars. However, the low melting point of SDE indicates that concrete specimens are vulnerable to fire. An experimental investigation on flexural performance of RC beams incorporating ZRE-SDE coating of steel rebars that were destroyed by fire is performed in this study. Twenty beams of five concrete mixes with different cementitious contents were tested to compare fire exposure for coated and uncoated rebars of the same beams at room temperature and determine the optimal cementitious content. Scanning electron microscopy (SEM) was also applied to investigate characteristics of fired mixture samples. Results showed that the use of SDE-ZRE at room temperature improves flexural strengths of the five mixes compared with uncoated rebars with percentages ranging from 8.5% to 12.3%. All beams with SDE-ZRE lost approximately 50% of their flexural strength due to firing. Moreover, the mix incorporating SF (silica fume) of 15% and cement content of 400 kg/m³ introduces optimum behaviour compared with other mixes. All results were supported and verified by the SEM analysis and compressive strength of cubic specimens of the same mixes.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.61-66
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• 2010

Cu-Cu thermo-compression bonding process was successfully developed as functions of the deposited Cu thickness and $Ar+H_2$ forming gas annealing conditions before and after bonding step in order to find the low temperature bonding conditions of 3-D integrated technology where the interfacial toughness was measured by 4-point bending test. Pre-annealing with $Ar+H_2$ gas at $300^{\circ}C$ is effective to achieve enough interfacial adhesion energy irrespective of Cu film thickness. Successful Cu-Cu bonding process achieved in this study results in delamination at $Ta/SiO_2$ interface rather than Cu/Cu interface.

• Journal of IKEEE
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• v.20 no.2
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• pp.205-208
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• 2016

In this paper, different types of touch screen silver pastes for bonding in conductive pattern formed over the ito film by bonding each sample of 5 was dried. The dry conditions, the oxidation of the ito film is a condition that does not occur. Reliability testing constant temp and humidity, cold-hot impact test is in progress. Each test will check the status of five sheets conductive pattern bonding. Conductive pattern bonding, after each 240,480,615 hours to check the status of silver pattern bonding. Reliability testing these through different silver pastes can see that the change in the adhesion and conductivity deterioration of the quality can be prevented, and reliability testing low temperature curing from the surface of silver pastes that can come as soon as the discoloration was unknown.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.2 s.39
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• pp.21-26
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• 2006

We developed a bonding at low temperature using fine pitch Sn and In bumps, and studied the reliability of the fine pitch In-Sn solder joints. The $30{\mu}m$ pitch Sn and In bumps were joined together at $120^{\circ}C$. A non conductive adhesive (NCA) was applied during solder joining. Thermal cycling test ($0^{\circ}C-100^{\circ}C$, 2 cycles/h) of up to 2000 cycles was carried out to evaluate the reliability of the solder joints. The bondability was evaluated by measuring the contact resistance (Rc) of the joints through the four point probe method. As the content of filler increased, the reliability improved in the solder joints during thermal cycling test because the contact resistance increased little. The filler redistributed the stress and strains from the thermal shock over the entire joint area.

• Transactions on Electrical and Electronic Materials
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• v.18 no.4
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• pp.181-184
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• 2017

Multilayer ceramics in which piezoelectric layers of $0.90Pb(Zr_{0.48}Ti_{0.52})O_3-0.05Pb(Mn_{1/3}Sb_{2/3})O_3-0.05Pb(Zn_{1/3}Nb_{2/3})O_3$ (0.90PZT-0.05PMS-0.05PZN) stack alternately with silver electrode layers were prepared by an advanced low-temperature co-fired ceramic (LTCC) method. The electrical properties and bonding strength of the multilayers were associated with the interface morphologies between the piezoelectric and silver-electrode layers. Usually, the inner silver electrodes are fabricated by sintering silver paste in multi-layer stacks. To improve the interface bonding strength, piezoelectric powders of 0.90PZT-0.05PMS-0.05PZN with an average particle size of $23{\mu}m$ were added to silver paste to form a gradient interface. SEM observation indicated clear interfaces in multilayer ceramics without powder addition. With the increase of piezoelectric powder addition in the silver paste, gradient interfaces were successfully obtained. The multilayer ceramics with gradient interfaces present greater bonding strength as well as excellent piezoelectric properties for 30~40 wt% of added powder. On the other hand, over addition greatly increased the resistance of the inner silver electrodes, leading to a piezoelectric behavior like that of bulk ceramics in multilayers.