• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.544-547
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• 2004

Glass frits for dielectric layers are mostly used for screen printing process. Several additives have already been known to be well matched with lead-oxide glasses system. The use of lead oxide, however, creates environmental problems, so many recent studies on lead-free glasses compositions have been carried out. A study of the suitability between additives and lead-free glass system is needed. In this study, we have used a screen-printing method to make thick films of lead-oxide glass and lead-free glass using different additives, and analyzed and compared the transmittance of the thick films.

• Proceedings of the KWS Conference
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• 2003.11a
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• pp.86-88
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• 2003

The characteristic of induction heating solder bump(solder ball: Sn-37Pb, Sn-3.5Ag, Sn-3.0Ag-0.5Cu) has analyzed in this paper. The initial condition of induction heating depends on the time and current. The shape of lead-free solder bump is better than lead solder. The shear strength of lead solder bump has decreased with aging time. The average of shear strength of solder bump is about 10N, 11N, and 11N respectively. The lead-free solder bump's shear strength is better than lead solder and varies irregularly with aging time.

• Journal of Sensor Science and Technology
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• v.24 no.4
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• pp.228-231
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• 2015

Ultrasonic motors provide high torques and quick responses compared to their magnetic counterparts; therefore, they are widely used in small-scale applications such as mobile phones, microrobots, and auto-focusing modules in digital cameras. To determine the feasibility of lead-free piezoceramics for ultrasonic motor applications, we fabricated a ring-type piezoceramic with a KNN-based lead-free piezoceramic (referred to as CZ5), intended for use in an auto-focusing module of a digital camera. The vibration of the lead-free stator was observed at 45.1 kHz. It is noteworthy that the fully assembled lead-free ultrasonic motor exhibited a revolution speed of 5-7 rpm, even though impedance matching with neighboring components was not considered. This result suggests that the tested KNN-based piezoceramic has great potential for use in ultrasonic motor applications, requiring minimal modifications to existing lead-based systems.

• Journal of Ceramic Processing Research
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• v.13 no.spc2
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• pp.282-285
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• 2012

Lead-free (Bi0.5Na0.41K0.09)TiO3 (BNKT) multilayer ceramic actuators were prepared using tape-casting and screen-printing techniques. Co-firing behavior of BNKT/AgPd laminates was examined as a function of sintering temperature. It was found that co-firing induced bending and electrical properties were very sensitive to sintering condition. By optimizing sintering conditions, lead-free electrostrictive multilayer actuators with normalized strain Smax/Emax of 266 pm/V have been successfully fabricated, which is promising for lead-free actuator applications.

• Proceedings of the KWS Conference
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• 2003.11a
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• pp.72-73
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• 2003

• Proceedings of the KWS Conference
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• 2002.05a
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• pp.276-277
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• 2002

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2001.11a
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• pp.46-47
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• 2001

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.280-280
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• 2007

Lead oxide-based ferroelectrics are the most widely used materials for piezoelectric actuators, sensors and transducers due to their excellent piezoelectric properties. Considering lead toxicity, there is great interest in developing lead-free piezoelectric materials, which are biocompatible and environmentally friendlier. Recently alkali oxide materials, including sodium - potassium niobate (NKN), have been given attention in view of their ultrasonic application and also as promising candidates for piezoelectric lead-free system. However, it is difficult to sinter such NKN-based materials via conventional sintering process. In this reason, many researchers have investigated hot press, hot isostatic press or spark-plasma sintering of NKN-based ceramics. In this study, as candidates for lead-free piezoelectric materials, dense (Na,K,Li)(Nb,Sb)$O_3$ systems were developed by conventional sintering process. The microstructures and piezoelectric properties of the (Na,K,Li)(Nb,Sb)$O_3$ systems were investigated as a function of variable compositions. The excellent piezoelectric and electromechanical properties indicate that this system is potentially good candidate as lead-free material for a wide range of electro-mechanical transducer applications.

• Journal of Welding and Joining
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• v.15 no.2
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• pp.36-42
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• 1997

In this paper, stability of initial strength at solder joint with lead free solders, such as Sn-In (52-48%) and Sn-Ag (96.5-3.5wt%) was studied. To obtain at solder joint with high quality, it is very important to control the temperature at the interface of solder joints. It is found that the thermal EMF (electro motive force) occurs betwee lead frame and copper pad on a substrate during reflow soldering process using heated tip. As a result of control the temperature at interface of solder joints, variation of initial strength at solder joint decreases from about $\pm40%$ to $\pm20%$, and it is realized Pb free soldering process using Sn/In and Sn-Ag solder paste.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.22-30
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• 2013

Due to ELV banning, automotive electronics cannot use four kinds of heavy metal element (Pb, Hg, Cd, $Cr^{6+}$) from 2016. Therefore, this study was focused on degradation characteristics of Sn-3.0Ag-0.5Cu Lead-free solder joint with OSP and ENIG finsh under various reliability assessment method, as like to thermal shock test and high temeprature/high humidity test with test duration for cabin electronics. Also, we compared bonding strength degradation to other advanced research results of electronic control unit for engine room because of difference service temperature with mount location in automotive. Whisker growth phenomenon and mitigation method which were essentially consideration items for Pb-free car electronics were examined. Conformal coating is a strong candidate for mitigating whisker growth in automotive electronics. Necessary condition to adapt Pb-free in car electronics was shown.