• Title/Summary/Keyword: Liquid Diffusion Bonding

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The Mixing Ratio Effect of Insert Metal Powder and Insert Brazing Powder on Microstructure of the Region Brazed on DS Ni Base Super Alloy (일방향응고 Ni기 초내열합금 천이액상화산접합부의 미세조직에 미치는 모재와 삽입금속 분말 혼합비의 영향)

  • Ye Chang-Ho;Lee Bong-Keun;Song Woo-Young;Oh In-Seok;Kang Chung-Yun
    • Journal of Welding and Joining
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    • v.23 no.6
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    • pp.99-105
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    • 2005
  • The mixing ratio effect of the GTD-111(base metal) powder and the GNI-3 (Ni-l4Cr-9.5Co-3.5Al-2.5B) powder on TLP(Transient Liquid Phase) bonding phenomena and mechanism was investigated. At the mixing ratio of the base metal powder under $50wt\%$, the base metal powders fully melted at the initial time and a large amount of the base metal near the bonded interlayer was dissolved by liquid inter metal. Liquid insert metal was eliminated by isothermal solidification which was controlled by the diffusion of B into the base metal. The solid phases in the bonded interlayer grew epitaxially from the base metal near the bonded interlayer inward the insert metal during the isothermal solidification. The number of grain boundaries farmed at the bonded interlayer corresponded with those of base metal. At the mixing ratio above $60wt\%$, the base metal powder melted only at the surface of the powder and the amount of the base metal dissolution was also less at the initial time. Nuclear of solids firmed not only from the base metal near the bonded interlayer but also from the remained base metal powder in the bonded interlayer. Finally, the polycrystal in the bonded interlayer was formed when the isothermal solidification finished. When the isothermal solidification was finished, the contents of the elements in the boned interlayer were approximately equal to those of the base metal. Cr-W borides and Cr-W-Ta-Ti borides formed in the base metal near the bonded interlayer. And these borides decreased with the increasing of holding time.

On the transient liquid phase diffusion bonding (천이액상화접합에 대하여)

  • 강정윤
    • Journal of Welding and Joining
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    • v.7 no.2
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    • pp.12-24
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    • 1989
  • 천이액상확산접합법은 접합계면에 일시적으로 액상이 형성되기 때문에, 고상확산접합법과 비교 하여 비교적 쉽게 금속결합을 이룰 수 있을 뿐만 아니라, 정밀하게 표면을 가공할 필요가 없으 며, 접합압력이 거의 필요 없다는 것이 잇점이라고 할 수 있다. 도한, 접합온도에서 등온응고되 기 때문에, 브레이징법과 비교하여 접합계면에 취약한 금속간화합물(Metallic Compound)이 생 성되지 않으므로, 기계적성질 및 내식성이 우수한 접합이음부를 얻을 수 있다는 잇점이 있다. 따라서, 본 접합법은 원리적으로 모재(Base Metal)와 거의 같은 정도의 물리적, 화학적, 기계적 성질을 갖는 접합이음부(Joint or Bonded Interlayer)를 얻을 수 있는 접합법이라고 생각되어진 다. 본 해설에서는 천이액상확산접합법의 기본원리, 접합기구, 접합인자 및 실용된 예에 대해서 서술하고자 한다.

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EFFECT OF PHOSPHORIC ACID CONCENTRATION ON THE DIFFUSION OF HEMA THROUGH DENTIN (상아질을 통한 HEMA의 확산에 인산농도가 미치는 영향)

  • Yoon, Mi-Ran;Lee, Kwang-Won;Park, Soo-Joung
    • Restorative Dentistry and Endodontics
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    • v.24 no.1
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    • pp.147-155
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    • 1999
  • The purpose of this study was to investigate the effect of phosphoric acid concentration on the movement of 2-hydroxyethylmethacrylate(HEMA) from bonding resin - resin composite combination through dentin in vitro. Freshly extracted human third molar teeth were divided into four groups each of 10 teeth. A closed chamber with 1 ml distilled water was attached to the CEJ of each tooth. An occlusal cavity of 4mm diameter & remaining dentin thickness of 1.0-1.5mm was prepared in each tooth. Dentin was treated with 10% phosphoric acid gel for 15 seconds. 32% phosphoric acid gel for 15 seconds, or with 35% phosphoric acid gel for 15 seconds. A control group not treated with acid gel was also prepared. The cavities were rinsed, dried and then treated with the HEMA-containing All-Bond 2 primer & bonding resin which was light-cured for 10 seconds. The cavities were then restored with Z100 composite resin(shade:A3.5:3M Dent. Prod. USA) & light cured for 30 seconds. Water samples were retrieved from the chambers over a time course (4.32, 14.4, 43.2, 144 & 432 minutes ; 1, 3 & 10 days) and analyzed by high performance liquid chromatography. The results were as follows. 1. HEMA was detected in the pulp chambers of all teeth from 4.32 minutes after resin placement The highest rate of release was in the first sample period (0-4.32 min) & rate of release declined exponentially thereafter. 2. No significant differences were found for mean release rate for HEMA over a time course among the four groups (p>0.05). 3. The diffusion rate was significantly (p<0.05) less for 10% phosphoric acid gel than 32% phosphoric acid gel at the second sample period(4.32-14.4 min). 4. No significant differences were found for cumulative HEMA diffusion among the four groups at 10 days(p>0.05) and mean total(cumulative) release at 10 days for all groups was in the 9 - 16 nmol range. 5. The cumulative release was significantly (p<0.05) less for 10% phosphoric acid gel than 32% phophoric acid gel at the third(14.4-43.2 min) & fourth(43.2-144 min) sample period.

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Fabrication of 6-superconducting layered HTS wire for high engineering critical current density

  • Kim, Gwantae;Ha, Hongsoo;Kim, Hosup;Oh, Sangsoo;Lee, Jaehun;Moon, Seunghyun
    • Progress in Superconductivity and Cryogenics
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    • v.23 no.4
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    • pp.10-13
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    • 2021
  • Recently, cable conductors composed of numerous coated conductors have been developed to transport huge current for large-scale applications, for example accelerators and fusion reactors. Various cable conductors such as CORC (Conductor on round core), Roebel Cable, and TSTC (Twisted stacked tape cable) have been designed and tested to apply for large-scale applications. But, these cable conductors cannot improve the engineering critical current density (Je) because they are made by simple stacking of coated conductors. In this study, multi-HTS (High temperature superconductor) layers on one substrate (MHOS) wire was fabricated to increase the engineering critical current density by using the exfoliation of superconducting layer from substrate and silver diffusion bonding method. By the repetition of these processes, the 10 m long 6-layer MHOS conductor was successfully fabricated without any intermediate layers like buffer or solder. 6-layer MHOS conductor exhibited a high critical current of 2,460A/12mm-w. and high engineering critical current density of 1,367A/mm2 at liquid nitrogen temperature.