• 한국세라믹학회지
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• 제31권4호
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• pp.381-388
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• 1994

A new process which co-fires the low-firing-substrate and copper conductor was studied to achieve good bond strength and low sheet resistance of conductor. Cupric oxide is used as the precursor of conductive material in the new method and the firing atmosphere of the new process is changed sequently in air H2N2. The addition of cupric oxide and variations of firing atmosphere permited complete binder-burnout in comparison with the conventional method and contributed to the improvement of resistance and bonding behaviors. The potimum conditions of this experiment to obtain the satisfactory resistance and bond strength are as follows (binder-burnout temperature in air; 55$0^{\circ}C$, reducing temperature in H2; 40$0^{\circ}C$ for 30 min, ratio of copper and cupric oxide; 60:40~30:70 wt%). The bonding mechanism between the substrate and metal was explained by metal diffusion layer in the interface and the bond strength mainly depended on the stress caused by the difference of shrinkage and thermal expansion coefficient between the substrate and metal.

• 한국세라믹학회지
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• 제32권5호
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• pp.601-607
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• 1995

The bond strength between the low-firing-substrate and Cu conductor depended on the softening point and the amount of frit added to the metal paste. The addition of 3 wt% frit (softening point: 68$0^{\circ}C$) to the metal paste resulted in the improvement of bond strength, which was approximately 3 times higher (3kg/$\textrm{mm}^2$) than that of non frit condition. It was also found that fracture surface shifted to the ceramic substrate in the interface region. These phenomena were attributed to the frit migration into the metal-ceramic interface. It was thought that the migration of glass frit occurred extensively when the softening point of glass firt was 68$0^{\circ}C$. The sheet resistance of Cu conductor remained constant by the addition of 4 wt% frit regardless of softening point of frit. For all samples with more than 4 wt% frit, the sheet resistance increased abruptly.

• 한국재료학회지
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• 제14권10호
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• pp.731-736
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• 2004

Herein, we report on the co-firing of a low-K wiring substrate and a middle-K functional substrate in LTCC. Firstly, we researched the sintering behavior and dielectric properties of the low-k wiring substrate comprised by alumina and glass frit with ${\varepsilon}_r$, of $\sim7$ and the middle-k functional substrate comprised by $Ba_{5}Nb_{4}O_{15}$ and glass frit with ${\varepsilon}_r$, of $20\sim30$. The warpage and delamination between the hetero layers of the low-K and the middle-K composition were also studied. In particular, physical matching of the hetero layers could be possible by adjusting of the sintering properties of the composition. We observed that an introduction of the glass frit to the low- and middle-K substrate gives rise to a minimization of an effect given by separation of the hetero layers, and modification of the fraction of the glass frit accompanied by a variation of the composition could control the sintering behavior and its beginning temperature. In the case of co-firing of the L03 as the low-K wiring substrate composition and the M03 as the middle-K functional substrate composition at $875^{\circ}C$, we could fabricate a desirable structure of hetero layers without any kinds of structural defects such as separation, warpage, delamination, pore trap, etc. We suppose that the co-firing techniques described in this study would provide a helpful method to fabricate a LTCC multi-functional for the next generation.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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• pp.673-676
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• 1999

We fabricated green sheet by tape casting method with fluormica glass-ceramic powders for fabrication of low temperature co-firing substrate. After ball milling with organic additives, we investigated green strength and density of green sheets which were casted by doctor blade machine. Green sheets were sintered at 700 ~ 1,00$0^{\circ}C$ for 1 ~3hrs. Microstructure, linear shrinkage and dielectric constant of substrates were surveyed.

• 한국세라믹학회지
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• 제29권10호
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• pp.827-835
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• 1992

The effects of CeO2 on the properties of cordierite-based glass-ceramics and its applicability to low firing temperature substrate were examined. Glass-ceramics were prepared by sintering the glass powder compacts at 900~100$0^{\circ}C$ for 3 h. Density, bending strength, dielectric constant and thermal expansion coefficient of the glass-ceramics were measured as functions of CeO2 contents and sintering temperatures. By adding CeO2, dense glass-ceramics were obtained below 100$0^{\circ}C$. dielectric constant and bending strength were more dependent on the porosity of glass-ceramics containing 5 wt% CeO2, sintered at 100$0^{\circ}C$ for 3 h, were as follows; relative density is 95.3%, bending strength is 178$\pm$11 MPa, dielectric constant is 4.98$\pm$0.20 (at 1 MHz) and thermal expansion coefficient is 33.7$\times$10-7/$^{\circ}C$. Therefore, the glass-ceramics containing 5 wt% CeO2 appeared to be suitable for low firing temperature substrate of electronic devices.

• 한국세라믹학회지
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• 제30권10호
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• pp.845-851
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• 1993

Low firing temperature substrate were synthesized through tape casting and sintering of glass with cordierite composition and then their properties were investigated. Even though the dielectric properties and XRD patterns of substrates, obtained by tape casting and sintering at 900~100$0^{\circ}C$ for various periods, were similar to those of substrates obtained by dry pressing, the sinterability was enhanced. The substrates were thin and the size was 0.6$\times$50$\times$50mm. From the results of dielectric properties, the sinterability and X-ray diffraction pattern, the proper condition for cofiring process with conductor, Cu, was 90$0^{\circ}C$ for 1h. The properties of the substrate are as follows; the dielectric constant was 5.31(at 1MHz), the dissipation factor was 0.0028, the apparent porosity was 0.28% and the main crystalline phase was $\alpha$-cordierite.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 1999년도 추계 기술심포지움 논문집
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• pp.111-115
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• 1999

The $Li_2O-MgO-MgF_2-SiO_2$glasses with addition of $B_2O_3$ were investigated in order to make glass-ceramics for low temperature firing substrate. Glasses were made by melting at $1450^{\circ}C$ in the electronic furnace and crystallized at $750^{\circ}C$. After the crystallization, crystal phases and microstructure were observed. The crystal phases were polycrystalline of lithium boron fluorphlogopite and lithium fluorhectorite. The crystal shape was changed to grande type from needle type with the increase in $B_2O_3$ contents. Average particle size of the glass-ceramics aftar water swelling was $3.77{\mu}{\textrm}{m}$. The optimum sintering temperature and sintering shrinkage of the substrate were $900^{\circ}C$ and 13.4vol%, respectively.

• 마이크로전자및패키징학회지
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• 제6권4호
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• pp.35-39
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• 1999

The $Li_2O-MgO-MgF_2-SiO_2$glasses with addition of $B_2O_3$ were investigated in order to make glass-ceramics for low temperature firing substrate. Glasses were made by melting at $1450^{\circ}C$ in the electronic furnace and crystallized at $750^{\circ}C$. The crystal phases were polycrystalline of lithium boron fluorphlogopite and lithium fluorhectorite. The crystal shape was chanced to granule type from needle type with increasing $B_2O_3$ content. Average particle size of the glass-ceramics after water swelling was 3.77$\mu\textrm{m}$. The optimum sintering temperature and sintering shrinkage of the substrate were $900^{\circ}C$ and 13.4%, respectively.

• 한국재료학회지
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• 제12권8호
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• pp.595-599
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• 2002

A homogeneous and stable, amorphous-type, anorthite (CaO $Al_2$$O_3$ $2SiO_2$)powder was synthesized by an organic-inorganic steric entrapment route. Polyvinyl alcohol ( PVA) was used as an organic carrier for the precursor ceramic gel. The PVA content, its degree of polymerization and type of silica sol had a significant influence on the calcination and crystallization behavior of the precursors. For densifiction and crystallization at low temperature, porous and soft, amorphous-type anorthite powder was planetary milled for 20h. The milled powder crystallized to stable anorthite phase and densified to a relative density of 94% below $1000^{\circ}C$. In the development of crystalline phases of the planetary milled powder, omisteinbergite phase was unusually observed at $900^{\circ}C$, and then anorthite was observed at $950^{\circ}C$. The sintered anorthite had a thermal expansion coefficient of $4.6$\times$10^{-6}$ /$^{\circ}C$ and a dielectric constant of 7.5 at 1 MHz. Finally, the anorthite synthesized by the new process is expected to be an useful material for low-firing ceramic substrate.

• 한국세라믹학회지
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• 제31권4호
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• pp.427-435
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• 1994

Cu-metallized low firing temperature substrates were synthesized by cofiring green sheet of cordierite-based glass with Cu. By Sol-Gel method, Cu powder was coated with borosilicate gel which should act as a glass frit in Cu paste during cofiring. Theoretical weight ratios of Glass/Cu were controlled to be 2.5, 5, 10 and 15% by varying alkoxide concentrations. Average particle size of coated Cu was 0.629~0.674 ${\mu}{\textrm}{m}$ in comparison to that of as-received Cu(0.596 ${\mu}{\textrm}{m}$), which increased with alkoxide concentration but did not increase above certain concentration. The weight ratios of coated layer were 2.11~5.37%. The properties of Cu-metallized low firing temperature substrate, cofired at 90$0^{\circ}C$ for 1h under H2/N2 atmosphere, were as follows; sheet resistance was 13~43 m{{{{ OMEGA }}/$\square$, adhesion strength was 1.0~2.1 kgf/$\textrm{mm}^2$. From the observations of SEM photographs, the gel coated on Cu performed excellently as a glass frit.