• Proceedings of the Materials Research Society of Korea Conference
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• 2011.10a
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• pp.43.1-43.1
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• 2011

Hydrogenated amorphous Si (a-Si:H), low temperature poly Si (LTPS) 등 기존 thin film transistors (TFTs)에 사용되던 채널 물질을 대체할 재료로써 다양한 연구가 진행되고 있는 amorphous indium-gallium-zinc-oxide (a-IGZO)는 TFT에 적용하였을 때 뛰어난 전기적 특성과 재연성을 나타낼 뿐만 아니라 넓은 밴드갭을 가져 투명소자로도 응용이 가능하다. 본 연구에서는 a-IGZO의 열처리에 따른 소자의 전기적 특성과 조성 분포의 관계를 확인하기 위해 다음과 같이 실험을 진행하였다. Si/SiO2 기판 위에 DC sputter를 이용하여 IGZO를 증착하고 $350^{\circ}C$에서 열처리를 한 후 evaporator로 Al 전극을 형성시켰다. 이 때 전기적 특성의 변화를 비교하기 위해 열처리 한 샘플과 열처리 하지 않은 샘플에 대해 I-V 특성을 측정하였고, 채널 내부의 조성 분포 변화를 transmission electron microscopy (TEM)의 energy dispersive spectrometer (EDS)를 이용하여 관찰하였다. 그 결과 열처리 된 a-IGZO 채널 층의 산소 비율이 감소하였으며 전체적인 조성이 고르게 분포 되었고 전기적 특성은 향상되었다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.31 no.2
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• pp.98-101
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• 2018

In this paper, we discuss the fabrication of metal alloy resistors. We connected them in parallel to estimate their resistance and temperature coefficient of resistance (TCR). The fabricated resistors have different resistances, 5 and $10{\Omega}$ and different TCRs, 50 and $200ppm/^{\circ}C$. Each resistor was confirmed to have the correct atomic composition through the use of energy dispersive X-ray (EDX). The resistors' electrical properties were confirmed by measuring resistance and TCR. The resistance and TCR of the resistors connected in parallel were estimated through the increase in resistance due to the increase in temperature, and were compared with the measured values. We are confident that this TCR estimation technique, which uses the increase in resistance due to temperature, will be very useful in designing and fabricating resistors with low and stable TCR.

• Transactions of the Korean Society of Automotive Engineers
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• v.10 no.5
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• pp.23-28
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• 2002

As the interest on the air pollution is gradually rising up at home and abroad, automotive industries have been working on the exhaust emission reduction from vehicles through a lot of approaches, which consist of new engine design, innovative aftertreatment systems, and using clean fuels. Methanol, ethanol, LNG, LPG, H2, reformulated gasoline are generally recognized as the clean fuel. Since the low price policy of government on LPG has expanded its vehicle market recently, there is concern of the exhaust emission of LPG vehicle. In this paper, we studied the value of LPG fuel as a clean fuel by comparing the results of the exhaust emission from LPG and Gasoline fueled vehicles, and discussed its limitation of LPG vehicle with mixer type as a fuel supply system. FTIR was used to understand the difference of exhaust emission components of LPG and Gasoline fueled vehicles.

• Electrical & Electronic Materials
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• v.8 no.4
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• pp.400-405
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• 1995

ZnO films have been grown easily with the conventional thermal evaporation method on SiO$\_$2/ coated Si wafers. Anhydrous zinc acetate has been used as evaporation source. Zinc-acetate was directly heated in the laboratory-made brass boat. Zinc-acetate was sublimed at the boat temperature of about 220.deg. C. The substrates were heated to 600.deg. C with home made tantalium heater. Oxygen has been flowed into the deposition chamber to change the partial pressure of oxygen. X-ray diffraction patterns showed all the films to be amorphous. The films deposited at high oxygen pressure exhibit higher resistivity than films at low pressure. Energy dispersive spectroscopy(EDS) and rutherford backscattering spectrometry(RBS) were conducted on the films to reveal the composition of the ZnO films.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.456-462
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• 2002

In the present work, a low cost and fine pitch bumping process by electroless Ni/immersion Au UBM (under bump metallurgy) and stencil printing for the solder bump on the Al pad is discussed. The Chip used this experimental had an array of pad 14x14 and zincate catalyst treatment is applied as the pretreatment of Al bond pad, it was shown that the second zincating process produced a dense continuous zincating layer compared to first zincating. Ni UBM was analyzed using Scanning electron microscopy, Energy dispersive x-ray, Atomic force microscopy, and X-ray diffractometer. The electroless Ni-P had amorphous structures in as-plated condition. and crystallized at 321 C to Ni and Ni$_3$P. Solder bumps are formed on without bridge or missing bump by stencil print solder bump process.

• Journal of the Korean Electrochemical Society
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• v.21 no.1
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• pp.12-20
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• 2018

To solve low cycle efficiency of the zinc anode in Zn-air batteries by corrosion, this study examined the effects of Al as a cathodic protection additive to Zn. The Al-mixed Zn anodes were produced by mixing Zn and Al powder (1, 2, and 3 wt. %). To compare the effects of the Al additive, Si was selected under the same conditions. The morphology and elemental composition of the additives in the Zn were characterized by scanning electron microscopy, energy dispersive X-ray spectroscopy, and inductively coupled plasma - mass spectrometry. The anti-corrosion effects of the Al and Si-mixed Zn anodes were examined by linear polarization. Cyclic voltammetry and charge-discharge tests were conducted to evaluate the electrochemical performance of the Al and Si-mixed Zn anodes. As a result, the Al-mixed Zn anodes showed highest corrosion resistance and cycling performance. Among these, the 2 wt.% Al-mixed Zn anodes exhibited best electrochemical performance.

• Journal of Advanced Marine Engineering and Technology
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• v.18 no.3
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• pp.78-84
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• 1994

The location of periodic noises in phase of AC power wave reveals to be specific according to the noise kinds which can be generally classified into modulation and baseband types in DLC. The former noise type has constant noise phase which is originated from switching mode power supplies and the latter normally caused from thyristor circuit of low switching frequency is compared to be more dispersive than the other.

• Transactions of Materials Processing
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• v.15 no.8 s.89
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• pp.539-543
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• 2006

Experimental studies are carried out in order to investigate the effects of heat treatment on the surface machined by W-EDM. In this work, two ways of heat treatment after W-EDM are considered. As a comparison, the machined surface by a traditional method such as milling/grinding is also considered. Thereby, specimens are prepared by four different machining methods. Those are (1) milling and then grinding, (2) wire-cut electric discharge machining (W-EDM), and (3) low temperature heat treatment or (4) high temperature heat treatment after W-EDM. The resulting surface roughness are measured and the changes of surface microstructures are investigated using the scanning electron microscope (SEM) with energy dispersive X-ray spectrometer (EDS). In general, heat treatment after W-EDM result in smoother surface and better chemical composition at the machined surface. Especially, high temperature tempering could remove defects in the thermally affected zone, which cause an overall deterioration of the surface machined by W-EDM.

• Journal of the Korean institute of surface engineering
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• v.29 no.6
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• pp.884-890
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• 1996

We have investigated a structural change of Si(100)-($2 \times 1$)-Sb surface caused by atomic hydrogen adsorption at room temperature using time-of-flight impact collision ion scattering spectroscopy (TOF-ICISS) and low energy electron diffraction (LEED). We found that when atomic hydrogen adsorbs on the Si(100)-($2 \times 1$)-Sb surface, (1) the partial desorption of Sb atoms from the Si(100) surface occurs even at room temperature, (2) the rest Sb atoms are displaced from their original positions and form an almost two-dimensional layer with dispersive distribution of Sb atoms, and (3) the structural transformation into the Si(100)-($1 \times 1$)-H periodicity is induced by the formation of the $1 \times 1$-H dihydride phase on the Si substrate.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.9 no.8
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• pp.3079-3089
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• 2015

In this paper, a smart constrained application protocol (CoAP)-based gateway with a border router is proposed for home safety services to remotely monitor the trespass, fire, and indoor air quality. The smart CoAP gateway controls a home safety sensor node with a pyroelectric infrared motion sensor, a fire sensor, a humidity and temperature sensor, and a non-dispersive infrared CO2 sensor and gathers sensing data from them. In addition, it can convert physical sensing data into understandable information and perform packet conversion as a border router for seamless connection between a low-power wireless personal area network (6LoWPAN) and the Internet (IPv6). Implementation and laboratory test results verify the feasibility of the smart CoAP gateway which especially can provide about 97.20% data throughput.