• Journal of the Korean Ceramic Society
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• v.46 no.2
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• pp.200-210
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• 2009

It is necessary to minimize the mismatch of sintering shrinkage between dielectric ceramic and Ni inner electrode layers for the purpose of developing the ultra high-capacity multi layered ceramic condenser(MLCC). Thus, low temperature sintering of dielectric $BaTiO_3$ ceramic should be precedently investigated. In this work, the influence of the milling condition on sintering behavior and electrical properties of $BaTiO_3$ ceramics was investigated in the $BaTiO_3$(BT)-Mg-Dy-Mn-Ba system with borosilicate glass as a sintering agent. As milling time increased, specific surface area(SSA) of the powder increased linearly, while both sinterability and dielectric property were found to be drastically decreased with an increasing SSA. It was also revealed that the sinterability of the excessively milled $BaTiO_3$ ceramics could be recovered by increasing Ba content, rather than increasing glass addition. These results suggest that the sintering behavior of $BaTiO_3$ ceramics under the high SSA was more strongly dependent on the transient liquid phase caused by Ba addition, than the liquid phase from additional glass.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 1994.04c
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• pp.7-7
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• 1994

For more than a decade components of low alloy iron powder with nickel and/or molybdenum for general engineering applications have been manufactured from powder metal. In the time to come such PM steel components will gain increasing significance. Because of various manufacturing difficulties they are mostly produced in two separate steps - sintering and hardening - which means high energy and labour requirements. The paper describes how such PM components are produced in just one run through a conveyor belt furnace with automatic atmosphere control and gas quenching zone. Energy and labour costs are low and reproducible quality is exceilent. The mechanical properties obtained with some powder alloys are presented as well.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.274-275
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• 2007

In this study, in order to develop low temperature sintering ceramics for multilayer piezoelectric actuator application. At the PMN-PZN-PZT ceramics, the influence of the ball-mill time on piezoelectric characteristics was investigated. All the specimens improved according to the increase of the ball-mill time increase. The specimen showed the optimum value when ball-mill time is 60 hour. Their optimum values were density=$7.93g/m^3$, ${\varepsilon}_r=1371$, kp=0.551, Qm=1609, $d_{33}=321pC/N$, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.288-289
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• 2007

In this study, in order to develop low temperature sintering ceramics for multilayer piezoelectric actuator application, PMN-PZN-PZT ceramics were manufactured as a function of the amount of CuO addition and their dielectric and piezoelectric characteristics were investigated. With the amount of CuO addition, the physical characteristics of specimens decreased. The specimens showed the optimum value at 0.5wt%CuO addition. Their optimum values were density=$7.93g/m^3$, ${\varepsilon}_r$=1398, kp=0.560, Qm=1706, $d_{33}$=327pC/N, respectively.

• Korean Journal of Materials Research
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• v.30 no.2
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• pp.93-98
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• 2020

Effective control of the heat generated from electronics and semiconductor devices requires a high thermal conductivity and a low thermal expansion coefficient appropriate for devices or modules. A method of reducing the thermal expansion coefficient of Cu has been suggested wherein a ceramic filler having a low thermal expansion coefficient is applied to Cu, which has high thermal conductivity. In this study, using pressureless sintering rather than costly pressure sintering, a polymer solution synthesis method was used to make nano-sized Cu powder for application to Cu matrix with an AlN filler. Due to the low sinterability, the sintered Cu prepared from commercial Cu powder included large pores inside the sintered bodies. A sintered Cu body with Zn, as a liquid phase sintering agent, was prepared by the polymer solution synthesis method for exclusion of pores, which affect thermal conductivity and thermal expansion. The pressureless sintered Cu bodies including Zn showed higher thermal conductivity (180 W/m·K) and lower thermal expansion coefficient (15.8×10^-6/℃) than did the monolithic synthesized Cu sintered body.

• Korean Journal of Materials Research
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• v.19 no.12
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• pp.680-685
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• 2009

Using a polyurethane foam replica method, porous hydroxyapatite scaffolds (PHS) were fabricated using conventional and microwave sintering techniques. The microstructure and material properties of the PHS, such as pore size, grain size, relative density and compressive strength, were investigated at different sintering temperatures and holding times to determine the optimal sintering conditions. There were interconnected pores whose sizes ranged between about 300 ${\mu}m$ and 700 ${\mu}m$. At a conventional sintering temperature of 1100$^{\circ}C$, the scaffold had a porous microstructure, which became denser and saw the occurrence of grain growth when the temperature was increased up to 1300$^{\circ}C$. In the case of microwave sintering, even at low sintering temperature and short holding time the microstructure was much denser and had smaller grains. As the holding time of the microwave sintering was increased, higher densification was observed and also the relative density and compressive strength increased. The compressive strength values of PHS were 2.3MPa and 1.8MPa when conventional and microwave sintering was applied at 1300$^{\circ}C$, respectively.

• Journal of Sensor Science and Technology
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• v.30 no.3
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• pp.148-153
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• 2021

During the manufacture of a ZnS lens with excellent transmittance in the mid-infrared region (3-5 ㎛) by the hot-press process, a single-layer sintering method is used in which one lens is manufactured in one process. Additional research is required to improve this single-layer sintering method because of its low manufacturing efficiency. To solve this problem, the variation in optical properties of ZnS lenses with change in sintering temperature was investigated by introducing a Stack sintering method that can sinter multiple lenses simultaneously. A carbon paper was placed between the molded lenses and sintered into five layers. The average permeability of 67% at medium infrared wavelengths of 3-5 ㎛ was excellent under the following sintering conditions: pressure of 50 MPa and temperature of 850℃. This value is 1% less than the average permeability in the case of single-layer sintering of the ZnS lens. It was confirmed that the stack sintering method developed in this study can be used to manufacture a large number of lenses with excellent characteristics in a single process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.328-329
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• 2009

This paper presents the effect of organic Ag complex sintering temperature on the MEH-PPV photoluminescence (PL) properties. MEH-PPV and organic Ag complex was coated on the glass substrate by spin coating method. The coated Ag complex was sintered in an air atmosphere. The sintering temperature was varied from 100 to $200^{\circ}C$ and sintering time was 5 min. The Ag film sintered at temperature higher than $120^{\circ}C$ shows very low sheet resistance less than $0.5\;{\Omega}{/\square}$. The coated MEH-PPV measure photoluminescence (PL) intensity at 580 nm. The PL peak was shifted to the higher wavelength with increasing the sintering temperature.

• Journal of the Korean Ceramic Society
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• v.29 no.12
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• pp.956-962
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• 1992

The predominant sintering mechanisms of low firing temperature ceramic substrate which consists of borosilicate glass containing alumina as a filler are the rearrangement of alumina particles and the viscous flow of glass powders. In this system, sintering condition depends on the volume ratio of alumina to glass and on the particle size. When the substrate contains about 35 vol% alumina filler and the average alumina particle size is 4 $\mu\textrm{m}$, the best firing condition is obtained at the temperature range of 900∼1000$^{\circ}C$. The extensive rearrangement behavior occurs at these conditions, and the optimum sintering condition is attained by smaller size of glass particles, too. The formation of cristobalite during sintering causes the difference of thermal expansion coefficient between the substrate and Si chip. This phenomenon degradates the capacity of Si chip. Therefore, the crystallization should be prevented. In the alumina filled borosilicate glass system, the crystallization does not occur. This effect may have some relation with aluminum ions in alumina. For aluminum ions diffuse into glass matrix during sintering, functiong as network former.

• Journal of the Korean Ceramic Society
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• v.27 no.3
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• pp.337-344
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• 1990

As a function of sintering temperature and time, the electrical properties of ruthenium based thick film resistors were investigated with microstructure. The variatio of resistivity and TCR(temperature coefficient of resistance)trends of sintered speciman at various sintering temperature were different low resistivity paste(Du Pont 1721) from high one(Du Pont 1741). These phenomena are deeply relative to microstructure of sintered film. With increasing the sintering temperature for 1721 system, the electrical sheet resistivity decreased, but again gradually increased above 80$0^{\circ}C$. And TCR trends in 1721 system are all positive. On the other hand the electrical sheet resistivity of 1741 resistor system decreased with sintering temperature. And TCR trends variable according to sintering temperature. TCR of speciman sintered at $700^{\circ}C$ was negative value, and TCR of 80$0^{\circ}C$ sintered speciman coexisted negative and positive value. But in case of speciman sintered at 90$0^{\circ}C$, TCR was positive value. As results of this fact, it was well known that the charge carrier contributied to electrical conduction in 1741 resistor system varied with sintering temperature.