• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.254-254
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• 2011

현재 AMLCD(Active Matrix Liquid Crystal Display)는 노트북, 컴퓨터, TV등 여러 영상매체에 있어 가장 많이 활용되고 있는 디스플레이로 손꼽힌다. AMLCD에 구동소자로 사용되는 a-Si:H TFT는 낮은 제조비용과 축적된 기술을 바탕으로 가장 많이 쓰이고 있다. 특히 a-Si이 가지는 소형화나 대형화의 편의성은 모바일 기기, projection TV, 광고용 패널 등 적용분야가 점점 넓어지고 있는 추세이다. 하지만 a-Si라는 물질 자체가 가지는 낮은 이동도는 더 많은 application을 위해 해결되어야 할 과제이다. 낮은 이동도는 a-Si 실리콘 원자간 결합의 불규칙성 및 무질서와 dangling bond에 의한 localize state(deep trap, band tail)의 존재 때문에 발생하며 결과적으로 TFT 소자의 특성의 저하를 가져온다. 앞선 연구에서는 carrier이동도의 개선을 위해서 첫 번째로 insulator층과 active층 사이의 계면 상태를 향상시키기 위해 insulator로 쓰이는 a-SiN층 표면에 0~18 sccm의 유량으로 phosphorus를 주입하였다. AFM분석을 해본 결과 phosphorus를 주입함으로써 계면의 roughness가 줄어드는 것을 확인 할 수 있었다. 이러한 계면의 roughness 감소는 표면 산란(surface scattering)및 전자 포획(trap)의 영향을 줄임으로써 이동도의 향상을 가져왔다. 두 번째로 active층으로 쓰이는 a-Si:H 층의 표면에 phosphorus를 0?9sccm의 유량으로 doping하였다. 이로 인해 channel이 형성되는 active 영역에 직접적으로 불순물을 doping됨으로써 전도도를 증가되어 이동도를 향상시켰다. 하지만 지나친 doping은 불순물 산란(impurity scattering)의 증가로 인해 이동도를 저하시키는 결과를 보여 주었다. 본 연구에서는 TFT의 이동도 향상을 위해 두 가지의 technology를 함께 적용시켜 a-SiN/a-Si:H 계면 각각에 phosphorus를 주입 및 doping을 하였다. 모든 박막은 PECVD로 제작하였으며 각 박막의 두께는 a-SiN/a-SiN(phosphorus)/a-Si:H(doped)/a-Si:H/n+ a-Si($2350{\AA}/150{\AA}/150{\AA}/1850{\AA}/150{\AA}$)으로 고정하고 유량을 변화시키면서 특성을 관찰하였다.

• Korean Journal of Materials Research
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• v.5 no.8
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• pp.929-935
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• 1995

In order to develop COG (Chip On Glass) technology for LCD module interconnecting the driver IC to Al pad electrode on the glass substrate, Anisotropic Conductive Adhesive(ACA) process, the most promising one among COG technologies, was investigated. ACA process was carried out by two steps, dispensing of ACA resin in the bonding area and curing by W radiation. Load on the chip was ranged from 2.0 to 15kg and the chip was heated at about 12$0^{\circ}C$. In resin, the density of conductive particles coated with Au or Ni at the surface were 500, 1000, 2000 and 4000 particles/$\textrm{mm}^2$, and the diameter of particles were 5, 7 and 12${\mu}{\textrm}{m}$. As a result of the experiments, ACA process using ACA particle of diameter and density of 5${\mu}{\textrm}{m}$ and 4000 particles/$\textrm{mm}^2$ respectively shows optimum characteristic with the stabilzed bonding properties and contact resistance.

• Journal of the Institute of Electronics Engineers of Korea SP
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• v.46 no.6
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• pp.123-131
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• 2009

The emerging display technology has been replaced the previous position of the CRT with the LCD. The nature of hold type display such as LCD, however, causes many problems such as motion blur and motion judder. To resolve the problems, we used frame interpolation technique which improves the image quality by inserting new interpolated frames between existing frames. In this paper, we propose a novel frame interpolation technique that uses dominant MV and variance different value in each block. At first, the proposed algorithm performs unidirectional motion estimation using blocking matching algorithm. The new frame is generated by pixel average using compared block variance or by pixel motion compensation using dominant motion vector, whether the motion estimation find the target area or not. Several experiments with the proposed algorithm shows that the proposed algorithm has better image quality than the existing bidirectional frame interpolation algorithm at the rate of about 3dB PSNR and has low complexity comparing to the unidirectional frame interpolation technique.

• Nuclear Engineering and Technology
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• v.5 no.4
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• pp.310-320
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• 1973

The sorption and fixation of cesium in dilute solutions by vermiculite saturated with Na or K were studied in order to investigate any possibibty of its use in radioactive effluent treatment. The cesium sorbed by vermiculite with the increase in pH is attributed to the increase of sorption surface as a result of the dispersion. The increased cesium sorption by Na-vermiculite is due to the different sorption rates by the different exchange sites : external surface and internal surface. It is shown that the larger amount of sorbed cesium was extracted by KCI rather than with any other extractants. It is suggested that the fixation of cesium by vermiculite occurs at the crystal edge where Cs may replace K. Domestic vermiculite is a valuable material for use in the cesium sorption and fixation, and might be useful as a good packing material outside the tank of highly radioactive liquid waste. And from these results one could suggest that the artificial alteration of the biotite to vermiculite might be occurring by treating with NaCl.

• Analytical Science and Technology
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• v.25 no.2
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• pp.127-132
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• 2012

A test tool for self-leveling and flowing characters of coating materials used to semiconductors and electronic parts, especially for protection of LCD and PDP connectors, was designed, and the test tool was evaluated using polymeric siloxane coating materials which have various viscosities. The test results showed that the designed test tool was effective to measure self-leveling and flowing properties of coating materials. Therefore, considering that the viscosity is not directly correlated with self-leveling and flowing properties, we believe that this test tool will be a very useful tool for measurement instead of classical method using viscosities of coating materials. Particularly, the measurement of self-leveling and flowing properties using the test tool would be expected to be used in the area of selecting suitable protective coating materials for LCD (Liquid Crystal Display), PDP (Plasma Display Panel) and semiconductor connection parts.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.105-105
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• 2006

IT 산업 및 반도체 산업이 발전함에 따라 초소형, 고집적화 시스템의 요구에 대응하기 위해서 고해상도 및 고정밀의 패턴 구현에 관한 많은 연구가 진행되고 있다. 이러한 연구는 각종 산업제품의 PCB(Printed Circuit Board) 및 디스플레이 장치인 PDP(Plasma Display Panel), LCD(Liquid Crystal Display) 등에 적용되어 널리 응용되고 있다. 현재 널리 사용되는 인쇄 회로 기판은 마스킹 후 선택적 에칭 방식을 적용하여 금속 배선을 형성하는 방식을 적용하고 있다. 이러한 방식은 설계가 변경될 경우 마스크를 다시 제작해야 하는 번거로움이 있어 설계 변경이 용이하지 않고 더욱 길어진 생산시간의 증가로 인하여 생산성 및 집적도가 떨어지게 된다. 따라서 최근에는 이러한 한계를 극복하기 위한 방안이 여러 가지 측면에서 시도되고 있으며, 그 중에서도 Inkjet Printing 기술에 대한 관심이 증가하고 있다. 본 연구에서는 Inkjet Printing 방식을 적용하여 금속 배선을 형성하고 선폭과 두께의 오차를 줄여 배선의 Tolerance 를 개선할 수 있는 방안을 제안하였다. Inkjet Printing 방식을 이용한 기존의 금속 배선 형성은 고해상도의 DPI(Dot Per Inch)에서 잉크 액적이 뭉치는 Bulge 현상이 발생되어 원하는 형상 및 배선의 폭을 구현하는데 어려움이 있었다. Bulge 현상은 배선의 불균일성을 야기할 뿐만 아니라 근접한 배선의 간섭에도 영향을 미처 금속 배선의 기능을 할 수 없는 단점을 발생시킨다. 따라서 본 연구에서는 이러한 Bulge 현상을 줄이고 배선간의 간섭을 방지하여 원하는 배선을 용이하게 형성할 수 있는 순차적 인쇄 방식을 적용하였다. 본 연구에서는 노즐직경 35um 의 Inkjet Head 와 나노 Ag 입자 잉크를 사용하여 Glass 표면 위에 배선을 형성하고 배선의 폭과 두께를 측정하였다. 또한 순차적 인쇄 방식을 적용하여 700DPI 이상의 고해상도에서 나타날 수 있는 Bulge 현상이 감소하였음을 관찰하였으며 금속 배선의 Tolerance를 10%내외로 유지할 수 있음을 확인하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.263-263
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• 2010

투명도전막(indium tin oxide; ITO)은 투명하면서도 전기 전도도가 높기 때문에, 액정표시소자(LCD; Liquid Crystal Display), 전자발광소자(ELD; Electroluminescent Display) 및 전자 크로믹 소자(Electrochromic Display)를 포함하는 평판형 표시 소자(FPD; Flat Panel Display)와 태양전지 등에 이용되고 있다. 낮은 비저항과 높은 투과율의 ITO 박막은 $300^{\circ}C$ 이상의 고온에서 코팅해야 하는 것으로 알려져 있다. 그러나 최근 플라스틱과 같은 연성 소자가 전자부품에 널리 이용되면서 ITO를 저온에서 증착해야할 필요성이 대두되고 있다. 본 연구에서는 ITO를 플라스틱에 적용하기 위한 저온 코팅 공정 및 시편의 전 후처리공정을 개발하여 박막의 특성을 알아보고자 한다. 실험에 사용된 기판은 고투과율의 고분자(polyethylene terephthalate; PET) 필름이며 $5\;{\times}\;10\;cm^2$의 크기로 절단하여 알코올로 초음파 세척을 실시하였고, 진공 용기에 장입한 후 펄스전원을 이용하여 3분간 in-situ 청정을 실시하였다. ITO 코팅은 마그네트론 스퍼터링을 이용하였으며, 코팅시간, 전처리, 후처리, 기판온도, 산소유량 등 코팅 조건에 따른 박막의 특성을 조사하였다. ITO 박막의 코팅 조건에 따른 박막의 결정구조 분석은 x-선 회절(x-ray diffraction; XRD)을 이용하였고, 박막의 표면형상과 두께 보정 및 단면의 미세조직과 결정 성장 여부 등은 투과전자 현미경(transmission electron microscope; TEM)을 이용하여 분석하였다. 또한 ITO 박막의 면저항과 분광특성은 four-point Probe (CMP-100MP, Advanced Instrument Technology), spectrophotometer (UV-1601, SHIMADZU)를 이용하여 측정하였다. ITO 박막의 광학특성 분석 결과 전광선 투과율은 두께에 따라 변화 하였지만, 색차와 Haze 값은 증착 조건에 따라 큰 차이는 보이지 않았다. 그리고 박막의 결정화에 영향을 주는 가장 중요한 인자는 기판온도이지만, 기판온도를 높이지 못할 경우 비평형 마그네트론(unbalanced-magnetron; UBM)에 의해서 플라즈마 밀도를 높이는 방법으로 유사한 효과를 얻을 수 있음을 확인하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.252.2-252.2
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• 2013

ZnO nanostructures have a lot of interest for decades due to its varied applications such as light-emitting devices, power generators, solar cells, and sensing devices etc. To get the high performance of these devices, the factors of nanostructure geometry, spacing, and alignment are important. So, Patterning of vertically- aligned ZnO nanowires are currently attractive. However, many of ZnO nanowire or nanorod fabrication methods are needs high temperature, such vapor phase transport process, metal-organic chemical vapor deposition (MOCVD), metal-organic vapor phase epitaxy, thermal evaporation, pulse laser deposition and thermal chemical vapor deposition. While hydrothermal process has great advantages-low temperature (less than $100^{\circ}C$), simple steps, short time consuming, without catalyst, and relatively ease to control than as mentioned various methods. In this work, we investigate the dependence of ZnO nanowire alignment and morphology on si substrate using of nanosphere template with various precursor concentration and components via hydrothermal process. The brief experimental scheme is as follow. First synthesized ZnO seed solution was spun coated on to cleaned Si substrate, and then annealed $350^{\circ}C$ for 1h in the furnace. Second, 200nm sized close-packed nanospheres were formed on the seed layer-coated substrate by using of gas-liquid-solid interfacial self-assembly method and drying in vaccum desicator for about a day to enhance the adhesion between seed layer and nanospheres. After that, zinc oxide nanowires were synthesized using a low temperature hydrothermal method based on alkali solution. The specimens were immersed upside down in the autoclave bath to prevent some precipitates which formed and covered on the surface. The hydrothermal conditions such as growth temperature, growth time, solution concentration, and additives are variously performed to optimize the morphologies of nanowire. To characterize the crystal structure of seed layer and nanowires, morphology, and optical properties, X-ray diffraction (XRD), field emission scanning electron microscopy (FE-SEM), Raman spectroscopy, and photoluminescence (PL) studies were investigated.

• Korean Journal of Metals and Materials
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• v.49 no.7
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• pp.570-576
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• 2011

The shape of a dendrite tip has long been approximated by a paraboloid of revolution, but many attempts have been made as well to more accurately match the dendrite tip profile using other mathematical functions: power function, 4th order polynomial, and hyperbolic function. In the present work, dendrite tip shapes were matched by parabolic function. The differences between the dendrite tip shapes of pivalic acid(PVA)-ethanol(Eth) and succinonitrile(SCN)-salol systems, characterized by anisotropic and isotropic solid-liquid interfacial properties, respectively, were quantitatively treated using shape parameters. The PVA-Eth system showed a slightly higher Z/R value than the SCN-salol system, their Z/R values lying in the range 2-4. (Z is the distance from the tip beyond which the parabolic fit starts to deviate from the profile, and R the tip radius.) ${\lambda}_P$ is the distance from the tip beyond which side branching starts to appear, and is larger in the PVA-Eth system than the SCNsalol system. ${\lambda}_P$ is different for both sides of the 2-dimensional dendrite profile. The difference of ${\lambda}_P$ between both sides of the dendrite is larger for PVA-Eth system than for SCN-salol, implying that the dendrite of PVA-Eth is less symmetric than that of SCN-salol.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1261-1262
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• 2008

Laser-based crystallization techniques are ideally-suited for forming high-quality crystalline Si films on active-matrix display backplanes, because the highly-localized energy deposition allows for transformation of the as-deposited a-Si without damaging high-temperature-intolerant glass and plastic substrates. However, certain significant and non-trivial attributes must be satisfied for a particular method and implementation to be considered manufacturing-worthy. The crystallization process step must yield a Si microstructure that permits fabrication of thin-film transistors with sufficient uniformity and performance for the intended application and, the realization and implementation of the method must meet specific requirements of viability, robustness and economy in order to be accepted in mass production environments. In recent years, Low Temperature Polycrystalline Silicon (LTPS) has demonstrated its advantages through successful implementation in the application spaces that include highly-integrated active-matrix liquid-crystal displays (AMLCDs), cost competitive AMLCDs, and most recently, active-matrix organic light-emitting diode displays (AMOLEDs). In the mobile display market segment, LTPS continues to gain market share, as consumers demand mobile devices with higher display performance, longer battery life and reduced form factor. LTPS-based mobile displays have clearly demonstrated significant advantages in this regard. While the benefits of LTPS for mobile phones are well recognized, other mobile electronic applications such as portable multimedia players, tablet computers, ultra-mobile personal computers and notebook computers also stand to benefit from the performance and potential cost advantages offered by LTPS. Recently, significant efforts have been made to enable robust and cost-effective LTPS backplane manufacturing for AMOLED displays. The majority of the technical focus has been placed on ensuring the formation of extremely uniform poly-Si films. Although current commercially available AMOLED displays are aimed primarily at mobile applications, it is expected that continued development of the technology will soon lead to larger display sizes. Since LTPS backplanes are essentially required for AMOLED displays, LTPS manufacturing technology must be ready to scale the high degree of uniformity beyond the small and medium displays sizes. It is imperative for the manufacturers of LTPS crystallization equipment to ensure that the widespread adoption of the technology is not hindered by limitations of performance, uniformity or display size. In our presentation, we plan to present the state of the art in light sources and beam delivery systems used in high-volume manufacturing laser crystallization equipment. We will show that excimer-laser-based crystallization technologies are currently meeting the stringent requirements of AMOLED display fabrication, and are well positioned to meet the future demands for manufacturing these displays as well.