• Title/Summary/Keyword: Light resistance

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Improvement of Fire Resistance and Impact Sound Insulation Performance for Timber Framed Floor by Installation of Isolated Ceiling (분리된 천정의 설치를 통한 목구조 바닥의 내화성능 및 충격음 차단성능 향상)

  • Park, Joo-Saeng;Kim, Se-Jong;Lee, Sang-Joon
    • Journal of the Korea Furniture Society
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    • v.24 no.4
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    • pp.426-432
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    • 2013
  • Fire resistance and impact sound insulation tests were performed for a floor assembly, of which stiffness was reinforced by shortening the span of floor joists by installing glulam beam additionally in the middle or one thirds of the original span, and which an additional ceiling component was installed apart from floor structure. By applying the isolated ceiling, timber framed floor showed 1 hour of fire resistance even in case that dead load was increased by considering cement mortar layer for radiant floor heating. Insulation performance against light and heavy impact sound was improved significantly by applying the sound absorbing layer of big mass and high elasticity in addition to the stiffness improvement and isolated ceiling.

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A Study on the Resistance Welding of Metallic Sandwich Panel : Part 2 - Process Analysis (저항 용접을 이용한 금속 샌드위치 판재 접합에 관한 연구 : Part 2 - 공정해석)

  • Lee Sang-Min;Kim Jin-Beom;Na Suck-Joo
    • Journal of Welding and Joining
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    • v.23 no.6
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    • pp.55-60
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    • 2005
  • In part 1. optimal process parameters such as thickness of stopper and welding time are achieved to produce high strength ISB(Inner Structured and Bonded) panels. Developed process is different from the usual resistance welding process in the number of points welded at a time. In part 2, Numerical modeling for this new process is proposed and the variation of contact area with respect to the gap of electrodes is studied through FE analyses, Besides, it is tried to figure out the welding nugget formation and proper distance between welding points. FE analytic results show that inner structures are melted more than skin plate, and current distribution between points to be welded can be controlled by distance welding points. Comparison of some FE analytic results with corresponding experimental results could confirm the validity of the proposed numerical modeling.

Bond Strength of Light-weight Inorganic Ceramic Board for Fire Resistant Curtain-wall System (커튼월 층간 화재확산방지구조 적용을 위한 경량무기발포 세라믹보드의 부착강도)

  • Shin, Hyeon-Uk;Song, Hun;Chu, Yong-Sik;Lee, Jong-Kyu
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2014.05a
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    • pp.214-215
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    • 2014
  • Technologies on energy saving and materials used in curtain walls have progressed with increase of high-rise and large buildings. This study is explain fire resistance performance of the curtain walls. And focused on bond strength of light-weight inorganic ceramic board in high temperature for fire resistant curtain-wall system. From the result, curtain-wall system high fire resistant using the light-weight inorganic ceramic board.

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Application Properties of Ultra Light Weight Silica Aerogel to Polyurethane Membrane (극초경량 실리카 에어로겔의 폴리우레탄 멤브레인 적용 특성)

  • Min, Munhong;Jeong, Cheonhee;Yoon, Seokhan;Yang, Junghan;Kim, Taekyeong
    • Textile Coloration and Finishing
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    • v.25 no.4
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    • pp.279-286
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    • 2013
  • Application properties of ultra light weight silica aerogel toward polyurethane membranes were investigated. From the results of pre-milling process of the silica aerogel, the solvent for dispersion of the aerogel was determined for methyl ethyl ketone and its content in the solvent was determined by 30%. Using this aerogel dispersion, the polyurethane membranes were prepared according to the mixing amount of silica aerogel and various properties of the membranes were investigated. As results, the optimum mixing amount of silica aerogel inside polyurethane membranes was decided at 11%, because the improvement of light weight property, air permeability, and moisture vapor permeability were improved upto 11% of silica aerogel content, maintaining the water penetration resistance almost unchanged.

An Optical Micro-Magnetic Device: Magnetic-Spatial Light Modulator

  • Park, Jae-Hyuk;Inoue, M.;Cho, Jae-Kyeong;Nishimura, K.;Uchida, H.
    • Journal of Magnetics
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    • v.8 no.1
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    • pp.50-59
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    • 2003
  • Spatial light modulators (SLMs) are centrally important devices in volumetric recording, data Processing, Pattern recognition and other optical systems. Various types of reusable SLMs with two-dimensional pixel arrays have been intensively developed. Of these, magneto-optic spatial light modulators (MOSLMs) have advantages of high switching speed, robustness, nonvolatility, and radioactive resistance. In this article, we review recent development work on MOSLMs, mainly in relation to our own studies.

A Study on the III-nitride Light Emitting Diode with the Chip Integration by Metal Interconnection (금속배선 칩 집적공정을 포함하는 질화물 반도체 LED 광소자 특성 연구)

  • 김근주;양정자
    • Journal of the Semiconductor & Display Technology
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    • v.3 no.3
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    • pp.31-35
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    • 2004
  • A blue light emitting diode with 8 periods InGaN/GaN multi-quantum well structure grown by metal-organic chemical vapor deposition was fabricated with the inclusion of the metal-interconnection process in order to integrate the chips for light lamp. The quantum well structure provides the blue light photoluminescence peaked at 479.2 nm at room temperature. As decreasing the temperature to 20 K, the main peak was shifted to 469.7 nm and a minor peak at 441.9 nm appeared indicating the quantum dot formation in quantum wells. The current-voltage measurement for the fabricated LED chips shows that the metal-interconnection provides good current path with ohmic resistance of 41 $\Omega$.

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Structural Stability Study of C/GFRP Composite material Traffic Light Fixture and Wind Load (인발 성형법을 이용한 C/GFRP 복합소재 신호등 부착대의 구조적 안정성에 관한 연구)

  • Na, Kyoung-Su;Kwac, Lee-Ku
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.20 no.11
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    • pp.9-16
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    • 2021
  • As the climate changes rapidly due to warming, it is becoming very important to ensure the stability of environmental structures. It is necessary to choose a material that withstands repeated external forces (wind loads) and satisfies members and joints that have energy absorbing power. Even if the strength of the traffic light attachment is sufficient, if the rigidity is insufficient, there is a limit to the displacement during strong winds. Excessive deformation may cause damage and fall, resulting in a safety accident. The author intends to study mechanical properties and resistance to external environment as a structural material capable of withstanding wind load (50m/sec) by fabricating a C/GFRP composite traffic light attachment using the pultrusion method (Pultrusion).

Effect of Light Conditions on Photoinhibition of Ginseng and Tobacco (광조건이 인삼과 잎담배의 광저해에 미치는 영향)

  • ;Il Hou
    • KOREAN JOURNAL OF CROP SCIENCE
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    • v.30 no.2
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    • pp.126-130
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    • 1985
  • Photoinhibition studies were conducted with ginseng (Panax ginseng) grown under shade and tobacco (N. tobaccum cv. Bulgaria) grown under full sunlight. The plants were exposed to light intensity of 580, 1280, 1770, 2580 ${\mu}$E/㎡/sec in normal air for 3.6 9 hours. Light saturation of ginseng was observed at 550 ${\mu}$E/㎡/sec and that of tobacco was at 1600 ${\mu}$E/㎡/sec. Tobacco exposed to high light intensity and long duration of light irradiation didn't show entire reduction in photosynthetic capacity. But in ginseng, 20.3% of photosynthesis was reduced in light intensity of 2,580 ${\mu}$E/㎡/sec during 9 hours. Light response in photosynthesis differed considerably between tobacco and ginseng, and ginseng exposed to high light intensity showed remarkable reduction in photosynthesis. The extent of photoinhibition of ginseng was dependent on the length of exposure to the high light intensity. Stomatal resistance of ginseng seemed not to be changed by photoinhibition but mesophyll resistance was increased.

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Effects of Static Contact Angle and Roughness on Rolling Resistance of Droplet (액적의 구름저항에 대한 정접촉각 및 거칠기의 영향)

  • Cho, Won Kyoung;Cho, Sang Uk;Kim, Doo-In;Kim, Dae-Up;Jeong, Myung Yung
    • Journal of the Microelectronics and Packaging Society
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    • v.23 no.1
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    • pp.23-28
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    • 2016
  • In this study, the effects of the contact angle (CA) and contact angle hyteresis (CAH) of planar and nano-patterned surfaces on rolling resistance of water droplet were studied. Based on the investigation on the CAH of water droplet on surfaces with various static wettability, it was found that the rolling resistance coefficient of water droplet is highly influenced by the surface pattern as well as CAH. The observed results suggest that the optimal surface patterns should be designed in order to minimize the rolling resistance of water droplet for the practical applications where superhydrophocitiy is required.

The Research of Solar Cells Applying Ni/Cu/Ag Contact for Low Cost & High Efficiency (태양전지의 저가격.고효율화를 위한 Ni/Cu/Ag 전극에 관한 연구)

  • Cho, Kyeong-Yeon;Lee, Ji-Hun;Lee, Soo-Hong
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.444-445
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    • 2009
  • The metallic contact system of silicon solar cell must have several properties, such as low contact resistance, easy application and good adhesion. Ni is shown to be a suitable barrier to Cu diffusion as well as desirable contact metal to silicon. Nickel monosilicide(NiSi) has been suggested as a suitable silicide due to its lower resistivity, lower sintering temperature and lower layer stress than $TiSi_2$. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposit the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 16.446 % on $0.2\sim0.6\;{\Omega}{\cdot}cm$, $20\;\times\;20\;mm^2$, CZ(Czochralski) wafer.

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