• Journal of Ginseng Research
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• v.36 no.2
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• pp.198-204
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• 2012

An light-emitting diode (LED)-based light source was used as a monochromatic light source to determine the responses of raw ginseng roots (Panax ginseng Meyer) to specific emission spectra with respect to the production of ginsenosides. The ginsenoside content in the ginseng roots changed in response to the LED light treatments at $25^{\circ}C$ relative to the levels in the control roots that were treated in the dark or at $4^{\circ}C$ for 7 d. Ginseng roots were exposed to LEDs with four different peak emission wavelengths, 380, 450, 470, and 660 nm, in closed compartments. Compared with the control $4^{\circ}C$-treated roots, roots that were treated with 450 and 470 nm light showed a significantly increased production of ginsenosides (p<0.05), with increases of 64.9% and 74.1%, respectively. The contents of the ginsenosides $Rb_2$, Rc, and $Rg_1$ were significantly higher (p<0.05) in the 450 and 470 nm-treated root samples. The ratio of protopanaxadiol ginsenosides ($Rb_1$, $Rb_2$, Rc, and Rd) to protopanaxatriol ginsenosides ($Rb_1$, $Rb_2$, Re, and Rf) was significantly higher (p<0.05) in the 450 and 470 nm-treated root samples than in the control $4^{\circ}C$-treated roots. This is the first report that demonstrates the increase and conversion of ginsenosides in raw ginseng roots in response to exposure to LED light.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.4
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• pp.175-182
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• 2017

In light emitting diode (LED) chip packaging, wire bonding is an important process that connects the LED chip on the lead frame pad with the Au wire and enables electrical operation for the next process. The wire bonding process is divided by two types: thermo compression bonding and ultrasonic bonding. Generally, the wire bonding process consists of three steps: 1st ball bonding that bonds the shape of the ball on the LED chip electrode, looping process that hangs the wire toward another connecting part with a loop shape, and 2nd stitch bonding that forms and bonds to another electrode. This study analyzed the factors affecting the LED die bonding processes to optimize the process capability that bonds a small Zener diode chip on the PLCC (plastic-leaded chip-carrier) LED package frame, and then applied response surface analysis. The design of experiment (DOE) was established considering the five factors, three levels, and four responses by analyzing the factors. As a result, the optimal conditions that meet all the response targets can be derived.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1143-1146
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• 2005

Novel series of electron-transporting hosts, pentavalent aluminum complexes containing 8 hydroxyquinoline ligands and various phenolato ligands were synthesized, and organic light-emitting diodes (OLEDs) were fabricated using these complexes as host materials of phosphorescent emitting device and the fabricated phosphorescent emitting device showed low driving voltage, high efficiency at high current density and good stability under conventional driving condition.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.14 no.6
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• pp.1375-1381
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• 2010

LED(Light Emitting Diode) is an emitting device which energy is same to the bandgap energy of p-type and n-type semiconductor junction. Recently high brightness LED is used in fish-luring light and traffic signal light alternative of normal light bulb, and widely used in the area of display pannel. Moreover nowadays LED has been used as a back light of LCD display. Recently, visible light communication(VLC) using LED, that allow two-way serial data communication between LEDs over a distance of sveral centimeters or meters, has been widely studied in the area of digital information transmission along with illumination and display. In this paper, we present LED communication system and their applications.

• The Journal of the Korea institute of electronic communication sciences
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• v.7 no.6
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• pp.1513-1518
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• 2012

This paper is implemented media transmission system of VLC transmitter and receiver module using LED of White lighting that is based on PC module and to transmission technology for performance analysis. To realize LED visible light communication receiver is used 1~12 LED light-emitting device and transmitter is used a variable sensor. Developed initial distance of the tranceiver is more than 0~1m for LED VLC and the overall system transmission speed is achieved on variable having Visible light media transmission system. Composition to PC module with LED module and infrared sensor for performance analysis, predict and analyze the communication distance, check about the possibility of application methods. Measure each performance when the lens wearing and not wearing in order to increase the overall efficiency of the LED module, can know that increase efficiency of approximately 20%.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2010.05a
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• pp.226-229
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• 2010

LED(Light Emitting Diode) is an emitting device which energy is same to the bandgap of p-type and n-type semiconductor junction. Recently high brightness LED is used in fish-luring light and traffic signal light alternative of normal light bulb, and widely used in the area of display pannel. Moreover nowadays LED has been used as a back light of LCD display. Recently, visible light communication(VLC) using LED, that allow two-way serial data communication between LEDs over a distance of sveral centimeters or meters, has been widely studied in the area of digital information transmission along with illumination and display. In this paper, we present LED communication system and their applications.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.54 no.1
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• pp.8-12
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• 2005

Indium tin oxide(ITO) surface treated by Oxygen plasma has been in situ analyzed using XPS(X-ray Photoelectron Spectroscopy) and EDS(Energy Dispersive Spectroscopy), to investigate the relations between the properties of the ITO surface and the properties of OLED(Organic Light Emitting Diode). We measured electrical resistivity using Four-Point-Probe and calculated sheet resistance, and ITO surface roughness was measured by AFM(Atomic Force Microscope). We fabricated OLED using substrate that was treated optimum ITO surface. The plasma treatment of the ITO surface lowered the operating voltage of the OLED. We have obtained an improvement of luminance and decrease of turn-on voltage.

• Journal of the Korean Chemical Society
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• v.49 no.2
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• pp.201-207
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• 2005

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.632-635
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• 2004

We have studied the effect of $TiO_2$ layer deposited by RF magnetron sputtering which is used as an ultra thin hole-injection buffer layer in organic light-emitting diode (OLED). The $TiO_2$ thin film layer prevents metallic ions from diffusing from the ITO layer to the organic layers and improves the balance of hole and electron injections and the interface characteristics between the electrode and the organic layer. With 2 nm thickness of $TiO_2$, the quantum efficiency was improved by 45 % compared to the device fabricated without the $TiO_2$ layer.

• Korean Journal of Optics and Photonics
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• v.13 no.4
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• pp.324-331
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• 2002

The fundamentals of light-emitting diode lamp design are presented. The shapes of the reflecting cup and lens employed in LED lamps can be flexibly adjusted, over a relatively large range, by using a few parameters. The analysis of the designed lamps by Monte Carlo photon simulation shows that diverse far-field beam patterns required in various application areas can be achieved.