• Journal of the Korean Society for Precision Engineering
• /
• v.29 no.2
• /
• pp.161-169
• /
• 2012

Recently, a study for the functional surface production of super hydrophobic of natural and biomimetic artificial has attracted much attention. To make process methods of super hydrophobic surface has a variety of ways such as lithography, etching, and laser ablation. However, we were used ultra-shot pulse laser ablation process which has the virtue of more environmental friendliness and simple process. In this paper, we were fabricated a multiplicity of super hydrophobic patterns on mold surface(NAK80) using by optimizing the laser processing conditions and it was transferred on PDMS. Also, we measured contact angle super hydrophobic patterns on PDMS. The result showed there is no patterns on PDMS were measured 94 degrees, by contrast, optimized super hydrophobic patterns on PDMS was 157 degrees. Therefore we fabricated super hydrophobic surface on mold. Based on these experimental results, it is possible to mass production using ultra shot pulse laser ablation of super hydrophobic pattern and to be applied for a variety of industries.

• Journal of the Semiconductor & Display Technology
• /
• v.15 no.1
• /
• pp.22-26
• /
• 2016

Extreme ultraviolet (EUV) pellicle is one of the most concerned research in the field of EUV lithography (EUVL). Imaging performance of EUV mask with pellicle should be investigated prior to high volume manufacturing (HVM) of EUVL. In this paper, we analyzed the relationship between standoff distance and imaging performance of EUV mask to verify the influences of relative standoff distance on imaging performance. As a result, standoff distance of EUV pellicle has no effect on imaging performance of EUV mask such as critical dimension (CD), normalized image log slope (NILS) and image contrast. Therefore, pellicle support structure can be flexibly designed and modified in diverse ways to complement the thermal limitation of EUV pellicle membrane.

• Laser Solutions
• /
• v.14 no.4
• /
• pp.14-20
• /
• 2011

The advantage of using lasers for through silicon via (TSV) drilling is that they allow higher flexibility during manufacturing because vacuums, lithography, and masks are not required; furthermore, the lasers can be applied to metal and dielectric layers other than silicon. However, conventional nanosecond lasers have disadvantages including that they can cause heat affection around the target area. In contrast, the use of a picosecond laser enables the precise generation of TSVs with a smaller heat affected zone. In this study, a comparison of the thermal and crystallographic defect around laser-drilled holes when using a picosecond laser beam with varing a fluence and repetition rate was conducted. Notably, the higher fluence and repetition rate picosecond laser process increased the experimentally recast layer, surface debris, and dislocation around the hole better than the high fluence and repetition rate. These findings suggest that even the picosecond laser has a heat accumulation effect under high fluence and short pulse interval conditions. To eliminate these defects under the high speed process, the CDE (chemical downstream etching) process was employed and it can prove the possibility to applicate to the TSV industry.

• Journal of the Korean Society for Nondestructive Testing
• /
• v.32 no.2
• /
• pp.142-148
• /
• 2012

This study presents the assessment results of adhesive properties on the interface between a silicon wafer and nano-scale polymer thin film pattern through UAFM images by using the contact resonance frequency of the cantilever. For the experiment, we varied surface treatment processes for the silicon wafer and fabricated a 300nm polymer thin film pattern through lithography. Images from the optical microscope were used to compare the produced test specimens for adhesive condition and the critical load value from the nano scratch test was used to verify the adhesive condition of the nano pattern. Each test specimen resulted in a $1{\mu}m{\times}1{\mu}m$ surface image and subsurface adhesive image. Adhesive condition was evaluated by image contrast differences on the interface according to the changing amplitudes and phases of contact resonance frequency.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1995.11a
• /
• pp.224-227
• /
• 1995

The micro-patterning by a Bow energy FIB whish has been conventionally utilized far mask-repairing was investigated. Amorphous Se$\_$75/Gee$\_$25/ resist irradiated by 9[keV]-defocused Ga$\^$+/ ion beam(∼10$\^$15/[ions/$\textrm{cm}^2$]) resulted in increasing the optical absorption, which was also observed also in the film exposed by an optical dose of 4.5${\times}$10$\^$20/[photons/$\textrm{cm}^2$]. The ∼0.3[eV] edge shift for ion-irradiated film was about twice to that obtained for photo-exposed. These large shift could be estimated as due to an increase in disorder from the decrease in the sloop of the Urbach tail. For Ga$\^$+/ FIB irradiation with a relatively low energy, 30[keV] and above the amount of dose of 1.4${\times}$10$\^$16/[ions/$\textrm{cm}^2$], the irradiated region in a-Se$\_$75/Ge$\_$25/ resist was perfectly etched in acid solution for 10[sec], which is relatively a short development time. A contrast was about 2.5. In spite of the relatively low incident energy,∼0.225[$\mu\textrm{m}$] pattern was clearly obtained by the irradiation of a dose 6.5${\times}$10$\^$16/[ions/$\textrm{cm}^2$] and a scan diameter 0.2[$\mu\textrm{m}$], from which excellent results were expected fur incident energies above 50[keV] which was conventionally used in FIBL.

• Polymer(Korea)
• /
• v.26 no.6
• /
• pp.701-709
• /
• 2002

To synthesize a new positive photosensitive polyimide precursor, parts of carboxylic acid groups in poly (amic acid) were esterified with 4,5-dimethoxy-2-nitrobenzyl bromide in the presence of K$_2$CO$_3$/HMPA followed by the chemical imidization of residual carboxylic acid units. The chemical structure of resulting polymer was characterized by $^1$H-NMR, UV/vis and FT-IR spectroscopic methods, and its thermal properties were examined by DSC and TGA. Upon UV irradiation, 4,5-dimethoxy-2-nitrobenzyl moiety underwent the photodegradation. As a result, the polymer became soluble in alkaline developer due to the formation of carboxylic acid moiety, which was used to make a micron-sized positive pattern. Sensitivity curves were obtained from the gel fraction experiments with respect to the various 4,5-dimethoxy-2-nitrobenzyl ester contents. From those curves, the sensitivity was ranged iron 4000 to 6000 mJ/㎠, and the contrast was measured to be from 3.1 to 4.9.

• Current Photovoltaic Research
• /
• v.6 no.4
• /
• pp.102-108
• /
• 2018

A glass-texturing technique was developed for photovoltaic (PV) module cover glass; periodic honeycomb textures were formed by using a conventional lithography technique and diluted hydrogen fluoride etching solutions. The etching conditions were optimized for three different types of textured structures. In contrast to a flat glass substrate, the textured glasses were structured with etched average surface angles of $31-57^{\circ}$, and large aspect ratios of 0.17-0.47; by using a finite difference time-domain simulation, we show that these textured surfaces increase the amount of scattered light and reduce reflectance on the glass surface. In addition, the optical transmittance of the textured glass was markedly improved by up to 95% for wavelengths ranging from 400 to 1100 nm. Furthermore, applying the textured structures to the cover glass of the PV module with heterojunction with intrinsic thin-layer crystalline silicon solar cells resulted in improvements in the short-circuit current density and module efficiency from 39 to $40.2mA/cm^2$ and from 21.65% to 22.41%, respectively. Considering these results, the proposed method has the potential to further strengthen the industrial and technical competitiveness of crystalline silicon solar cells.

• International Journal of Advanced Culture Technology
• /
• v.7 no.1
• /
• pp.243-247
• /
• 2019

The most commonly used 3D modeling file formats are OBJ (Wavefront file format specification) and STL (STereoLithography). Although they have a common point of view in 3D on the screen, detailed functions are different according to purpose of development. OBJ is the most commonly used 3D file format and STL is mainly used as 3D file format for 3D printing. However, in the field of Scientific Visualization, precise analysis is required. There is a difference in accuracy depending on the type of 3D file format. OBJ and STL are not suitable for delicate surface description because they form meshes in the form of triangular polygons. And if you increase the number of triangle polygons, it will be smoother, but the file size also increases exponentially and causes excessive CPU usage. In contrast, VTK provides a variety of polygon structures, including triangular polygons as well as rectangular polygons and cube polygons. Thus, delicate surface depiction is possible. Delicate surface rendering is possible and file size is not large. This paper describes the concept and structure of VTK. We also compared the load times and file sizes between VTK, STL, and OBJ in the Chrome browser. In addition, the difference in surface rendering ability between VTK, STL, and OBJ is intuitively viewed based on the screen in which each 3D file format is implemented under the same conditions. This study is expected to be helpful for efficient 3D file format for precise implementation of Web - based Scientific Visualization.

• Journal of IKEEE
• /
• v.25 no.1
• /
• pp.64-68
• /
• 2021

We demonstrate an effect of annealing temperature on imprinting process of BiLaO thin film for liquid crystal alignment. BiLaO prepared sol-gel process was deposited by spin coating on a glass substrate, and then transferred to a pre-fabricated aligned pattern which is fabricated on a silicon wafer by laser interference lithography. Thin film was annealed at different temperature of 100, 150, 200, and 250 ℃. From the polarized optical microscopy analysis, the liquid crystal orientation was not uniform at the annealing temperature of 200 ℃ or lower and the uniform liquid crystal alignment characteristics were confirmed at the annealing temperature of 250 ℃. From atomic force microscopy, the pattern was not transferred at a temperature of 200 ℃ or lower. In contrast, the pattern was transferred at 250 ℃. Anisotropy of the thin film was obtained by the alignment pattern transferred at a temperature of 250 ℃, and the liquid crystal molecules could be evenly oriented on the thin film. Therefore, it was confirmed that the liquid crystal alignment process by the imprinting process of the BiLaO oxide film was affected by the annealing temperature.