• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2007.11a
• /
• pp.157-158
• /
• 2007

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2009.10a
• /
• pp.33-34
• /
• 2009

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
• /
• v.29 no.2
• /
• pp.111-118
• /
• 2023

In this study, the feasibility of laser patterning on the surface of food packaging polymer film was confirmed, and the surface patterning process conditions of femtosecond laser were established. In addition, it was proved that the surface properties of the film can be changed and controlled through the fabrication of various patterned films on the surface of food packaging films such as HDPE, PP, and PET. Various patterned surfaces, including large-scale circular patterns induced by a single femtosecond laser pulse, roughness patterns achieved by overlapping single pulses by 30%, straight line patterns, roughness patterns obtained by overlapping straight line patterns, and grid patterns formed by intersecting straight line patterns were fabricated. The characteristics of the patterned HDPE, PP, and PET films, based on the surface pattern structure and size, were analyzed using SEM, AFM, and contact angle measurements. Compared to the surface of each control film without femtosecond laser patterning, the contact angles of the surfaces of large-area circular patterning HDPE and PP films, large-area roughness patterning HDPE and PP films by overlapping 30% of single pulses, and large-area roughness patterning PET film by overlapping rectilinear patterning were in the range of 27.1-37.5 degree. This indicated that the HDPE, PP, and PET films became more hydrophilic after patterning. On the other hand, the HDPE film patterned with a large-scale grid pattern exhibited a contact angle of 120.4 degree, indicating that the HDPE film became more hydrophobic after patterning. Therefore, films that have been changed to hydrophilic surfaces through patterning can be used in anti-fouling applications where proteins, cells, viruses, and other food materials do not adhere or are easily detached. In addition, if a superhydrophobic surface of 150 degrees or more is fabricated through more precise lattice patterning in the future, it will be possible to use it for superhydrophobic surface applications such as self-cleaning.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.29 no.9
• /
• pp.571-575
• /
• 2016

Recently, there has been much focus on the controlled alignment and patterning process of nanowires for nanoelectronic devices. A simple and effective method for patterning of highly aligned nanowires using a microcontact printing technique is demonstrated. In this method, nanowires are first directionally aligned by contact printing, following which line and space micropatterns of nanowire arrays are accomplished by microcontact printing with a micro patterned NOA mold.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2001.10a
• /
• pp.186-189
• /
• 2001

The main method in micro-etching process, used in manufacturing semiconductors, electronic components, circuits, is Photo Masking method that exposes and develops on the photo-sensitivity solutions or films. This method enables one to process highly precisely, $\pm$0.03 mm in end line location area. But this has limits in a high speed / wide width process, difficulties in endless masking, and the problem of high price. We have developed the direct masking method to make use of Gravure printing, widely used in grocery packing sheet printing. We made cylinder tools to influence the masking quality by laser stream process. We have confirmed that the end line location accuracy in the line width of the product is improved from 0.12 mm to $\pm$0.07 mm level, after etching process.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.10a
• /
• pp.689-693
• /
• 2005

Inkjet printing is a non-contact and direct writing associated with a computer. In the industrial field, there have been many efforts to utilize the inkjet printing as a new way of manufacturing, especially for electronic devices. For the application of inkjet printing to electronic field, one of the key factors is exact realization of designed images into printed patterns. In this work, micro patterning for conducting line has been studied using the piezoelectric print head and silver nano ink. Dimensions of printed images have been predicted in terms of print resolution and diameter of a single dot. The predicted and the measured values showed consistent results. Using the results, the design capability for industrial inkjet printing could be achieved.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.13 no.5
• /
• pp.511-515
• /
• 2013

A Monte Carlo (MC) simulation study has been done in order to investigate the effects of line-edge-roughness (LER) induced by either 1P1E (single-patterning and single-etching) or 2P2E (double-patterning and double-etching) on fully-depleted silicon-on-insulator (FDSOI) tri-gate metal-oxide-semiconductor field-effect transistors (MOSFETs). Three parameters for characterizing the LER profile [i.e., root-mean square deviation (${\sigma}$), correlation length (${\zeta}$), and fractal dimension (D)] are extracted from the image-processed scanning electron microscopy (SEM) image for each photolithography method. It is experimentally verified that two parameters (i.e., ${\sigma}$ and D) are almost the same in each case, but the correlation length in the 2P2E case is longer than that in the 1P1E case. The 2P2E-LER-induced $V_TH$ variation in FDSOI tri-gate MOSFETs is smaller than the 1P1E-LER-induced $V_TH$ variation. The total random variation in $V_TH$, however, is very dependent on the other major random variation sources, such as random dopant fluctuation (RDF) and work-function variation (WFV).

• Journal of the Korean Society for Precision Engineering
• /
• v.24 no.5
• /
• pp.89-96
• /
• 2007

Inkjet printing has become one of the most attractive manufacturing techniques in industry. Especially inkjet printing technology will soon be part of the PCB (Printed Circuit Board) fabrication processes. Traditional printing on PCB includes screen printing and photolithography. These technologies involve high costs, time-consuming procedures and several process steps. However, by inkjet technology manufacturing time and production costs can be reduced, and procedures can be more efficient. PCB manufacturers therefore willingly accept this inkjet technology to the PCB industry, and are quickly shifting from conventional to inkjet printing. To produce the printed circuit board by the inkjet technology, it must be harmonized with conductive nano ink, printing process, system, and inkjet printhead. In this study, micro patterning of conductive line has been investigated using the piezoelectric printhead driven by a bipolar voltage signal is used to dispense 20-40 ${\mu}m$ diameter droplets and silver nano ink which consists of 1 to 50 nm silver particles that are homogeneously suspended in an organic carrier. To fabricate a conductive line used in PCB with high precision, a printed line width was calculated and compared with printing results.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.29 no.7
• /
• pp.435-439
• /
• 2016

We developed a Ag nanowire patterning technique using a water-soluble sacrificial layer. To form a water-soluble sacrificial layer, germanium was deposited on the substrate and then water-soluble germanium oxide was simply formed by thermal oxidation of germanium using a conventional furnace. The formation of Ag nanowire patterns with various line and space arrangements was successfully demonstrated using this patterning process. The main advantage of this patterning technique is that it does not use a strong acid etchant, thereby preventing damage to the Ag nanowire during the patterning process.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2011.06a
• /
• pp.169-170
• /
• 2011