• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.725-727
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• 2009

Lowering the dielectric constant is one of the important issues for the efficiency and the power consumption in the plasma display panel (PDP) industry. This study examined the effect of the addition of ceramic filler (up to 10% of crystalline and amorphous silica, respectively) to a $B_2O_3$-ZnO- $P_2O_5$ glass matrix on the dielectric, coefficient of thermal expansion, etching behaviors and residual stress for the barrier ribs in plasma display panels. The dielectric constant of barrier ribs is affected by containing two types of $SiO_2$ filler for the barrier rib composition in PDP.

• Journal of the Korean Ceramic Society
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• v.40 no.7
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• pp.615-619
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• 2003

Temperature and frequency dependence of dielectric and electrical properties was investigated in cerium and manganese doped Sr$\_$0.6/Ba$\_$0.4/Nb$_2$O$\_$6/(60SBN) ceramic system. Structural deformation of 60SBN by dopants did not appeared. 1350$^{\circ}C$-10 h sintered specimen had higher densification than 1250$^{\circ}C$-10 h sintered one, to which dielectric properties are related. That the feature of dielectric maxima peaks was typical Diffusive Phase Transition (DPT), it was explained by "random-field Ising model". Even though 60SBN has large dielectric loss at high frequency above 100 ㎑, it is desirable for optical applications because of low dielectric loss at low frequency. From Arrhenius plot of temperature, the activation energy was calculated to 0.45-0.49 eV.

• Transactions on Electrical and Electronic Materials
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• v.13 no.6
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• pp.322-325
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• 2012

Crystalline silica was synthesized by annealing amorphous silica at $1,300^{\circ}C$ or $1,400^{\circ}C$ for various times, and the crystallinity was estimated by X-ray diffraction (XRD) analysis. In order to prepare a low dielectric material, epoxy/crystalline silica composites were prepared, and the effect of silica content on the dielectric properties was studied under various functions of frequency and ambient temperature. The dielectric constant decreased with increasing crystalline silica content in the epoxy composites, and it also decreased with increasing frequency. At 120 Hz, the value of 5 wt% silica decreased by 0.25 compared to that of 40 wt% silica, and at 23 kHz, the value of 5 wt% silica decreased by 0.23 compared to that of 40 wt% silica. The value increased with increasing ambient temperature.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.31-34
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• 2009

We investigated the effect of relative dielectric constant of front dielectric layer on the efficacy of plasma display panel. Dielectric materials with relative dielectric constant of around 6 and 7 were developed. When the front dielectric layer had a low relative dielectric constant, power consumption decreased more than luminance did. And it led to efficacy enhancement. However, the minimum sustain voltage increased.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.611-615
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• 2003

The crystalline and dielectric properties on $Al_2O_3$ filled glass frit ($CaO-Al_2O_3-SiO_2-MgO-B_2O_3$) with admixtures of $TiO_2$ have been investigated. The dielectric constant value of $7.5{\sim}7.8$, quality factor value of 700 were obtained for glass frit : $Al_2O_3$ (50 : 50 wt%) ceramics. As the amount of $TiO_2$ increased, temperature coefficient of dielectric constant were decreased.

• Journal of the Semiconductor & Display Technology
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• v.7 no.4
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• pp.35-39
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• 2008

We studied deposition of low-k SiOCH dielectric film by PECVD. DEMS(diethoxymethlysilane) precursor, which has two ethoxy groups along with one methyl group attached to the silicon atoms, was used as precursor. The SiOCH film was deposited as a function of oxygen flow rates ranging from 0 to 100sccm. The deposition rate($\AA$/min) of SiOCH film was increased due to the increase of oxygen radical as a function of $O_2$ flow rates. The dielectric constant was decreased from 3.0 to 2.77, as the film was annealed at $450^{\circ}C$ for 30 min. So, it could account that the dielectric constant changes sensitively with $O_2$ flow rates. Also, the leakage current of the annealed film exhibited stable curve than that of asdeposited. These results were caused by the increase of Si-O-Si group and decrease of Si-CH group and OH group within the film by annealing.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.727-729
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• 2007

Inorganic-organic hybrid polymer provides various advantages including low-temperature process, high dielectric constant and direct photo-patterning. The hybrid dielectric was synthesized by the sol-gel process in which an acid-catalyzed solution of Si alkoxide and Zr alkoxide was used as a precursor. The electrical performance of transistors with hybrid dielectric was investigated.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.328-328
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• 2008

As a low K material for high frequency high integration modules, glass/ceramic composites were investigated. Glass composition were selected from $SiO_2-B_2O_3-Al_2O_3-R_2O$-RO system which having very low dielectric constant and cordierite was used as a ceramic filler. These composites were sintered at temperature range from $850^{\circ}$ to $950^{\circ}$ and XRD, SEM microstructure analysis of sintered bodies were performed for understanding sintering behavior. Any crystallization was not occurred and dense sintered bodies were attained. Dielectric and mechanical properties of these sintered glass/cordierite composites were analysed by network analyzer and UTM. Glass/ceramic composite with 50 wt% cordierite showing a dielectric constant (${\varepsilon}_r$) of 5.4, Q${\times}f_0$ (Q) of 1600 at 1 GHz and maximum bending strength of 163 MPa was attained.

• Bulletin of the Korean Chemical Society
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• v.35 no.10
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• pp.2941-2944
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• 2014

The electrical and mechanical properties of the plasma polymerized low dielectric constant SiCOH films were investigated. The SiCOH films were produced with tetrakis(trimethylsilyloxy)silane and cyclohexane as precursors by using a plasma enhanced chemical vapor deposition. When the deposition plasma powers were changed from 10 to 50 W, the relative dielectric constant of the SiCOH film increased from 2.09 to 2.76 and their hardness and elastic modulus were changed from 1.6 to 5.6 GPa and from 16 to 44 GPa, respectively. After thermal annealing at $500^{\circ}C$, the annealed SiCOH films showed relative dielectric constants of 1.80-2.97, a hardness of 0.45-0.6 GPa and an elastic modulus of 6-7 GPa. And then, the chemical structures of as-deposited and annealed SiCOH films were analyzed by using Fourier transform infrared spectroscopy.

• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.1
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• pp.17-24
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• 2014

In this paper, we analysed coupling coefficient between dielectric resonator of high dielectric constant and microstrip line to design for low phase noise dielectric resonator by direct coupling. Also we analysed phase noise of dielectric resonance oscillator with parallel feedback circuit to complement Q by high dielectric constant. We obtained a result from high-stability dielectric oscillator which is optimum designed through analysis of dielectric resonance oscillator phase noise and coupling coefficient. The result is that the phase noise was -83.3dBc/Hz@1KHz at 20.25GHz when we used about 3.6 coupling coefficient and ${\epsilon}_r$=30 dielectric resonator of 20.25GHz dielectric resonance oscillator. As a result, we suggested the direct-connect design method by frequency multiplication mode to prevent phase noise loss at K-Band.