• Journal of the Korean Society of Propulsion Engineers
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• v.8 no.4
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• pp.67-75
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• 2004

It is essential to develop a transient analysis model for the turbopump-fed type liquid rocket engine development, especially for deriving the number of test and its parameters. In this study we proposed a mathematical model of turbopump-fed type liquid rocket engine, and inspected transient mode changes of a rocket engine according to variations of thrust control valve opening ratio. To verify the results, we solved the same problem with AnaSyn software from Russia, and concluded that the results of transient code we developed deviated within 2% from AnaSyn results. Also, using the transient engine analysis code we showed the possibility to find out the system level design Parameters of the components. For example, we modeled a pressure stabilizer which is used to control the consistency of mixture ratio in the gas generator as forced damping system, and found the stability range of the natural frequency and the damping ratio with the transient engine system analysis code.

• Journal of Powder Materials
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• v.11 no.1
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• pp.69-73
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• 2004

The sintering characteristics of commercial 7xxx series Al-Zn-Mg-Cu alloy have been investigated. Sintering system of this blended elemental powder has aspects of both transient and supersolidus liquid phase sintering. Transient liquids occur when the constitution point during sintering lies in a solid phase region but where the sintering temperature is greater than either the melting point of one of the constituent or a eutectic temperature. Supersolidus liquid phase sintering occurs when a preblended powder is heated to a temperature between the solidus and liquids. However, these reaction were restrained their inter diffusion due to the appearance of the oxide film. Thus, 7xxx series Al alloy is extremely sensitive to process variables, including particle size, holding time and sintering temperature. Therefore, above phenomenons were observed formation and behaviour of the liquid by using SEM and DSC.

• Journal of Welding and Joining
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• v.19 no.4
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• pp.423-428
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• 2001

The bonding phenomena of Ni base single crystal superalloy. CMSX-4 during transient liquid phase(TLP) bonding was investigated using MBF-80 insert metal. Bonding of CMSX-4 was carried out at 1,373∼1,548K for 0∼19.6ks in vacuum. The (001) orientation of each test specimen was aligned perpendicular to the bonding interface. The dissolution width of base metal was increased when the bonding temperature and holding time were increased. The eutectic width diminished linearly with the square root of holding time during isothermal solidification process. Borides were formed in the bonded layer during TLP bonding operation. The solid phase grew epitaxially into the liquid phase from substrates and single crystallization could be readily achieved during the isothermal solidification.

• The Korean Journal of Ceramics
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• v.6 no.1
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• pp.78-82
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• 2000

Although alumina aggregates have been used as refractory aggregates due to the improved mechanical properties of refractories as a result of the low contraction of alumina aggregates, the aggregates have a difficulty in fabrication due to its low sinterability. Two types of alumina aggregates and a fused alumina aggregate containing transient liquid forming additives are prepared to investigate the sintering characteristics of aggregates. $Al_2O_3$rich composition in the $Al_2O_3$-MgO-$SiO_2$(-$TiO_2$) system is chosen for the transient liquid phase sintering and the final recrystallized bonding phase between grains inside the fused alumina aggregates is found to be a needle-like mullite phase. The flexural strength of alumina bars, reaction-bonded using the paste having a composition of $Al_2O_3$-MgO-$SiO_2$-$TiO_2$, is about 78 MPa, which is one half value of that of pure alumina.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.31 no.11
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• pp.918-925
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• 2007

In this paper, different criteria fur determining hue change time in the hue detection based transient liquid crystals technique were compared. Results showed that methods utilizing threshold of intensity or saturation gave many missing points and quality of the calculated results were strongly depends on the value of threshold. Wider bandwidth in the hue bandwidth method showed better distribution of calculated hue change time, but induced ambiguity in the hue change time. In the time-hue curve fitting method, the distribution of evaluated hue change time was smooth and reasonable, and, by the nature of curve fitting, the noise effect on the hue was successfully considered in calculating of the hue change time. Compared to other methods, it is expected that the time-hue curve fitting method would provide better and accurate hue change time in the hue detection based transient liquid crystals technique.

• ETRI Journal
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• v.41 no.6
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• pp.820-828
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• 2019

A highly reliable conductive adhesive obtained by transient liquid-phase sintering (TLPS) technologies is studied for use in high-power device packaging. TLPS involves the low-temperature reaction of a low-melting metal or alloy with a high-melting metal or alloy to form a reacted metal matrix. For a TLPS material (consisting of Ag-coated Cu, a Sn96.5-Ag3.0-Cu0.5 solder, and a volatile fluxing resin) used herein, the melting temperature of the metal matrix exceeds the bonding temperature. After bonding of the TLPS material, a unique melting peak of TLPS is observed at 356 ℃, consistent with the transient behavior of Ag₃Sn + Cu₆Sn₅ → liquid + Cu₃Sn reported by the National Institute of Standards and Technology. The TLPS material shows superior thermal conductivity as compared with other commercially available Ag pastes under the same specimen preparation conditions. In conclusion, the TLPS material can be a promising candidate for a highly reliable conductive adhesive in power device packaging because remelting of the SAC305 solder, which is widely used in conventional power modules, is not observed.

• Journal of Welding and Joining
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• v.21 no.2
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• pp.82-88
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• 2003

The bonding phenomenon and mechanism in the transient liquid phase bonding(TLP Bonding) of directionally solidified Ni base superalloy, GTD-111 was investigated. At the bonding temperature of 1403K, liquid insert metal was eliminated by isothermal solidification which was controlled by the diffusion of B and Si into the base metal and solids in the bonded interlayer grew epitaxially from mating base metal inward the insert metal. The number of grain boundaries formed at the bonded interlayer was corresponded with those of base metal. The liquation of grain boundary and dendrite boundary occurred at 1433K. At the bonding temperature of 1453K which is higher than liquation temperature of grain boundary, liquids of the Insert metal were connected with liquated grain boundaries and compositions in each region mixed mutually. In Joints held for various time at 1453t phases formed at liquated grain boundary far from the interface were similar to those of bonded interlayer. With prolonged holding time, liquid phases decreased gradually and liquids of continuous band shape divided many island shape. But liquid phases did not disappeared after holding for 7.2ks at 1453k. Isothermal solidification process at the bonding temperature which is higher than the liquation temperature of the grain boundary was controlled by diffusion of Ti to be result in liquation than B or Si. in insert metal. (Received January 15, 2003)

• Journal of Powder Materials
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• v.12 no.2 s.49
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• pp.131-135
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• 2005

7xxx series Al alloy has the most attractive properties including its excellent high specific strength, stress corrosion cracking and corrosion-resistance. However, in case of the Al-Zn system, the liquid phase has a transient aspect because of the high solid solubility of Zn in Al. Therefore, transient liquid phase sintering behavior was observed during the sintering process. And the amount of liquid and its duration were influenced by the process variables including heating rate and final sintering temperature. At high heating rates($100^{\circ}C/min$), the liquid fraction increased during sintering because diffusion was minimized and therefore local saturation could easily occur. The sintered density increased with increasing heating rate.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.27 no.11
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• pp.1618-1629
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• 2003

The effects of the interaction between flow field and heat transfer caused by the longitudinal vortices are experimentally investigated using a five hole probe and a transient liquid crystal technique. The test facility consists of a wind tunnel with vortex generators protruding from a bottom surface and a mesh heater. In order to control the strength of the longitudinal vortices, the angle of attack of vortex generators used in the present experiment is 20$^{\circ}$, and the spacing between the vortex generators is 25mm. The height and cord length of the vortex generator is 20mm and 50mm, respectively. Three-component mean velocity measurements are made using a f-hole probe system, and the surface temperature distribution is measured by the hue capturing method using a transient liquid crystal technique. The transient liquid crystal technique in measuring heat transfer has become one of the most effective ways in determining the full surface distributions of heat transfer coefficients. The key point of this technique is to convert the inlet flow temperature into an exponential temperature profile using the mesh heater set up in the wind tunnel. The conclusions obtained in the present experiment are as follows: The two maximum heat transfer values exist over the whole domain, and as the longitudinal vortices move to the farther downstream region, these peak values show the decreasing trends. These trends are also observed in the experimental results of other researchers to have used the uniform heat flux method.

• Proceedings of the Materials Research Society of Korea Conference
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• 1994.11a
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• pp.142-143
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• 1994