• 한국진공학회지
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• 제7권3호
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• pp.167-272
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• 1998

ECR plasma CVD를 이용한 SiOF박막은 낮은 유전상수를 가지고 있으며, 기존의 공정과의 정합성이 우수해 다층배선 공정에 채용이 유망한 재료이지만 수분의 흡수로 인한 유전율의 상승과 후속공정의 안정성이 문제점으로 부각되고 있다. 따라서 본 연구에서는 SiOF박막의 내흡습성과 후속공정에서의 안정성을 향상시키기 위하여 SiOF박막을 증착한 후 후속 산소 플라즈마 처리를 행하였다. SiOF박막은 산소 플라즈마 처리를 수행함으로써 SiOF박막의 밀도가 증가하고, 수분과의 친화력이 강한 Si-F 결합이 감소하는 것이 주요한 원인으로 사료된다. 하지만 플라즈마 처리 시간이 5분 이상으로 증가하면 유전율의 증가가 일어난다. 따라서 본 실험에서는 산소 플라즈마 처리조건이 마이크로파 전력이 700W, 공정 압력이 3mTorr, 기판온도가 $300^{\circ}C$일 경우 플라즈마 처리시간은 3분이 적당한 것으로 생각 된다.

• 한국세라믹학회지
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• 제43권6호
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• pp.338-343
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• 2006

The effects of lead-borosilicate glass frits on the sintering behavior and microwave dielectric properties of ceramic-glass composites were investigated as functions of glass composition of glass addition ($10{\sim}50vol%$), softening point (Ts) of the glass, and sintering temperature of the composites ($500{\sim}900^{\circ}C$ for 2 h). The addition of 50 vol% glass ensured successful sintering below $900^{\circ}C$. Sintering characteristics of the composites were well described in terms of Ts. PbO addition in to the glass enhanced the reaction with $Al_{2}O_3$ to form liquid phase and $PbAl_{2}Si_{2}O_8$, which was responsible to lower Ts. Dielectric constant(${\epsilon}_r$), $Q{\times}f_0$ and temperature coefficient of resonant frequency (${\tau}_f$) of the composite with 50 vol% glass contents ($B_{2}O_{3}:PbO:SiO_{2}:CaO:Al_{2}O_3$ = 5:40:45:5:5) demonstrated 8.5, 6,000 GHz, $-70\;ppm/^{\circ}C$, respectively, which is applicable to substrate requiring a low dielectric constant. When the same glass composition was applied sinter $MgTiO_3\;and\;TiO_2,\;at\;900^{\circ}C$ (50 vol% glass in total), the properties were 23.8, 4,000 GHz, $-65ppm/^{\circ}C$ and 31.1, 2,500 GHz, $+80ppm/^{\circ}C$ respectively, which is applicable to filter requiring an intermidiate dielectric constant.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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• pp.21-27
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• 2001

Epoxy/BaTiO$_3$composite film type capacitors with excellent stability at room temperature, uniform thickness, and electrical properties over a large area were successfully fabricated. We fabricated composite capacitor films with good film formation capability and easy process ability, from ACF-resin as a matrix and two kinds of BaTiO$_3$powders as fillers to increase the dielectric constant of the composite film. The crystal structure of the powders and its effects on dielectric constant of the films were investigated by X-ray diffraction. DSC and dielectric properties tests were conducted to decide the right curing temperature and the optimum amount of the curing agent. As a result, the capacitors of $7{\mu}{\textrm}{m}$ thick film with 10nF/cm2 and low leakage current were successfully demonstrated.

• 한국재료학회지
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• 제12권6호
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• pp.442-446
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• 2002

Design of microwave absorbers using high frequency properties of fiber reinforced composites are investigated. Two kinds of composite materials (glass and carbon) are used and their complex permittivity and permeability are measured by transmission/reflection technique using network analyzer. Low dielectric constant and nearly zero dielectric loss are determined in glass fiber composite. However, carbon fiber composites show the high dielectric constant and large conduction loss which is increased with anisotropy of fiber arrangement. It is, therefore, proposed that the glass and carbon fiber composites can be used as the impedance transformer (surface layer) and microwave reflector, respectively. By inserting the foam core or honeycomb core (which can be treated as an air layer) between glass and carbon fiber composites, microwave absorption above 10 dB (90% absorbance) in 4-12 GHz can be obtained. The proposed fiber composites laminates with sandwitch structure have high potential as lightweight and high strength microwave absorbers.

• 한국전기전자재료학회논문지
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• 제29권9호
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• pp.565-570
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• 2016

In this work, the complex permittivity of epoxy resins is measured. Epoxy resins, epoxy with micro size fillers and epoxy with micro+nano alumina composites have been evaluated for dielectric properties according to frequency variation. The dielectric spectroscopy measurement and analyses are carried out in the frequency range of $10^{-2}Hz$ to 1MHz and constant to room temperature. The results of dielectric loss suggest that significant improvement in the electrical performance can be expected by using samples containing nano and micro fillers mixture when compared to materials containing only microfillers. As the result, we verified the specific characteristics of dielectric permittivity and dielectric loss namely, relative permittivity become low with improving dispersibility of nano+micro mixture composites and become rise with agglomerate of nano particles.

• Transactions on Electrical and Electronic Materials
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• 제13권2호
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• pp.69-72
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• 2012

In this study, deposition of low-dielectric constant SiOC(H) films by conventional plasma-enhanced chemical vapor deposition (PECVD) were investigated through various characterization techniques. The results show that, with an increase in the plasma power density, the relative dielectric constant (k) of the deposited films decreases whereas the refractive index increases. This is mainly due to the incorporation of organic molecules with $CH_3$ group into the Si-O-Si cage structure. It is as confirmed by FT-IR measurements in which the absorption peak at 1,129 $cm^{-1}$ corresponding to Si-O-Si cage structure increases with power plasma density. Electrical characterization reveals that even after fast thermal annealing process, the leakage current density of the deposited films is in the order of $10^{-11}$ A/cm at 1.5 MV/cm. The reliability of the SiOC(H) film is also further characterized by using BTS test.

• 한국진공학회지
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• 제12권S1호
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• pp.83-87
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• 2003

Zirconium oxide films have been synthesized by radio-frequency magnetron sputtering deposition on n-Si(001) substrate with metal zirconium target at variant $O_2$ partial pressures. The influences of $O_2$ partial pressures of the morphology, deposition rate, microstructure, and the dielectric constant of $ZrO_2$ have been discussed. The results show that deposition rate of $ZrO_2$ films decreases, the roughness, and the thickness of the native $SiO_2$ interlayer increases with the increase of $O_2$ partial pressure. $ZrO_2$ films synthesized at low $O_2$ partial pressure are amorphous and monoclinic polycrystalline in nanometer scale at low $O_2$ partial pressure. The relative dielectrics of $ZrO_2$ films are in the range of 12 to 25.

• 한국표면공학회지
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• 제25권3호
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• pp.126-132
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• 1992

Recent VLSI requires materials with high dielectric constant in order to reduce their storage capacitor areas. Thin TaOx film was formed from Ta(OCH3)5 by photo-CVD method at a low temperature. The result shows that the film obtained by photo-CVD method is this study has good step coverage, high dielectric constant (20-25) and low leakage current. The high strong peaks from Ta(4f), Ta(4d), and O(ls) levels were observed by XPS analysis. From the diffraction pattern and TEM prcture analysis, the TaOx thin film was observed to be amorphous. This kind of the deposition method could be considered to be a very promising method applied to VLSI.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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• pp.178-180
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• 2005

In this study, in order to develop multilayer low temperature sintering piezoelectric transformer, $Pb_{0.97}Sr_{0.03}[(Mn_{1/3}Nb_{2/3})x(Zr_{0.48}Ti_{0.52})_{1-x}O_3]+$ 0.25wt% $CeO_2$+0.3 wt% $Nb_2O_5$ system ceramics were fabricated using $Li_2CO_3-CaCO_3$ and CuO as sintering aids and their piezoelectric and dielectric characteristics were investigated with the amount of PMN substitution. With increasing PMN substitution, electromechanical coupling factor kp and dielectric constant were increased.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.253-254
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• 2007

In this study, in order to develop low temperature sintering multilayer piezoelectric actuator, PMN-PNN-PZT system ceramics were fabricated using $Li_2CO_3-Bi_2O_3$-CuO as sintering aids and their piezoelectric and dielectric characteristics were investigated as a function of heating rate. At sintering temperature of $900^{\circ}C$, with increasing heating rate, electromechanical coupling factor(kp), mechanical quality factor(Qm) and dielectric constant $({\varepsilon}_r)$ were increased.