• Journal of Welding and Joining
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• v.15 no.4
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• pp.136-142
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• 1997

In this study, the amorphous foil filler, thickness of 20 - $20~30\mu\textrm{m}$ was made to develop Cu-7.5wt%Mn-7.5wt%Si insert alloy(melting point temperature : solidus line 1003K, liquidus line 1070K). Liquid phase diffusion bonding of 304 stainless steels (STS304), is carried out successfully by using developed Cu-7.5Mn-7.5Si insert alloy. Bonding conditions are taken from bonding pressure of 5MPa, bonding temperatures from 1073K to 1423K varied within 50K and brazing holding times of 0, 30, 60 and 240 minutes. As the results, the tensile strength in the liquid phase diffusion bonding is a little bit lower than that in the solid phase diffusion bonding. The authors find out that the liquid phase diffusion bonding needs lower bonding pressure than the others. Therefore, the liquid phase diffusion bonding had an excellent brazability in which the bonding process showed the typical mechanism of diffusion bonding. In corresponding, the new developed insert alloy of low melting pointed Cu-7.5Mn-7.5Si makes possible brazing between the STS304.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.73-73
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• 2009

In this sutdy, a new class ACA(Anisotropic Conductive Adhesive) with low-melting-point alloy(LMPA) and self-organized interconnection method were developed. This developed self-organized interconnection method are achieved by the flow, melting, coalescence and wetting characteristics of the LMPA fillers in ACA. In order to observe self-interconnection characteristic, the QFP($14{\times}14{\times}2.7mm$ size and 1mm lead pitch) was used. Thermal characteristic of the ACA and temperature-dependant viscosity characteristics of the polymer were observed by differential scanning calorimetry(DSC) and torsional parallel rheometer, respectively. A electrical and mechanical characteristics of QFP bonding were measured using multimeter and pull tester, respectively. Wetting and coalescence characteristics of LMPA filler particles and morphology of conduction path were observed by microfocus X-ray inspection systems and cross-sectional optical microscope. As a result, the developed self-organized interconnection method has a good electrical characteristic($2.41m{\Omega}$) and bonding strength(17.19N) by metallurgical interconnection of molten solder particles in ACA.

• Nuclear Engineering and Technology
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• v.47 no.3
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• pp.227-239
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• 2015

The thermal, mechanical, and neutronic performance of the metal alloy fast reactor fuel design complements the safety advantages of the liquid metal cooling and the pool-type primary system. Together, these features provide large safety margins in both normal operating modes and for a wide range of postulated accidents. In particular, they maximize the measures of safety associated with inherent reactor response to unprotected, doublefault accidents, and to minimize risk to the public and plant investment. High thermal conductivity and high gap conductance play the most significant role in safety advantages of the metallic fuel, resulting in a flatter radial temperature profile within the pin and much lower normal operation and transient temperatures in comparison to oxide fuel. Despite the big difference in melting point, both oxide and metal fuels have a relatively similar margin to melting during postulated accidents. When the metal fuel cladding fails, it typically occurs below the coolant boiling point and the damaged fuel pins remain coolable. Metal fuel is compatible with sodium coolant, eliminating the potential of energetic fuel-coolant reactions and flow blockages. All these, and the low retained heat leading to a longer grace period for operator action, are significant contributing factors to the inherently benign response of metallic fuel to postulated accidents. This paper summarizes the past analytical and experimental results obtained in past sodium-cooled fast reactor safety programs in the United States, and presents an overview of fuel safety performance as observed in laboratory and in-pile tests.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.3
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• pp.88-94
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• 2002

Recently, the life cycle and the lead-time of a product are to be shortened in order to satisfy consumer's demand. It is thus important to reduce the time and cost in manufacturing trial products. Several technique have been developed and successfully commercialized in the market of RPM(Rapid Prototyping and Manufacturing). However, most commercial systems currently use resins or waxes as the raw materials. So, the limited mechanical strength for functional testing is regarded as an obstacle towards broader application of rapid prototyping techniques. To overcome these problems, high-speed machining technology is being investigated worldwide for rapid manufacturing and even for direct rapid tooling application. In this paper, some fundamental experiments and analyses are carried out to obtain the filling time, materials, method, and process parameters for HisRP(High-Speed RP) process. HisRP is a new RP process that is combined high-speed machining with automatic filling. In filling process, Bi58-Sn alloy is chosen as filling material because of the properties of low-melting point, low coefficient of thermal expansion and no harm to environment. Also the use of filling wire it if advantage since it needs simple and flexible mechanism. Then the rapid product, for example a skull, is manufactured for aluminum material by HisRP process with an automatic set-up device thor 4-faces machining.

• Journal of the Korean Academy of Esthetic Dentistry
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• v.3 no.1
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• pp.32-43
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• 1995

Ni-Ti alloy has excellent corrosion resistance, biocompatibility, shape memory effect and superelasticity, so it has been used widely in biomedical fields. But it has difficulty in casting due to its high melting temperature and oxygen affinity at high temperature. Recently it has been attempted to cast Ni-Ti alloy using new casting machine and investment. The purpose of this study was to examine the superelastic behavior of cast shape memory Ni-Ti alloy and to compare the mechanical properties of the cast shape memory alloy with those of commercial alloys for removable partial denture framework. Ni-Ti alloy(Ni 50.25%, Ti 49.75% : atomic ratio) was cast with dental argon-arc pressure casting machine and Type IV gold alloy, Co-Cr alloy, Ni-Cr alloy, pure titanium were cast as reference. Experimental cast Ni-Ti alloy was treated with heat($500{\pm}2^{\circ}C$) in muffle furnace for 1 hour. Transformation temperature range of cast Ni-Ti alloy was measured with differential scanning calorimetry. The superelastic behavior and mechanical properties of cat Ni-Ti alloy were observed and evaluated by three point bending test, ultimate tensile test, Vickers microhardness test and scanning electron microscope. The results were as follows : 1. Cast Ni-Ti alloy(Ni 50.25%, Ti 49.75% : atomic ratio) was found to have superelastic behavior. 2. Stiffness of cast Ni-Ti alloy was considerably lesser than that of commercial alloys for removable partial denture. 3. Permanent deformation was observed in commercial alloys for removable partial denture framework at three point bending test over proportional limit(1.5mm deflection), but was not nearly observed in cast Ni-Ti alloy. 4. On the mechanical properties of ultimate tensile strength, elongation and Vickers microhardness number, cast Ni-Ti alloy was similiar to Type IV gold alloy, Co-Cr alloy, Ni-Cr alloy and pure titanium. With these results, cast Ni-Ti alloy had superelastic behavior and low stiffness. Therefore, it is suggested that cast Ni-Ti alloy may be applicated to base metal alloy for removable partial denture framework.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1989.06a
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• pp.111-113
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• 1989

This paper reports the optical characteristics of TeS$_{5}$ Ge$_{5}$ thin film. In phase diagram, TeS$_{5}$ Ge$_{5}$ has the eutetic point with the loweat melting point. Therfore, TeS$_{5}$ Ge$_{5}$ thin film will be melted by Diode Laser with low energy. TeS$_{5}$ Ge$_{5}$ thin films start to change the phase from amorphous to crystalline near 10$0^{\circ}C$, but perfectly change the phase at 28$0^{\circ}C$. As-deposit TeS$_{5}$ Ge$_{5}$ thin film start to change the phase to crystalline in enviroment og 66$^{\circ}C$ 80%RH.circ}C$ 80%RH.

• Journal of Welding and Joining
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• v.29 no.4
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• pp.80-84
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• 2011

In the 5xxx series Al-Mg alloy, magnesium addition can increase the strength of aluminum alloy by solid solution strengthening but it has a relatively low melting and boiling temperature. During full -penetration laser welding of the Al-Mg alloys, its low boiling point and high vapor pressure brings about the spiky humping bead on the bottom side. Under back-side shielding, the spiking of back bead can be reduced but it restraints the process flexibility. In this study, a square pulse waveform modulation was employed to stabilize keyhole and back bead surface without back-side shielding. By using an experimental design, the bead shapes were evaluated for various process parameters such as the focal position, welding velocity and waveform parameters and the smooth back bead shape could be achieved.

• Tribology and Lubricants
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• v.36 no.4
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• pp.207-214
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• 2020

In this study, we investigated the effects of copper and copper-alloy on the frictional and wear properties of low-steel friction material. The proportions of copper and copper-alloy in the brake friction materials used in passenger cars are very high (approximately 5-20% weight), and these materials have significant effects on friction and wear characteristics. In this study, the effects of cupric ingredients, such as the copper fiber and brass fiber, are investigated using the friction materials based on commercial formulations. After the copper and brass fibers from the same formulation were removed, the frictional and wear characteristics were evaluated to determine the influence of the copper and copper-alloy. We evaluated the frictional and wear characteristics by simulating various braking conditions using a 1/5 scale dynamometer. The results show that the friction material containing copper and brass fibers have excellent frictional stability and a low wear rate compared to the friction material that does not contain copper and brass fibers. These results are attributed to the excellent ductility, moderate melting point, high strength, and excellent thermal conductivity of copper and copper-alloy. We analyzed the surfaces of the friction materials before and after the performing the friction tests using a scanning electron microscope-energy dispersive X-ray spectroscope, confocal microscope, and roughness tester to verify the frictional behavior of copper and copper-alloy. In future studies, it will be applied to the development of copper-free friction materials based on the results of this study.

• Journal of the Semiconductor & Display Technology
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• v.15 no.4
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• pp.10-15
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• 2016

In this paper, novel ball grid array (BGA) interconnection process using solderable anisotropic conductive adhesives (SACAs) with low-melting-point alloy (LMPA) fillers have been developed to enhance the processability in the conventional capillary underfill technique and to overcome the limitations in the no-flow underfill technique. To confirm the feasibility of the proposed technique, BGA interconnection test was performed using two types of SACA with different LMPA concentration (0 and 4 vol%). After the interconnection process, the interconnection characteristics such as morphology of conduction path and electrical properties of BGA assemblies were inspected and compared. The results indicated that BGA assemblies using SACA without LMPA fillers showed weak conduction path formation such as solder bump loss or short circuit formation because of the expansion of air bubbles within the interconnection area due to the relatively high reflow peak temperature. Meanwhile, assemblies using SACA with 4 vol% LMPAs showed stable metallurgical interconnection formation and electrical resistance due to the favorable selective wetting behavior of molten LMPAs for the solder bump and Cu metallization.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.1-7
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• 2017

Aluminum alloys have been widely used in many fields such as electronic, structure, aero-space and vehicle industries due to their outstanding thermal and electrical conductivity as well as low cost. However, they have some difficulties for using in brazing process because of the strong oxide layer of $Al_2O_3$ on the surface of Al alloy. In addition, their melting point is similar to that of brazing filler metal resulting in thermal damage of Al alloys. Therefore, it is very important to understand the brazing principles, filler metal and its properties such as wetting, capillary flow and dissolution of base metal in the Al brazing process. This paper reviews the brazing principles, aluminum alloys, and brazing fillers. In the case of brazing principle, some formula was used for calculation of capillary force and the dissolution to obtain the best condition of Al brazing. In addition, the advanced research trends in Al brazing were introduced including thermal treatment, additive for improving property and decreasing melting point in Al brazing process.