• 제목/요약/키워드: Line Scratch

검색결과 61건 처리시간 0.029초

나노스크래치와 HF 식각을 병용한 보로실리케이트 요/철형 구조체 패턴 제작 기술 (Fabrication Technique of Nano/Micro Pattern with Concave and Convex Structures on the Borosilicate Surface by Using Nanoscratch and HF etching)

  • 윤성원;강충길
    • 한국정밀공학회지
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    • 제21권4호
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    • pp.24-31
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    • 2004
  • The objective of this work is to suggest a mastless pattern fabrication technique using the combination of machining by Nanoindenter(equation omitted) XP and HF wet etching. Sample line patterns were machined on a borosilicate surface by constant load scratch (CLS) of the Nanoindenter(equation omitted) XP with a Berkovich diamond tip, and they were etched in HF solution to investigate chemical characteristics of the machined borosilicate surface. All morphological data of scratch traces were scanned using atomic force microscope (AFM).

CMP 공정에서 마이크로 스크래치 감소를 위한 슬러리 필터의 특성 (Characteristics of Slurry Filter for Reduction of CMP Slurry-induced Micro-scratch)

  • 김철복;김상용;서용진
    • 한국전기전자재료학회논문지
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    • 제14권7호
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    • pp.557-561
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    • 2001
  • Chemical mechanical polishing (CMP) process has been widely used to planarize dielectric layers, which can be applied to the integraded circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of in the defect-free inter-level dielectrics (ILD). Especially, defects such as micro-scratch lead to severe circuit failure which affect yield. CMP slurries can contain particles exceeding 1㎛ in size, which could cause micro-scratch on the wafer surface. The large particles in these slurries may be caused by particles agglomeration in slurry supply line. To reduce these defects, slurry filtration method has been recommended in oxide CMP. In this work, we have studied the effects of filtration and the defect trend as a function of polished wafer count using various filters in inter-metal dielectrics(IMD)-CMP process. The filter installation in CMP polisher could reduce defects after IMD-CMP process. As a result of micro-scratch formation, it is shown that slurry filter plays an important role in determining consumable pad lifetime. The filter lifetime is dominated by the defects. We have concluded that slurry filter lifetime is fixed by the degree of generating defects.

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롤투롤 시스템에서의 비 접촉 이송 시스템을 위한 수학적 장력 모델에 관한 연구 (A study on the Mathematical Tension Model for a Non-contact Transfer of a Moving Web in R2R e-Printing Systems)

  • 이창우;김호준;강현규;신기현
    • 제어로봇시스템학회논문지
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    • 제15권9호
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    • pp.894-898
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    • 2009
  • In a post printing section of roll to roll printing systems, scratch problem is the major defects. The functional qualities such as conductivity, mobility could deteriorate because of the scratch defect. In general, the scratch of the printed pattern on the flexible substrate was induced from a contact between rolls and printed pattern in the post printing section. In this paper, for non-contacting transfer of a moving web, a mathematical tension model has been developed considering strain due to air floatation and the proposed mode has been validated by numerical simulation. Additionally, the correlation between floatation height and speed compensation to control the tension and register are investigated. On the basis of the proposed model, a guide line of speed control in R2R printing system is presented to guarantee the non-contact between rolls and R2R printed pattern on the flexible substrate.

AR 모델 기반의 고전영화의 긁힘 손상의 자동 탐지 및 복원 시스템 설계와 구현 (Design and Implementation of AR Model based Automatic Identification and Restoration Scheme for Line Scratches in Old Films)

  • 한녹손;김성환
    • 정보처리학회논문지B
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    • 제17B권1호
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    • pp.47-54
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    • 2010
  • 오래된 영화 필름이나 비디오 테이프 등의 영상물에서 나타나는 대표적인 손상으로는 긁힘과 얼룩무늬 손상이 있으며, 본 논문은 긁힘 손상을 자동 탐지하고, 자기상관 (AR: autoregressive) 이미지 생성모델 (PAST-PRESENT 모델) 기반의 영상 인페인팅 모델을 사용하여 손상을 복원하는 시스템을 설계하고 구현하였다. AR 이미지 모델 생성을 위해, 지역성을 최대화할 수 있도록 인접 화소를 모으는 Sampling Pattern을 사용하였으며, 추출된 화소들을 필터링 (filtering)하는 단계, AR 모델 파라미터 계산 (model fitting)을 위한 Durbin-Levinson 알고리즘, 최종 파라미터를 통한 훼손된 화소의 예측 및 보간 단계로 구성된다. 구현된 시스템은(1) VHS 테이프를 통한 아날로그 영상물의 디지털화, (2) 긁힘 손상의 자동탐지와 자동손상복원, (3) 얼룩무늬의 수동탐지와 자동복원의 3단계 복원절차를 지원하도록 설계하였다. 단계 1과 단계 2는 영상복원 고속화를 위해 TIDSP 보드 (TMS320DM642 EVM)을 이용하여 구현하였으며, 단계 3은 사용자의 수동탐지를위해, PC 를 사용하여 구현하였다. 본 논문에서 제안된 기법을 고전 한국영화 2편 (자유만세와 로보트 태권 V)에 대하여 실험하였으며, 본 논문에서 제안한 자기상관 기반의 복원 시스템은 Bertalmio 인페인팅 기법과 비교하였으며, 주관적 화질 (MOS 테스트) 및 객관적 화질 (PSNR), 특히, 숙련된 복원기술자에 의한 복원과의 차이를 정의하는 복구품질 (RR)에서 향상된 결과를 보임을 확인하였다.

전자내시경을 활용한 공압실린더 튜브 내면의 결함 자동검사시스템 개발 (Development of automatic inspection system of defects on inner surface of pneumatic cylinder-tubes by electronic endoscope)

  • 노태정;구본주
    • 한국산학기술학회논문지
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    • 제15권6호
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    • pp.3376-3382
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    • 2014
  • 전자내시경을 이용하여 양극처리된 알루미늄 실린더튜브 내면의 결함을 자동으로 검사하는 시스템을 개발하였다. 이 시스템은 크게 자동 결함검사 소프트웨어, 전자내시경 및 이송장치 등으로 구성되어 있다. 실험을 통하여 자동 결함검사의 최적검출 조건을 도출하여 실린더튜브 내면의 결함 검사에 적용한 결과 주요 결함 요소인 스크래치, 산화물, 라인, 웰드라인의 인식률을 99%로서 만족하였다. 자동 결함검사 시스템을 생산현장에 적용하면 기존의 육안 검사 시 작업자가 가지는 육체적인 피로도 줄여 작업효율을 증가시키며, 결함검출 자료를 바탕으로 제품의 품질을 향상시킬 수 있다.

Effects of TESTIN Gene Expression on Proliferation and Migration of the 5-8F Nasopharyngeal Carcinoma Cell Line

  • Zhong, Zhun;Zhang, Fei;Yin, Shu-Cheng
    • Asian Pacific Journal of Cancer Prevention
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    • 제16권6호
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    • pp.2555-2559
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    • 2015
  • Purpose: To investigate effects of the TESTIN (TES) gene on proliferation and migration of highly metastatic nasopharyngeal carcinoma cell line 5-8F and the related mechanisms. Materials and Methods: The target gene of human nasopharyngeal carcinoma cell line 5-8F was amplified by PCR and cloned into the empty plasmid pEGFP-N1 to construct a eukaryotic expression vector pEGFP-N1-TES. This was then transfected into 5-8F cells. MTT assays, flow cytometry and scratch wound tests were used to detect the proliferation and migration of transfected 5-8F cells. Results: A cell model with stable and high expression of TES gene was successfully established. MTT assays showed that the OD value of 5-8F/TES cells was markedly lower than that of 5-8F/GFP cells and 5-8F cells (p<0.05). Flow cytometry showed that the apoptosis rate of 5-8F/TES cells was prominently increased compared with 5-8F/GFP cells and 5-8F cells (p<0.05). In vitro scratch wound assays showed that, the width of the wound area of 5-8F/TES cells narrowed slightly, while the width of the wound area of 5-8F/ GFP cells and 5-8F cells narrowed sharply, suggesting that the TES overexpression could inhibit the migration ability. Conclusions: TES gene expression remarkably inhibits the proliferation of human nasopharyngeal carcinoma cell line 5-8F and reduces its migration in vitro. Thus, it may be a potential tumor suppressor gene for nasopharyngeal carcinoma.

스크래치 가공기술 개발에 따른 잉여 진동 성분 분석에 관한 연구 (A Study on the Redundant Vibration Analysis for the Development of Scratch Processing Technology)

  • 전찬대;차진훈;윤신일;한상보
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 춘계학술대회 논문집
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    • pp.1660-1663
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    • 2005
  • Unwanted vibrations are inevitably induced in other directions when pure unidirectional vibration motion is desired for the vertical scratching mechanism. Pure vertical vibration motion of the scratching machine can be obtained by driving identical two motors with symmetrically positioned eccentric unbalance masses. The desired optimal condition for driving pure vertical vibration for the scratching machine is assumed to be the resonance condition in that direction. Imposing the flexibility of the scratching machine in the horizontal direction, we can find out the amount of horizontal vibration component while maintaining the resonance in vertical direction. The desired stiffness in horizontal direction which produces the minimum vibration in horizontal direction are defined which can be used as a guide line to design the supporting structure of the scratching machine.

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Line scan camera를 이용한 검사 시스템에서의 새로운 영상 처리 알고리즘 (Development of improved image processing algorithms for an automated inspection system using line scan cameras)

  • 장동식;이만희;부창완
    • 제어로봇시스템학회논문지
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    • 제3권4호
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    • pp.406-414
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    • 1997
  • A real-time inspection system is developed using line scan cameras. Several improved algorithms are proposed for real-time detection of defects in this automated inspection system. The major improved algorithms include the preprocessing, the threshold decision, and the clustering algorithms. The preprocessing algorithms are for exact binarization and the threshold decision algorithm is for fast detection of defects in 1-D binary images. The clustering algorithm is also developed for fast classifying of the defects. The system is applied to PCBs(Printed Circuit Boards) inspection. The typical defects in PCBs are pits, dent, wrinkle, scratch, and black spots. The results show that most defects are detected and classified successfully.

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AE에 의한 WA계 비트리파이드 및 레지노이드 결합제 연삭숫돌의 결합도 평가 (Evaluation of Grade of WA-Vitrified and Resinoid Bond Grinding Wheels by Acoustic Emission)

  • 정인근;임영호;권동호
    • 한국정밀공학회지
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    • 제12권9호
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    • pp.74-85
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    • 1995
  • The purpose of this paper is to evaluate the grade of WA vitrified and resinoid bond grinding wheels by the sue of AE measuring system. When the manufactured 48 kinds of specimens were scratched by the method of OKOSHI'S grade test, the relationship between the amount of bit scratch depth of grinding wheel specimens and the character- istics of AE signals, and the relationship of AE counts and grade were considered as fololws; (1) The higher the grades are AE cumlulative event counts N and AE event count rate n, the smaller the values tend to be. But A $E_{rms}$is in reverse. (2) In the case of same grade, the smaller the grain size is, the higher the value of AE cumulative event counts N and A $E_{rms}$is results of comparison and observation. The grinding wheel with lower elasticity and with higher percentage of pore detected higher value of AE cumula- tive event counts N than with higher elasticity and lower percentage of pore. But A $E_{rms}$ is in reverse. (3) AE cumulative event counts N and bit scratch depth h have normally one to one correspondence. (4) It can be expected that quantitative evaluations of grade by using AE have been carried out by the wave observation of AE signal in line with the relationship between load speed of bit and AE cumulative event counts N & AE event count rate n.' AE event count rate n.ate n.

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