• Title/Summary/Keyword: Location and Shape of Circular Hole

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The Stress Analysis of the Cross Beam of the Electric Car-body according to the Change of Location and Shape of Circular Hole (원공 위치와 형상 변화에 따른 전동차 크로스 빔의 강도해석)

  • Jeon, Hyung-Yong;Sung, Rak-Won;Han, Geun-Jo
    • Journal of the Korean Society for Precision Engineering
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    • v.16 no.9
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    • pp.9-17
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    • 1999
  • This investigation is the result of the structural analysis by finite element method for optimal design of the cross beam with circular holes of the electric car-body. in order to install the air pipe and electric wire pipe that correspond signal between electric machines for the control system and to reduce the weight of the electric car-body, several circular areas from a cross beam should be taken off. What we want to perform is the optimal design of a cross beam with circular holes to posses equal stress in comparison with no hole cross beam. first, no hole cross beam as basic modal be chosen, executing the analysis, reviewing the distribution of stress and displacement at each location. several parameter should be adopted from the cross beam geometry like the location and shape of the hole to affect the maximum stress and displacement. So the analysis was executed by finite element analysis for finding optimal design parameter to the change of the location and shape of the circular hole. finally, the optimal design of the cross beam with circular holes was obtained and the maximum equivalent stress was compared with no hole cross beam at each location.

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A Study on the Lightweight Design of a Cross Beam for Railway Passenger Coach (철도객차용 크로스 빔의 경량화 설계에 관한 연구)

  • Jang, Deuk-Yul;Jeon, Hyung-Yong
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.16 no.5
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    • pp.126-133
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    • 2017
  • This report investigates the stress distribution according to the location and shape change of the circular hole for the lightweight design of the cross beam of a railway passenger car and studies the lightweight design. To design a lightweight cross beam with a circular hole, we selected the non-circular crossbeam as a basic model, examined the stress distribution and displacement by position and determined the location, shape, size and quantity of the hole for light weight. We analyzed the effects of the position and shape of the hole on the maximum equivalent stress and displacement. The influencing factors were set as the design parameters, and the stress value was examined according to the variation of each variable. By considering the stress value according to the change of each variable and selecting the design parameter with the narrowest scattering value of the stress at each position of the hollow cross beam with various hole positions and shapes, we studied a cross beam with a circle hole under identical load condition to have an equal stress distribution to that of a non-circular cross beam.

The Effect of Defect Location Near a Circular Hole Notch on the Relationship Between Crack Growth Rate (da/dN) and Stress Intensity Factor Range (δK) - Comparative Studies of Fatigue Behavior in the Case of Monolithic Al Alloy vs. Al/GFRP Laminate - (원공노치 인근에 발생한 결함의 위치변화가 균열성장률(da/dN) 및 응력확대계수범위(δK)의 관계에 미치는 영향 - 단일재 알루미늄과 Al/GFRP 적층재의 피로거동 비교 -)

  • Kim, Cheol-Woong;Ko, Young-Ho;Lee, Gun-Bok
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.31 no.3 s.258
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    • pp.344-354
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    • 2007
  • The objective of this study is to investigate the effect of arbitrarily located defect around the circular hole in the aircraft structural material such as Al/GFRP laminates and monolithic Al alloy sheet under cyclic bending moment. The fatigue behavior of these materials may be different due to the defect location. Material flaws in the from of pre-existing defects can severely affect the fatigue crack initiation and propagation behavior. The aim of this study is to evaluate effects of relative location of defects around the circular hole in monolithic Al alloy and Al/GFRP laminates under cyclic bending moment. The fatigue behavior i.e., the stress concentration factor($K_t$), the crack initiation life($N_i$), the relationship between crack length(a) and cycles(N), the relationship between crack growth rate(da/dN) and stress intensity factor range(${\Dalta}K$) near a circular hole are considered. Especially, the defects location at ${\theta}_1=0^{\circ}\;and\;{\theta}_2=30^{\circ}$ was strongly effective in stress concentration factor($K_t$) and crack initiation life($N_i$). The test results indicated the features of different fatigue crack propagation behavior and the different growing delamination shape according to each location of defect around the circular hole in Al/GFRP laminates.

Development of a Robotic System for Measuring Hole Displacement Using Contact-Type Displacement Sensors (접촉식 변위센서를 이용한 홀 변위 측정 로봇시스템 개발)

  • Kang, Hee-Jun;Kweon, Min-Ho;Suh, Young-Soo;Ro, Young-Shick
    • Journal of the Korean Society for Precision Engineering
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    • v.25 no.1
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    • pp.79-84
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    • 2008
  • For the precision measurement of industrial products, the location of holes inside the products, if they exist, are often selected as feature points. The measurement of hole location would be performed by vision and laser-vision sensor. However, the usage of those sensors is limited in case of big change of light intensity and reflective shiny surface of the products. In order to overcome the difficulties, we have developed a hole displacement measuring device using contact-type displacement sensors (LVDTs). The developed measurement device attached to a robot measures small displacement of a hole by allowing its X-Y movement due to the contact forces between the hole and its own circular cone. The developed device consists of three plates which are connected in series for its own function. The first plate is used for the attachment to an industrial robot with ball-bush joints and springs. The second and third plates allow X-Y direction as LM guides. The bottom of the third plate is designed that various circular cones can be easily attached according to the shape of the hole. The developed system was implemented for its effectiveness that its measurement accuracy is less than 0.05mm.

Atmospheric Pressure Plasma Etching Technology for Forming Circular Holes in Perovskite Semiconductor Materials (페로브스카이트 반도체 물질에 원형 패턴을 형성하기 위한 상압플라즈마 식각 기술)

  • Kim, Moojin
    • Journal of Convergence for Information Technology
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    • v.11 no.2
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    • pp.10-15
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    • 2021
  • In this paper, we formed perovskite (CH3NH3PbI3) thin films on glass with wet coating methods, and used various analytical techniques to discuss film thickness, surface roughness, crystallinity, composition, and optical property. The coated semiconductor material has no defects and is uniform, the surface roughness value is very small, and a high absorption rate has been observed in the visible light area. Next, in order to implement the hole shape in the organic-inorganic layer, Samples in the order of a metal mask with holes at regular intervals, a glass coated with a perovskite material, and a magnet were etched with atmospheric pressure plasma equipment. The shape of the hole formed in the perovskite material was analyzed by changing the time. It can be seen that more etching is performed as the time increases. The sample with the longest processing time was examined in more detail, and it was classified into 7 regions by the difference according to the location of the plasma.