• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.12
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• pp.9-15
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• 1994

In this paper, the linearized power amplifier using digital adaptive predistorter is implemented in order to restrict spectral spreading and adjacent channel interference. The linearized systems is composed of a DSP56001 processor that executes predistortion in baseband. 90.deg. phase shifter, power splitter/combiner, quadrature modulator/demodulator of 360MHz band, and nonlinear amplifier. A ${\pi}$/4-shift QPSK is used to modulate digital random signals. As the quantized power of baseband signal and the output of amplifier are fed to the predistorter, and predistorting values are calculated using an adaptive algorithm. In the experiment, a peak to sidelobe ratio of the linearized amplifier is improved up to 15dB in comparison with conventional nonlinear amplifier, which means that the distortion of transmitted signal is decreased and adjacent channel interference was reduced.

• 한국ITS학회:학술대회논문집
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• v.2007 no.10
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• pp.131-135
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• 2007

• Journal of Satellite, Information and Communications
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• v.3 no.1
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• pp.1-7
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• 2008

This Paper studied the design and measured results of a flight model for Ku-Band Linearized Channel Amplifier (LCAMP) for communication satellite onboard system. All MMICs, i.e. Variable Gain Amplifier (VGA), Variable Voltage Attenuator (VVA) with analog/digital attenuator, Branch line Hybrid Coupler and Detector for Pre-distorter are fabricated using Thin-Film Hybrid process. The performance of the fabricated module is verified through Radio Frequency circuit simulations and electrical function test in space environment for flight model at 12.25 to 12.75 GHz.

• The Journal of The Korea Institute of Intelligent Transport Systems
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• v.8 no.3
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• pp.83-90
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• 2009

This paper presents the design and measurement of a flight model for a Ku-Band Linearized Channel Amplifier. All MMICs, Variable Gain Amplifier (VGA), Variable Voltage Attenuator ('.IVA), Branch line Coupler and Detector for Pre-distorter are fabricated using a Thin-Film Hybrid process. The performance of the fabricated module is verified through the radio frequency circuit simulation tool and electrical function test in space environment.